The influence of die geometry on stress distribution by experimental and FEM simulation on electrolytic copper wiredrawing

• Autor(a) principal: Kabayama,Leonardo Kyo
• Data de Publicação: 2009
• Outros Autores: Taguchi,Simone Pereira, Martínez,Gustavo Aristides Santana
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Materials research (São Carlos. Online)
• Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392009000300006
• topic: tribology; finite element method; wiredrawing; die geometry

The study of die geometry is vital in determining the surface and mechanical properties of drawn wires, and consequently, their application. In this work, annealed electrolytic copper wire (ETP), with 0.5 mm original diameter was reduced by 19% in dies with 2β = 10º and 18º and Hc = 35 and 50%. The best experimental results were then studied by the Finite Element Method to simulate residual stress distribution. The experimental results show that the friction coefficient decreases as the wire drawing speed increases, and that low 2β and Hc values bring about the most favorable wiredrawing conditions. The simulation shows a variation in the axial and radial tensions, both for the compression and traction stresses on all regions during the wire drawing process. In conclusion, the influence of the internal die geometry on the drawn wire is clarified.