An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards
Autor(a) principal: | |
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Data de Publicação: | 2017 |
Outros Autores: | |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Latin American journal of solids and structures (Online) |
Texto Completo: | http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1679-78252017001302402 |
Resumo: | Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc.) mounted on Printed Circuit Boards (PCB) is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings. |
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Latin American journal of solids and structures (Online) |
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An Enhanced Random Vibration and Fatigue Model for Printed Circuit BoardsRandom vibrationfatiguePCBAbstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc.) mounted on Printed Circuit Boards (PCB) is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings.Associação Brasileira de Ciências Mecânicas2017-01-01info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersiontext/htmlhttp://old.scielo.br/scielo.php?script=sci_arttext&pid=S1679-78252017001302402Latin American Journal of Solids and Structures v.14 n.13 2017reponame:Latin American journal of solids and structures (Online)instname:Associação Brasileira de Engenharia e Ciências Mecânicas (ABCM)instacron:ABCM10.1590/1679-78253163info:eu-repo/semantics/openAccessBraz,Bruno de CastroBussamra,Flávio Luiz de Silvaeng2018-02-23T00:00:00Zoai:scielo:S1679-78252017001302402Revistahttp://www.scielo.br/scielo.php?script=sci_serial&pid=1679-7825&lng=pt&nrm=isohttps://old.scielo.br/oai/scielo-oai.phpabcm@abcm.org.br||maralves@usp.br1679-78251679-7817opendoar:2018-02-23T00:00Latin American journal of solids and structures (Online) - Associação Brasileira de Engenharia e Ciências Mecânicas (ABCM)false |
dc.title.none.fl_str_mv |
An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards |
title |
An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards |
spellingShingle |
An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards Braz,Bruno de Castro Random vibration fatigue PCB |
title_short |
An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards |
title_full |
An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards |
title_fullStr |
An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards |
title_full_unstemmed |
An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards |
title_sort |
An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards |
author |
Braz,Bruno de Castro |
author_facet |
Braz,Bruno de Castro Bussamra,Flávio Luiz de Silva |
author_role |
author |
author2 |
Bussamra,Flávio Luiz de Silva |
author2_role |
author |
dc.contributor.author.fl_str_mv |
Braz,Bruno de Castro Bussamra,Flávio Luiz de Silva |
dc.subject.por.fl_str_mv |
Random vibration fatigue PCB |
topic |
Random vibration fatigue PCB |
description |
Abstract Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc.) mounted on Printed Circuit Boards (PCB) is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings. |
publishDate |
2017 |
dc.date.none.fl_str_mv |
2017-01-01 |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1679-78252017001302402 |
url |
http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1679-78252017001302402 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
10.1590/1679-78253163 |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
text/html |
dc.publisher.none.fl_str_mv |
Associação Brasileira de Ciências Mecânicas |
publisher.none.fl_str_mv |
Associação Brasileira de Ciências Mecânicas |
dc.source.none.fl_str_mv |
Latin American Journal of Solids and Structures v.14 n.13 2017 reponame:Latin American journal of solids and structures (Online) instname:Associação Brasileira de Engenharia e Ciências Mecânicas (ABCM) instacron:ABCM |
instname_str |
Associação Brasileira de Engenharia e Ciências Mecânicas (ABCM) |
instacron_str |
ABCM |
institution |
ABCM |
reponame_str |
Latin American journal of solids and structures (Online) |
collection |
Latin American journal of solids and structures (Online) |
repository.name.fl_str_mv |
Latin American journal of solids and structures (Online) - Associação Brasileira de Engenharia e Ciências Mecânicas (ABCM) |
repository.mail.fl_str_mv |
abcm@abcm.org.br||maralves@usp.br |
_version_ |
1754302889274114048 |