Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy
Autor(a) principal: | |
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Data de Publicação: | 2016 |
Outros Autores: | , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UFRN |
Texto Completo: | https://repositorio.ufrn.br/handle/123456789/31885 |
Resumo: | In the present study a hypoeutectic Bi-1.5wt%Ag alloy was directionally solidified under transient heat flow conditions and the microstructure was analysed. Bi-Ag alloys are considered as potential alternatives to replace Pb-based alloys as solder materials for metallic connections under high temperatures. However, a lack of understanding regarding the effects of solidification thermal parameters (growth rate - VL, the cooling rate - dot T) on microstructural aspects is reported in literature. Another challenge is to improve properties and reliability. The results of the present study include the determination of the tip growth rate and the cooling rate by cooling curves recorded by thermocouples positioned along the casting length, metallography, X-ray fluorescence (XRF) and Vickers hardness. The entire directionally solidified Bi-1.5Ag microstructure was arranged by faceted Bi-rich dendrites surrounded by a eutectic mixture (Bi+Ag). The primary and secondary dendrite arm spacing (λ1 and λ2), the interphase spacing (λ) and the diameter of Ag-rich particles were also measured along the casting length; and experimental growth laws. Relating these microstructural features to the experimental thermal parameters are proposed |
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Spinelli, José EduardoMacedo, R. A.Silva, Bismarck LuizGarcia, A.2021-03-15T20:47:50Z2021-03-15T20:47:50Z2016SPINELLI, J e; A MACEDO, R; SILVA, B L; A GARCIA,. Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy. Iop Conference Series: Materials Science and Engineering, [S.L.], v. 117, p. 012028-012028, mar. 2016. Disponível em: https://iopscience.iop.org/article/10.1088/1757-899X/117/1/012028. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1088/1757-899x/117/1/0120281757-89811757-899Xhttps://repositorio.ufrn.br/handle/123456789/3188510.1088/1757-899x/117/1/012028IOP PublishingAttribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/info:eu-repo/semantics/openAccessHypoeutectic Bi-1.5wt%AgPb-basedCorrelation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloyinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleIn the present study a hypoeutectic Bi-1.5wt%Ag alloy was directionally solidified under transient heat flow conditions and the microstructure was analysed. Bi-Ag alloys are considered as potential alternatives to replace Pb-based alloys as solder materials for metallic connections under high temperatures. However, a lack of understanding regarding the effects of solidification thermal parameters (growth rate - VL, the cooling rate - dot T) on microstructural aspects is reported in literature. Another challenge is to improve properties and reliability. The results of the present study include the determination of the tip growth rate and the cooling rate by cooling curves recorded by thermocouples positioned along the casting length, metallography, X-ray fluorescence (XRF) and Vickers hardness. The entire directionally solidified Bi-1.5Ag microstructure was arranged by faceted Bi-rich dendrites surrounded by a eutectic mixture (Bi+Ag). The primary and secondary dendrite arm spacing (λ1 and λ2), the interphase spacing (λ) and the diameter of Ag-rich particles were also measured along the casting length; and experimental growth laws. Relating these microstructural features to the experimental thermal parameters are proposedengreponame:Repositório Institucional da UFRNinstname:Universidade Federal do Rio Grande do Norte (UFRN)instacron:UFRNORIGINALCorrelationBetween_SILVA_2016.pdfCorrelationBetween_SILVA_2016.pdfapplication/pdf1560022https://repositorio.ufrn.br/bitstream/123456789/31885/1/CorrelationBetween_SILVA_2016.pdfea984ef22be011953d72dd8d794d9b79MD51CC-LICENSElicense_rdflicense_rdfapplication/rdf+xml; charset=utf-8914https://repositorio.ufrn.br/bitstream/123456789/31885/2/license_rdf4d2950bda3d176f570a9f8b328dfbbefMD52LICENSElicense.txtlicense.txttext/plain; charset=utf-81484https://repositorio.ufrn.br/bitstream/123456789/31885/3/license.txte9597aa2854d128fd968be5edc8a28d9MD53TEXTCorrelationBetween_SILVA_2016.pdf.txtCorrelationBetween_SILVA_2016.pdf.txtExtracted texttext/plain20961https://repositorio.ufrn.br/bitstream/123456789/31885/4/CorrelationBetween_SILVA_2016.pdf.txt225048639b601bedf8441b3fa3c4dc52MD54THUMBNAILCorrelationBetween_SILVA_2016.pdf.jpgCorrelationBetween_SILVA_2016.pdf.jpgGenerated Thumbnailimage/jpeg1540https://repositorio.ufrn.br/bitstream/123456789/31885/5/CorrelationBetween_SILVA_2016.pdf.jpgd4e26da7bb42de7e55f24080cb08744dMD55123456789/318852021-03-21 05:47:05.805oai:https://repositorio.ufrn.br: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Repositório de PublicaçõesPUBhttp://repositorio.ufrn.br/oai/opendoar:2021-03-21T08:47:05Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)false |
