Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples
Autor(a) principal: | |
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Data de Publicação: | 2019 |
Outros Autores: | , , , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UNESP |
Texto Completo: | http://dx.doi.org/10.1007/s11664-019-07454-6 http://hdl.handle.net/11449/187923 |
Resumo: | Directional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder alloy. The association of such findings allowed understanding the mechanisms affecting the heat transfer efficiency between this alloy and substrates of interest. Nickel (Ni) and copper (Cu) were tested since they are considered work piece materials of importance in electronic soldering. Moreover, low carbon steel was tested as a matter of comparison. For each tested case, wetting angles, integrity and nature of the interfaces and transient heat transfer coefficients, ‘h’, were determined. Even though the copper has a thermal conductivity greater than nickel, it is demonstrated that the occurrence of voids at the copper interface during alloy soldering may decrease the heat transfer efficiency, i.e., ‘h’. Oppositely, a more stable and less defective reaction layer was formed for the alloy/nickel couple. This is due to the suppression of the undesirable thermal contraction since the hexagonal Cu6Sn5 intermetallics is stable at temperatures below 186°C in the presence of nickel. |
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Repositório Institucional da UNESP |
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Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couplesheat transferreaction layerSn-Cu alloysolderssolidificationwettabilityDirectional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder alloy. The association of such findings allowed understanding the mechanisms affecting the heat transfer efficiency between this alloy and substrates of interest. Nickel (Ni) and copper (Cu) were tested since they are considered work piece materials of importance in electronic soldering. Moreover, low carbon steel was tested as a matter of comparison. For each tested case, wetting angles, integrity and nature of the interfaces and transient heat transfer coefficients, ‘h’, were determined. Even though the copper has a thermal conductivity greater than nickel, it is demonstrated that the occurrence of voids at the copper interface during alloy soldering may decrease the heat transfer efficiency, i.e., ‘h’. Oppositely, a more stable and less defective reaction layer was formed for the alloy/nickel couple. This is due to the suppression of the undesirable thermal contraction since the hexagonal Cu6Sn5 intermetallics is stable at temperatures below 186°C in the presence of nickel.Department of Manufacturing and Materials Engineering University of Campinas UNICAMPDepartment of Materials Engineering Federal University of Rio Grande do Norte-UFRNCampus of São João da Boa Vista São Paulo State University - UNESPDepartment of Materials Engineering Federal University of São Carlos UFSCarCampus of São João da Boa Vista São Paulo State University - UNESPUniversidade Estadual de Campinas (UNICAMP)Federal University of Rio Grande do Norte-UFRNUniversidade Estadual Paulista (Unesp)Universidade Federal de São Carlos (UFSCar)Soares, ThiagoCruz, ClarissaSilva, BismarckBrito, Crystopher [UNESP]Garcia, AmauriSpinelli, José EduardoCheung, Noé2019-10-06T15:51:28Z2019-10-06T15:51:28Z2019-01-01info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articlehttp://dx.doi.org/10.1007/s11664-019-07454-6Journal of Electronic Materials.0361-5235http://hdl.handle.net/11449/18792310.1007/s11664-019-07454-62-s2.0-85070081003Scopusreponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPengJournal of Electronic Materialsinfo:eu-repo/semantics/openAccess2021-10-22T21:54:29Zoai:repositorio.unesp.br:11449/187923Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462021-10-22T21:54:29Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false |
dc.title.none.fl_str_mv |
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples |
title |
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples |
spellingShingle |
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples Soares, Thiago heat transfer reaction layer Sn-Cu alloy solders solidification wettability |
title_short |
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples |
title_full |
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples |
title_fullStr |
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples |
title_full_unstemmed |
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples |
title_sort |
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples |
author |
Soares, Thiago |
author_facet |
Soares, Thiago Cruz, Clarissa Silva, Bismarck Brito, Crystopher [UNESP] Garcia, Amauri Spinelli, José Eduardo Cheung, Noé |
author_role |
author |
author2 |
Cruz, Clarissa Silva, Bismarck Brito, Crystopher [UNESP] Garcia, Amauri Spinelli, José Eduardo Cheung, Noé |
author2_role |
author author author author author author |
dc.contributor.none.fl_str_mv |
Universidade Estadual de Campinas (UNICAMP) Federal University of Rio Grande do Norte-UFRN Universidade Estadual Paulista (Unesp) Universidade Federal de São Carlos (UFSCar) |
dc.contributor.author.fl_str_mv |
Soares, Thiago Cruz, Clarissa Silva, Bismarck Brito, Crystopher [UNESP] Garcia, Amauri Spinelli, José Eduardo Cheung, Noé |
dc.subject.por.fl_str_mv |
heat transfer reaction layer Sn-Cu alloy solders solidification wettability |
topic |
heat transfer reaction layer Sn-Cu alloy solders solidification wettability |
description |
Directional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder alloy. The association of such findings allowed understanding the mechanisms affecting the heat transfer efficiency between this alloy and substrates of interest. Nickel (Ni) and copper (Cu) were tested since they are considered work piece materials of importance in electronic soldering. Moreover, low carbon steel was tested as a matter of comparison. For each tested case, wetting angles, integrity and nature of the interfaces and transient heat transfer coefficients, ‘h’, were determined. Even though the copper has a thermal conductivity greater than nickel, it is demonstrated that the occurrence of voids at the copper interface during alloy soldering may decrease the heat transfer efficiency, i.e., ‘h’. Oppositely, a more stable and less defective reaction layer was formed for the alloy/nickel couple. This is due to the suppression of the undesirable thermal contraction since the hexagonal Cu6Sn5 intermetallics is stable at temperatures below 186°C in the presence of nickel. |
publishDate |
2019 |
dc.date.none.fl_str_mv |
2019-10-06T15:51:28Z 2019-10-06T15:51:28Z 2019-01-01 |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://dx.doi.org/10.1007/s11664-019-07454-6 Journal of Electronic Materials. 0361-5235 http://hdl.handle.net/11449/187923 10.1007/s11664-019-07454-6 2-s2.0-85070081003 |
url |
http://dx.doi.org/10.1007/s11664-019-07454-6 http://hdl.handle.net/11449/187923 |
identifier_str_mv |
Journal of Electronic Materials. 0361-5235 10.1007/s11664-019-07454-6 2-s2.0-85070081003 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
Journal of Electronic Materials |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.source.none.fl_str_mv |
Scopus reponame:Repositório Institucional da UNESP instname:Universidade Estadual Paulista (UNESP) instacron:UNESP |
instname_str |
Universidade Estadual Paulista (UNESP) |
instacron_str |
UNESP |
institution |
UNESP |
reponame_str |
Repositório Institucional da UNESP |
collection |
Repositório Institucional da UNESP |
repository.name.fl_str_mv |
Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP) |
repository.mail.fl_str_mv |
|
_version_ |
1799965443149004800 |