Conjugate Cooling of a Discrete Heater in Laminar Channel Flow

• Autor(a) principal: Alves,Thiago Antonini
• Data de Publicação: 2011
• Outros Autores: Altemani,Carlos A.C.
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Journal of the Brazilian Society of Mechanical Sciences and Engineering (Online)
• Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1678-58782011000300003
• topic: conjugate heat transfer; adiabatic heat transfer coefficient; laminar channel flow; numerical analysis

Electronic components are usually assembled on printed circuit boards cooled by forced airflow. When the spacing between the boards is small, there is no room to employ a heat sink on critical components. Under these conditions, the components’ thermal control may depend on the conductive path from the heater to the board in addition to the direct convective heat transfer to the airflow.The conjugate forced convection-conduction heat transfer from a two-dimensional strip heater flush mounted to a finite thickness wall of a parallel plates channel cooled by a laminar airflow was investigated numerically. A uniform heat flux was generated along the strip heater surface. Under steady state conditions, a fraction of the heat generation was transferred by direct convection to the airflow in the channel and the remaining fraction was transferred by conduction to the channel wall. The lower surface of the channel wall was adiabatic, so that the heat conducted from the heater to the plate eventually returned to the airflow. A portion of it returned upstream of the heater, preheating the airflow before it reached the heater surface. Due to this, it was convenient to treat the direct convection from the heater surface to the airflow by the adiabatic heat transfer coefficient. The flow was developed from the channel entrance, with constant properties.The conjugate problem was solved numerically within a single solution domain comprising both the airflow region and the solid wall of the channel. The results were obtained for the channel flow Reynolds number ranging from about 600 to 1900, corresponding to average airflow velocities from 0.5 m/s to 1.5 m/s. The effects of the solid wall to air thermal conductivities ratio were investigated in the range from 10 to 80, typical of circuit board materials. The wall thickness influence was verified from 1 mm to 5 mm. The results indicated that within these ranges, the conductive substrate wall provided a substantial enhancement of the heat transfer from the heater, accomplished by an increase of its average adiabatic surface temperature.