Design and evaluation of multi-band RF energy harvesting circuits and antennas for WSNs

• Autor(a) principal: Borges, Luís M.
• Data de Publicação: 2014
• Outros Autores: Barroca, Norberto, Saraiva, Henrique M., Tavares, Jorge, Gouveia, Paulo T., Velez, Fernando J., Loss, Caroline, Salvado, Rita, Pinho, Pedro, Gonçalves, Ricardo, Carvalho, Nuno Borges, Chavez-Santiago, Raúl, Balasingham, Ilangko
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
• Texto Completo: http://hdl.handle.net/10400.21/4795
• topic: Conversion efficiency; Energy harvesting; Printed circuit boards; Sensor nodes; Wearable antennas; Design and evaluations; Emerging technologies; Experimental characterization; Fabrication technique; Printed circuit boards; Radio-frequency energy harvesting; RF energy harvesting; Wireless sensor networks

Radio frequency (RF) energy harvesting is an emerging technology that will enable to drive the next generation of wireless sensor networks (WSNs) without the need of using batteries. In this paper, we present RF energy harvesting circuits specifically developed for GSM bands (900/1800) and a wearable dual-band antenna suitable for possible implementation within clothes for body worn applications. Besides, we address the development and experimental characterization of three different prototypes of a five-stage Dickson voltage multiplier (with match impedance circuit) responsible for harvesting the RF energy. Different printed circuit board (PCB) fabrication techniques to produce the prototypes result in different values of conversion efficiency. Therefore, we conclude that if the PCB fabrication is achieved by means of a rigorous control in the photo-positive method and chemical bath procedure applied to the PCB it allows for attaining better values for the conversion efficiency. All three prototypes (1, 2 and 3) can power supply the IRIS sensor node for RF received powers of -4 dBm, -6 dBm and -5 dBm, and conversion efficiencies of 20, 32 and 26%, respectively. © 2014 IEEE.