Transfer methods for arrays of nanostructures

• Autor(a) principal: Fernandes, Daniel Filipe Félix
• Data de Publicação: 2017
• Tipo de documento: Dissertação
• Idioma: eng
• Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
• Texto Completo: http://hdl.handle.net/10362/31876
• topic: Transfer; Nanowires; Cost-effective; Scalability; Reproducibility; Domínio/Área Científica::Engenharia e Tecnologia::Engenharia dos Materiais

Nowadays, semiconductor and metallic nanostructure compounds can be synthesized through a wide variety of techniques. However, their implementation in devices typically requires the use of transfer methods, in order to take nanostructures into specific substrates’ areas. The application of these methods remains challenging as they cannot fulfill several attributes namely low cost, suitability for a large variety of nanostructures and compatibility with large area and/or thermal-sensitive substrates. This work focuses on the study of two transfer techniques aiming to surpass these limitations, NanoCombing Assembly (NCA) and Rubbing, showing their applicability to deposit on low-cost substrates, aligned and random nanostructure arrays, respectively. Despite being difficult to transfer aligned nanowire arrays with NCA, Rubbing shows good results when depositing random networks, allied with process straightforwardness, low cost and high substrate compatibility compared to other methods. Polydimethylsiloxane (PDMS) is used as a nanostructure transport layer and transfer tests proved to be efficient on flat and patterned substrates. However, the low nanostructure adhesion to substrate’s surfaces limited the electrical characterization of transferred patterns. Nevertheless, Rubbing shows great promise for cost-effective and simple transferring of micro/nanopatterns into large area substrates, if further optimization of the nanostructure/substrate interface is realized.