Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels
Autor(a) principal: | |
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Data de Publicação: | 2018 |
Outros Autores: | , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UFRN |
Texto Completo: | https://repositorio.ufrn.br/handle/123456789/31788 |
Resumo: | The dependences of microstructures on the solidification thermal parameters of Sn–0.5 wt.%Cu, Sn–0.5 wt.%Cu–0.05 wt.%Al, and Sn–0.5 wt.%Cu–0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling rates and thermal gradients associated with the experiments. Various types of growth relations are proposed to represent the microstructural progresses. Al addition does not change either the matrix primary dendritic spacing or the spacing between Cu6Sn5 particles. However, it is shown that the secondary dendrite arm spacing, λ2, is greatly affected, increasing with the increase in the Al content. Both globular-type and fibrous-type morphologies typify the Cu6Sn5 intermetallics located in interdendritic zones |
id |
UFRN_00c609374643929d61b76ad1017c6a14 |
---|---|
oai_identifier_str |
oai:https://repositorio.ufrn.br:123456789/31788 |
network_acronym_str |
UFRN |
network_name_str |
Repositório Institucional da UFRN |
repository_id_str |
|
spelling |
Lima, Thiago SoaresSilva, Bismarck LuizGarcia, AmauriCheung, NoéSpinelli, José Eduardo2021-03-10T14:48:08Z2021-03-10T14:48:08Z2018-06-22LIMA, Thiago Soares; SILVA, Bismarck Luiz; GARCIA, Amauri; CHEUNG, Noé; SPINELLI, José Eduardo. Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels. Proceedings of The Institution of Mechanical Engineers, Part L: Journal of Materials, [S.L.], v. 233, n. 9, p. 1733-1737, 22 jun. 2018. Disponível em: https://journals.sagepub.com/doi/10.1177/1464420718784314. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1177/14644207187843141464-42072041-3076https://repositorio.ufrn.br/handle/123456789/3178810.1177/1464420718784314SAGE PublicationsAttribution-NonCommercial 3.0 Brazilhttp://creativecommons.org/licenses/by-nc/3.0/br/info:eu-repo/semantics/openAccessSn–Cu–Al alloysSoldersSolidificationMicrostructureIntermetallicsEutecticDendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levelsinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleThe dependences of microstructures on the solidification thermal parameters of Sn–0.5 wt.%Cu, Sn–0.5 wt.%Cu–0.05 wt.%Al, and Sn–0.5 wt.%Cu–0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling rates and thermal gradients associated with the experiments. Various types of growth relations are proposed to represent the microstructural progresses. Al addition does not change either the matrix primary dendritic spacing or the spacing between Cu6Sn5 particles. However, it is shown that the secondary dendrite arm spacing, λ2, is greatly affected, increasing with the increase in the Al content. Both globular-type and fibrous-type morphologies typify the Cu6Sn5 intermetallics located in interdendritic zonesengreponame:Repositório Institucional da UFRNinstname:Universidade Federal do Rio Grande do Norte (UFRN)instacron:UFRNORIGINALDendriticAndEutectic_SILVA_2018.pdfDendriticAndEutectic_SILVA_2018.pdfapplication/pdf544562https://repositorio.ufrn.br/bitstream/123456789/31788/1/DendriticAndEutectic_SILVA_2018.pdfee7ab294c6d9051ac7fed0900a358118MD51CC-LICENSElicense_rdflicense_rdfapplication/rdf+xml; charset=utf-8920https://repositorio.ufrn.br/bitstream/123456789/31788/2/license_rdf728dfda2fa81b274c619d08d1dfc1a03MD52LICENSElicense.txtlicense.txttext/plain; charset=utf-81484https://repositorio.ufrn.br/bitstream/123456789/31788/3/license.txte9597aa2854d128fd968be5edc8a28d9MD53TEXTDendriticAndEutectic_SILVA_2018.pdf.txtDendriticAndEutectic_SILVA_2018.pdf.txtExtracted texttext/plain17834https://repositorio.ufrn.br/bitstream/123456789/31788/4/DendriticAndEutectic_SILVA_2018.pdf.txta65dc5b9ecc6e3c5eddc47dcb1fc58fbMD54THUMBNAILDendriticAndEutectic_SILVA_2018.pdf.jpgDendriticAndEutectic_SILVA_2018.pdf.jpgGenerated Thumbnailimage/jpeg1683https://repositorio.ufrn.br/bitstream/123456789/31788/5/DendriticAndEutectic_SILVA_2018.pdf.jpg3084306db1cdfe8f70bc5944594ab1abMD55123456789/317882021-03-14 05:46:03.851oai:https://repositorio.ufrn.br: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Repositório de PublicaçõesPUBhttp://repositorio.ufrn.br/oai/opendoar:2021-03-14T08:46:03Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)false |
dc.title.pt_BR.fl_str_mv |
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels |
title |
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels |
spellingShingle |
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels Lima, Thiago Soares Sn–Cu–Al alloys Solders Solidification Microstructure Intermetallics Eutectic |
title_short |