dc.title.pt_BR.fl_str_mv |
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy |
title |
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy |
spellingShingle |
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy Spinelli, José Eduardo Hypoeutectic Bi-1.5wt%Ag Pb-based |
title_short |
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy |
title_full |
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy |
title_fullStr |
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy |
title_full_unstemmed |
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy |
title_sort |
Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy |
author |
Spinelli, José Eduardo |
author_facet |
Spinelli, José Eduardo Macedo, R. A. Silva, Bismarck Luiz Garcia, A. |
author_role |
author |
author2 |
Macedo, R. A. Silva, Bismarck Luiz Garcia, A. |
author2_role |
author author author |
dc.contributor.author.fl_str_mv |
Spinelli, José Eduardo Macedo, R. A. Silva, Bismarck Luiz Garcia, A. |
dc.subject.por.fl_str_mv |
Hypoeutectic Bi-1.5wt%Ag Pb-based |
topic |
Hypoeutectic Bi-1.5wt%Ag Pb-based |
description |
In the present study a hypoeutectic Bi-1.5wt%Ag alloy was directionally solidified under transient heat flow conditions and the microstructure was analysed. Bi-Ag alloys are considered as potential alternatives to replace Pb-based alloys as solder materials for metallic connections under high temperatures. However, a lack of understanding regarding the effects of solidification thermal parameters (growth rate - VL, the cooling rate - dot T) on microstructural aspects is reported in literature. Another challenge is to improve properties and reliability. The results of the present study include the determination of the tip growth rate and the cooling rate by cooling curves recorded by thermocouples positioned along the casting length, metallography, X-ray fluorescence (XRF) and Vickers hardness. The entire directionally solidified Bi-1.5Ag microstructure was arranged by faceted Bi-rich dendrites surrounded by a eutectic mixture (Bi+Ag). The primary and secondary dendrite arm spacing (λ1 and λ2), the interphase spacing (λ) and the diameter of Ag-rich particles were also measured along the casting length; and experimental growth laws. Relating these microstructural features to the experimental thermal parameters are proposed |
publishDate |
2016 |
dc.date.issued.fl_str_mv |
2016 |
dc.date.accessioned.fl_str_mv |
2021-03-15T20:47:50Z |
dc.date.available.fl_str_mv |
2021-03-15T20:47:50Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.citation.fl_str_mv |
SPINELLI, J e; A MACEDO, R; SILVA, B L; A GARCIA,. Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy. Iop Conference Series: Materials Science and Engineering, [S.L.], v. 117, p. 012028-012028, mar. 2016. Disponível em: https://iopscience.iop.org/article/10.1088/1757-899X/117/1/012028. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1088/1757-899x/117/1/012028 |
dc.identifier.uri.fl_str_mv |
https://repositorio.ufrn.br/handle/123456789/31885 |
dc.identifier.issn.none.fl_str_mv |
1757-8981 1757-899X |
dc.identifier.doi.none.fl_str_mv |
10.1088/1757-899x/117/1/012028 |
identifier_str_mv |
SPINELLI, J e; A MACEDO, R; SILVA, B L; A GARCIA,. Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy. Iop Conference Series: Materials Science and Engineering, [S.L.], v. 117, p. 012028-012028, mar. 2016. Disponível em: https://iopscience.iop.org/article/10.1088/1757-899X/117/1/012028. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1088/1757-899x/117/1/012028 1757-8981 1757-899X 10.1088/1757-899x/117/1/012028 |
url |
https://repositorio.ufrn.br/handle/123456789/31885 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.rights.driver.fl_str_mv |
Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ info:eu-repo/semantics/openAccess |
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Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ |
eu_rights_str_mv |
openAccess |
dc.publisher.none.fl_str_mv |
IOP Publishing |
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IOP Publishing |
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