Oxidation Behavior of Copper at a Temperature below 300 °C and the Methodology for Passivation

• Autor(a) principal: Lee,Shao-Kuan
• Data de Publicação: 2016
• Outros Autores: Hsu,Hsiu-Ching, Tuan,Wei-Hsing
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Materials research (São Carlos. Online)
• Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392016000100051
• topic: Copper; Passivation; Oxidation; Oxidation kinetics

In this study, we investigate the oxidation behavior of copper at temperatures below 300 °C and its mechanism. A methodology to slow down the oxidation rate is then proposed based on the observed mechanism. The oxides formed after oxidation at low temperatures have fine crystal sizes; the rate constants reach 2×10-15 m2/s and 6×10-14 m2/s at 200 °C and 300 °C, respectively. A passivation treatment at 600 °C in nitrogen produces a thin oxide layer composed of relatively large Cu2O crystals. The presence of such a layer slows down the oxidation rate constants by an order of magnitude. This study demonstrates that the oxidation of copper at low temperatures is controlled by the grain boundary diffusion. Increasing the crystal size in the surface oxide reduces the oxidation rate significantly.