Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing
Autor(a) principal: | |
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Data de Publicação: | 2020 |
Outros Autores: | , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Materials research (São Carlos. Online) |
Texto Completo: | http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000500215 |
Resumo: | Abstract The aim of this study was to clarify the influence of inter-metallic compounds (IMCs) on the electrical conductivity of Cu/Al joint. The longitudinal resistance and the lateral current distribution at flash welded and diffusion brazed Cu/Al joint interfaces were investigated using four-point method and conductive atomic force microscopy, respectively. A 2μm Cu9Al4/CuAl2 layer was formed in both joints. The IMCs layer was homogenous and the current distribution interface was planar at diffusion brazed joint. However, the IMCs layer was discontinuous and the current distribution interface was non-planar at flash welded joint. After heat treatment at 350°C for 500h, the thickness of interfacial layer was increased to 50μm. CuAl and a short crack were newly formed in the diffusion brazed joint. CuAl, (Cu,Al)xOy and a long crack were newly formed in the flash welded joint. A multilayer current distribution was found at both heat treated joints. The resistivity of all Cu/Al joints was higher than that of copper and lower than that of aluminum. The resistivity of diffusion brazed joint was the lowest, which was lower than the theoretical value. The resistivity of the heat treated flash welded joint was the highest among all the joints. |
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Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazingcopperaluminuminter-metallic compoundselectrical resistivityconductive atom force microscopyAbstract The aim of this study was to clarify the influence of inter-metallic compounds (IMCs) on the electrical conductivity of Cu/Al joint. The longitudinal resistance and the lateral current distribution at flash welded and diffusion brazed Cu/Al joint interfaces were investigated using four-point method and conductive atomic force microscopy, respectively. A 2μm Cu9Al4/CuAl2 layer was formed in both joints. The IMCs layer was homogenous and the current distribution interface was planar at diffusion brazed joint. However, the IMCs layer was discontinuous and the current distribution interface was non-planar at flash welded joint. After heat treatment at 350°C for 500h, the thickness of interfacial layer was increased to 50μm. CuAl and a short crack were newly formed in the diffusion brazed joint. CuAl, (Cu,Al)xOy and a long crack were newly formed in the flash welded joint. A multilayer current distribution was found at both heat treated joints. The resistivity of all Cu/Al joints was higher than that of copper and lower than that of aluminum. The resistivity of diffusion brazed joint was the lowest, which was lower than the theoretical value. The resistivity of the heat treated flash welded joint was the highest among all the joints.ABM, ABC, ABPol2020-01-01info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersiontext/htmlhttp://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000500215Materials Research v.23 n.5 2020reponame:Materials research (São Carlos. Online)instname:Universidade Federal de São Carlos (UFSCAR)instacron:ABM ABC ABPOL10.1590/1980-5373-mr-2020-0325info:eu-repo/semantics/openAccessWang,Xue-GangDongYuan,XingLi,Jia-NingLi,Xin-Gengeng2020-11-18T00:00:00Zoai:scielo:S1516-14392020000500215Revistahttp://www.scielo.br/mrPUBhttps://old.scielo.br/oai/scielo-oai.phpdedz@power.ufscar.br1980-53731516-1439opendoar:2020-11-18T00:00Materials research (São Carlos. Online) - Universidade Federal de São Carlos (UFSCAR)false |
dc.title.none.fl_str_mv |
Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing |
title |
Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing |
spellingShingle |
Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing Wang,Xue-Gang copper aluminum inter-metallic compounds electrical resistivity conductive atom force microscopy |
title_short |
Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing |
title_full |
Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing |
title_fullStr |
Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing |
title_full_unstemmed |
Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing |
title_sort |
Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing |
author |
Wang,Xue-Gang |
author_facet |
Wang,Xue-Gang DongYuan,Xing Li,Jia-Ning Li,Xin-Geng |
author_role |
author |
author2 |
DongYuan,Xing Li,Jia-Ning Li,Xin-Geng |
author2_role |
author author author |
dc.contributor.author.fl_str_mv |
Wang,Xue-Gang DongYuan,Xing Li,Jia-Ning Li,Xin-Geng |
dc.subject.por.fl_str_mv |
copper aluminum inter-metallic compounds electrical resistivity conductive atom force microscopy |
topic |
copper aluminum inter-metallic compounds electrical resistivity conductive atom force microscopy |
description |
Abstract The aim of this study was to clarify the influence of inter-metallic compounds (IMCs) on the electrical conductivity of Cu/Al joint. The longitudinal resistance and the lateral current distribution at flash welded and diffusion brazed Cu/Al joint interfaces were investigated using four-point method and conductive atomic force microscopy, respectively. A 2μm Cu9Al4/CuAl2 layer was formed in both joints. The IMCs layer was homogenous and the current distribution interface was planar at diffusion brazed joint. However, the IMCs layer was discontinuous and the current distribution interface was non-planar at flash welded joint. After heat treatment at 350°C for 500h, the thickness of interfacial layer was increased to 50μm. CuAl and a short crack were newly formed in the diffusion brazed joint. CuAl, (Cu,Al)xOy and a long crack were newly formed in the flash welded joint. A multilayer current distribution was found at both heat treated joints. The resistivity of all Cu/Al joints was higher than that of copper and lower than that of aluminum. The resistivity of diffusion brazed joint was the lowest, which was lower than the theoretical value. The resistivity of the heat treated flash welded joint was the highest among all the joints. |
publishDate |
2020 |
dc.date.none.fl_str_mv |
2020-01-01 |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000500215 |
url |
http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000500215 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
10.1590/1980-5373-mr-2020-0325 |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
text/html |
dc.publisher.none.fl_str_mv |
ABM, ABC, ABPol |
publisher.none.fl_str_mv |
ABM, ABC, ABPol |
dc.source.none.fl_str_mv |
Materials Research v.23 n.5 2020 reponame:Materials research (São Carlos. Online) instname:Universidade Federal de São Carlos (UFSCAR) instacron:ABM ABC ABPOL |
instname_str |
Universidade Federal de São Carlos (UFSCAR) |
instacron_str |
ABM ABC ABPOL |
institution |
ABM ABC ABPOL |
reponame_str |
Materials research (São Carlos. Online) |
collection |
Materials research (São Carlos. Online) |
repository.name.fl_str_mv |
Materials research (São Carlos. Online) - Universidade Federal de São Carlos (UFSCAR) |
repository.mail.fl_str_mv |
dedz@power.ufscar.br |
_version_ |
1754212677830311936 |