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels |
title_full |
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels |
title_fullStr |
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels |
title_full_unstemmed |
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels |
title_sort |
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels |
author |
Lima, Thiago Soares |
author_facet |
Lima, Thiago Soares Silva, Bismarck Luiz Garcia, Amauri Cheung, Noé Spinelli, José Eduardo |
author_role |
author |
author2 |
Silva, Bismarck Luiz Garcia, Amauri Cheung, Noé Spinelli, José Eduardo |
author2_role |
author author author author |
dc.contributor.author.fl_str_mv |
Lima, Thiago Soares Silva, Bismarck Luiz Garcia, Amauri Cheung, Noé Spinelli, José Eduardo |
dc.subject.por.fl_str_mv |
Sn–Cu–Al alloys Solders Solidification Microstructure Intermetallics Eutectic |
topic |
Sn–Cu–Al alloys Solders Solidification Microstructure Intermetallics Eutectic |
description |
The dependences of microstructures on the solidification thermal parameters of Sn–0.5 wt.%Cu, Sn–0.5 wt.%Cu–0.05 wt.%Al, and Sn–0.5 wt.%Cu–0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling rates and thermal gradients associated with the experiments. Various types of growth relations are proposed to represent the microstructural progresses. Al addition does not change either the matrix primary dendritic spacing or the spacing between Cu6Sn5 particles. However, it is shown that the secondary dendrite arm spacing, λ2, is greatly affected, increasing with the increase in the Al content. Both globular-type and fibrous-type morphologies typify the Cu6Sn5 intermetallics located in interdendritic zones |
publishDate |
2018 |
dc.date.issued.fl_str_mv |
2018-06-22 |
dc.date.accessioned.fl_str_mv |
2021-03-10T14:48:08Z |
dc.date.available.fl_str_mv |
2021-03-10T14:48:08Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.citation.fl_str_mv |
LIMA, Thiago Soares; SILVA, Bismarck Luiz; GARCIA, Amauri; CHEUNG, Noé; SPINELLI, José Eduardo. Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels. Proceedings of The Institution of Mechanical Engineers, Part L: Journal of Materials, [S.L.], v. 233, n. 9, p. 1733-1737, 22 jun. 2018. Disponível em: https://journals.sagepub.com/doi/10.1177/1464420718784314. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1177/1464420718784314 |
dc.identifier.uri.fl_str_mv |
https://repositorio.ufrn.br/handle/123456789/31788 |
dc.identifier.issn.none.fl_str_mv |
1464-4207 2041-3076 |
dc.identifier.doi.none.fl_str_mv |
10.1177/1464420718784314 |
identifier_str_mv |
LIMA, Thiago Soares; SILVA, Bismarck Luiz; GARCIA, Amauri; CHEUNG, Noé; SPINELLI, José Eduardo. Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels. Proceedings of The Institution of Mechanical Engineers, Part L: Journal of Materials, [S.L.], v. 233, n. 9, p. 1733-1737, 22 jun. 2018. Disponível em: https://journals.sagepub.com/doi/10.1177/1464420718784314. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1177/1464420718784314 1464-4207 2041-3076 10.1177/1464420718784314 |
url |
https://repositorio.ufrn.br/handle/123456789/31788 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.rights.driver.fl_str_mv |
Attribution-NonCommercial 3.0 Brazil http://creativecommons.org/licenses/by-nc/3.0/br/ info:eu-repo/semantics/openAccess |
rights_invalid_str_mv |
Attribution-NonCommercial 3.0 Brazil http://creativecommons.org/licenses/by-nc/3.0/br/ |
eu_rights_str_mv |
openAccess |
dc.publisher.none.fl_str_mv |
SAGE Publications |
publisher.none.fl_str_mv |
SAGE Publications |
dc.source.none.fl_str_mv |
reponame:Repositório Institucional da UFRN instname:Universidade Federal do Rio Grande do Norte (UFRN) instacron:UFRN |
instname_str |
Universidade Federal do Rio Grande do Norte (UFRN) |
instacron_str |
UFRN |
institution |
UFRN |
reponame_str |
Repositório Institucional da UFRN |
collection |
Repositório Institucional da UFRN |
bitstream.url.fl_str_mv |
https://repositorio.ufrn.br/bitstream/123456789/31788/1/DendriticAndEutectic_SILVA_2018.pdf https://repositorio.ufrn.br/bitstream/123456789/31788/2/license_rdf https://repositorio.ufrn.br/bitstream/123456789/31788/3/license.txt https://repositorio.ufrn.br/bitstream/123456789/31788/4/DendriticAndEutectic_SILVA_2018.pdf.txt https://repositorio.ufrn.br/bitstream/123456789/31788/5/DendriticAndEutectic_SILVA_2018.pdf.jpg |
bitstream.checksum.fl_str_mv |
ee7ab294c6d9051ac7fed0900a358118 728dfda2fa81b274c619d08d1dfc1a03 e9597aa2854d128fd968be5edc8a28d9 a65dc5b9ecc6e3c5eddc47dcb1fc58fb 3084306db1cdfe8f70bc5944594ab1ab |
bitstream.checksumAlgorithm.fl_str_mv |
MD5 MD5 MD5 MD5 MD5 |
repository.name.fl_str_mv |
Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN) |
repository.mail.fl_str_mv |
|
_version_ |
1797776997775048704 |