A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Detalhes bibliográficos
Autor(a) principal: Dias, Marcelino
Data de Publicação: 2018
Outros Autores: Costa, Thiago Antônio, Silva, Bismarck Luiz, Spinelli, José Eduardo, Cheunga, Noé, Garcia, Amauri
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Repositório Institucional da UFRN
Texto Completo: https://repositorio.ufrn.br/handle/123456789/32178
Resumo: Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular β-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn-10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettability
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spelling Dias, MarcelinoCosta, Thiago AntônioSilva, Bismarck LuizSpinelli, José EduardoCheunga, NoéGarcia, Amauri2021-04-12T20:47:48Z2021-04-12T20:47:48Z2018-02DIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.0290026-2714https://repositorio.ufrn.br/handle/123456789/3217810.1016/j.microrel.2017.12.029ElsevierAttribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/info:eu-repo/semantics/openAccessSolder alloysSn-Sb alloysMicrostructureTensile propertiesWettabilityA comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloysinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleSn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular β-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn-10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettabilityengreponame:Repositório Institucional da UFRNinstname:Universidade Federal do Rio Grande do Norte (UFRN)instacron:UFRNORIGINALComparativeAnalysisMicrostructural_SILVA_2018.pdfComparativeAnalysisMicrostructural_SILVA_2018.pdfapplication/pdf2052906https://repositorio.ufrn.br/bitstream/123456789/32178/1/ComparativeAnalysisMicrostructural_SILVA_2018.pdfe4ddb588d1ae28613fa8f087caab3937MD51CC-LICENSElicense_rdflicense_rdfapplication/rdf+xml; charset=utf-8914https://repositorio.ufrn.br/bitstream/123456789/32178/2/license_rdf4d2950bda3d176f570a9f8b328dfbbefMD52LICENSElicense.txtlicense.txttext/plain; charset=utf-81484https://repositorio.ufrn.br/bitstream/123456789/32178/3/license.txte9597aa2854d128fd968be5edc8a28d9MD53TEXTComparativeAnalysisMicrostructural_SILVA_2018.pdf.txtComparativeAnalysisMicrostructural_SILVA_2018.pdf.txtExtracted texttext/plain37366https://repositorio.ufrn.br/bitstream/123456789/32178/4/ComparativeAnalysisMicrostructural_SILVA_2018.pdf.txtdcacb2830e93f02cd6fe763c4db68357MD54THUMBNAILComparativeAnalysisMicrostructural_SILVA_2018.pdf.jpgComparativeAnalysisMicrostructural_SILVA_2018.pdf.jpgGenerated Thumbnailimage/jpeg1709https://repositorio.ufrn.br/bitstream/123456789/32178/5/ComparativeAnalysisMicrostructural_SILVA_2018.pdf.jpge6386bd3b273eea51e374dec891cd6d6MD55123456789/321782021-04-18 06:05:42.195oai:https://repositorio.ufrn.br:123456789/32178Tk9OLUVYQ0xVU0lWRSBESVNUUklCVVRJT04gTElDRU5TRQoKCkJ5IHNpZ25pbmcgYW5kIGRlbGl2ZXJpbmcgdGhpcyBsaWNlbnNlLCBNci4gKGF1dGhvciBvciBjb3B5cmlnaHQgaG9sZGVyKToKCgphKSBHcmFudHMgdGhlIFVuaXZlcnNpZGFkZSBGZWRlcmFsIFJpbyBHcmFuZGUgZG8gTm9ydGUgdGhlIG5vbi1leGNsdXNpdmUgcmlnaHQgb2YKcmVwcm9kdWNlLCBjb252ZXJ0IChhcyBkZWZpbmVkIGJlbG93KSwgY29tbXVuaWNhdGUgYW5kIC8gb3IKZGlzdHJpYnV0ZSB0aGUgZGVsaXZlcmVkIGRvY3VtZW50IChpbmNsdWRpbmcgYWJzdHJhY3QgLyBhYnN0cmFjdCkgaW4KZGlnaXRhbCBvciBwcmludGVkIGZvcm1hdCBhbmQgaW4gYW55IG1lZGl1bS4KCmIpIERlY2xhcmVzIHRoYXQgdGhlIGRvY3VtZW50IHN1Ym1pdHRlZCBpcyBpdHMgb3JpZ2luYWwgd29yaywgYW5kIHRoYXQKeW91IGhhdmUgdGhlIHJpZ2h0IHRvIGdyYW50IHRoZSByaWdodHMgY29udGFpbmVkIGluIHRoaXMgbGljZW5zZS4gRGVjbGFyZXMKdGhhdCB0aGUgZGVsaXZlcnkgb2YgdGhlIGRvY3VtZW50IGRvZXMgbm90IGluZnJpbmdlLCBhcyBmYXIgYXMgaXQgaXMKdGhlIHJpZ2h0cyBvZiBhbnkgb3RoZXIgcGVyc29uIG9yIGVudGl0eS4KCmMpIElmIHRoZSBkb2N1bWVudCBkZWxpdmVyZWQgY29udGFpbnMgbWF0ZXJpYWwgd2hpY2ggZG9lcyBub3QKcmlnaHRzLCBkZWNsYXJlcyB0aGF0IGl0IGhhcyBvYnRhaW5lZCBhdXRob3JpemF0aW9uIGZyb20gdGhlIGhvbGRlciBvZiB0aGUKY29weXJpZ2h0IHRvIGdyYW50IHRoZSBVbml2ZXJzaWRhZGUgRmVkZXJhbCBkbyBSaW8gR3JhbmRlIGRvIE5vcnRlIHRoZSByaWdodHMgcmVxdWlyZWQgYnkgdGhpcyBsaWNlbnNlLCBhbmQgdGhhdCB0aGlzIG1hdGVyaWFsIHdob3NlIHJpZ2h0cyBhcmUgb2YKdGhpcmQgcGFydGllcyBpcyBjbGVhcmx5IGlkZW50aWZpZWQgYW5kIHJlY29nbml6ZWQgaW4gdGhlIHRleHQgb3IKY29udGVudCBvZiB0aGUgZG9jdW1lbnQgZGVsaXZlcmVkLgoKSWYgdGhlIGRvY3VtZW50IHN1Ym1pdHRlZCBpcyBiYXNlZCBvbiBmdW5kZWQgb3Igc3VwcG9ydGVkIHdvcmsKYnkgYW5vdGhlciBpbnN0aXR1dGlvbiBvdGhlciB0aGFuIHRoZSBVbml2ZXJzaWRhZGUgRmVkZXJhbCBkbyBSaW8gR3JhbmRlIGRvIE5vcnRlLCBkZWNsYXJlcyB0aGF0IGl0IGhhcyBmdWxmaWxsZWQgYW55IG9ibGlnYXRpb25zIHJlcXVpcmVkIGJ5IHRoZSByZXNwZWN0aXZlIGFncmVlbWVudCBvciBhZ3JlZW1lbnQuCgpUaGUgVW5pdmVyc2lkYWRlIEZlZGVyYWwgZG8gUmlvIEdyYW5kZSBkbyBOb3J0ZSB3aWxsIGNsZWFybHkgaWRlbnRpZnkgaXRzIG5hbWUgKHMpIGFzIHRoZSBhdXRob3IgKHMpIG9yIGhvbGRlciAocykgb2YgdGhlIGRvY3VtZW50J3MgcmlnaHRzCmRlbGl2ZXJlZCwgYW5kIHdpbGwgbm90IG1ha2UgYW55IGNoYW5nZXMsIG90aGVyIHRoYW4gdGhvc2UgcGVybWl0dGVkIGJ5CnRoaXMgbGljZW5zZQo=Repositório de PublicaçõesPUBhttp://repositorio.ufrn.br/oai/opendoar:2021-04-18T09:05:42Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)false
dc.title.pt_BR.fl_str_mv A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
spellingShingle A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
Dias, Marcelino
Solder alloys
Sn-Sb alloys
Microstructure
Tensile properties
Wettability
title_short A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_full A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_fullStr A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_full_unstemmed A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_sort A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
author Dias, Marcelino
author_facet Dias, Marcelino
Costa, Thiago Antônio
Silva, Bismarck Luiz
Spinelli, José Eduardo
Cheunga, Noé
Garcia, Amauri
author_role author
author2 Costa, Thiago Antônio
Silva, Bismarck Luiz
Spinelli, José Eduardo
Cheunga, Noé
Garcia, Amauri
author2_role author
author
author
author
author
dc.contributor.author.fl_str_mv Dias, Marcelino
Costa, Thiago Antônio
Silva, Bismarck Luiz
Spinelli, José Eduardo
Cheunga, Noé
Garcia, Amauri
dc.subject.por.fl_str_mv Solder alloys
Sn-Sb alloys
Microstructure
Tensile properties
Wettability
topic Solder alloys
Sn-Sb alloys
Microstructure
Tensile properties
Wettability
description Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular β-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn-10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettability
publishDate 2018
dc.date.issued.fl_str_mv 2018-02
dc.date.accessioned.fl_str_mv 2021-04-12T20:47:48Z
dc.date.available.fl_str_mv 2021-04-12T20:47:48Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
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status_str publishedVersion
dc.identifier.citation.fl_str_mv DIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.029
dc.identifier.uri.fl_str_mv https://repositorio.ufrn.br/handle/123456789/32178
dc.identifier.issn.none.fl_str_mv 0026-2714
dc.identifier.doi.none.fl_str_mv 10.1016/j.microrel.2017.12.029
identifier_str_mv DIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.029
0026-2714
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