A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substrate

Detalhes bibliográficos
Autor(a) principal: Cao,Chuanhao
Data de Publicação: 2021
Outros Autores: Liu,Lizhu, Zhang,Xiaorui
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Polímeros (São Carlos. Online)
Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S0104-14282021000100408
Resumo: Abstract Flexible transparent substrate materials, which was able to withstand high dynamic strain, in contrast to traditional substrate materials. A flexible and transparent material with advantages including transparency, stable size, and excellent corrosion and electrical resistance was provided. The polyimide(PI) film was prepared by introducing a structure with a high content of F atom and a fine optimization process to enhance the various properties of the film. However, the properties of the films were optimized effectively by gradient vacuum and secondary dissolution so that the film had a transmittance at 400 nm of 82%. The films with low dielectric constant and low dielectric loss represent the breakdown strength of 202 kV/mm. The glass transition temperature of the film was 267 °C, and the thermal expansion coefficient was 35ppm/k (30 °C~270 °C), indicated outstanding thermal dimensional stability. Therefore, this polyimide film was an optoelectronic device with extremely high application potential on the folding mobile phone and the PI film is the finest materials of screen.
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spelling A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substratetransparent PItransmittanceinsulationthermal performancedielectric propertiesAbstract Flexible transparent substrate materials, which was able to withstand high dynamic strain, in contrast to traditional substrate materials. A flexible and transparent material with advantages including transparency, stable size, and excellent corrosion and electrical resistance was provided. The polyimide(PI) film was prepared by introducing a structure with a high content of F atom and a fine optimization process to enhance the various properties of the film. However, the properties of the films were optimized effectively by gradient vacuum and secondary dissolution so that the film had a transmittance at 400 nm of 82%. The films with low dielectric constant and low dielectric loss represent the breakdown strength of 202 kV/mm. The glass transition temperature of the film was 267 °C, and the thermal expansion coefficient was 35ppm/k (30 °C~270 °C), indicated outstanding thermal dimensional stability. Therefore, this polyimide film was an optoelectronic device with extremely high application potential on the folding mobile phone and the PI film is the finest materials of screen.Associação Brasileira de Polímeros2021-01-01info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersiontext/htmlhttp://old.scielo.br/scielo.php?script=sci_arttext&pid=S0104-14282021000100408Polímeros v.31 n.1 2021reponame:Polímeros (São Carlos. Online)instname:Associação Brasileira de Polímeros (ABPol)instacron:ABPO10.1590/0104-1428.10520info:eu-repo/semantics/openAccessCao,ChuanhaoLiu,LizhuZhang,Xiaoruieng2021-05-28T00:00:00Zoai:scielo:S0104-14282021000100408Revistahttp://www.scielo.br/pohttps://old.scielo.br/oai/scielo-oai.php||revista@abpol.org.br1678-51690104-1428opendoar:2021-05-28T00:00Polímeros (São Carlos. Online) - Associação Brasileira de Polímeros (ABPol)false
dc.title.none.fl_str_mv A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substrate
title A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substrate
spellingShingle A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substrate
Cao,Chuanhao
transparent PI
transmittance
insulation
thermal performance
dielectric properties
title_short A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substrate
title_full A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substrate
title_fullStr A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substrate
title_full_unstemmed A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substrate
title_sort A foldable high transparent fluorinated polyimide (HFBAPP/6FDA) film material for transparent flexible substrate
author Cao,Chuanhao
author_facet Cao,Chuanhao
Liu,Lizhu
Zhang,Xiaorui
author_role author
author2 Liu,Lizhu
Zhang,Xiaorui
author2_role author
author
dc.contributor.author.fl_str_mv Cao,Chuanhao
Liu,Lizhu
Zhang,Xiaorui
dc.subject.por.fl_str_mv transparent PI
transmittance
insulation
thermal performance
dielectric properties
topic transparent PI
transmittance
insulation
thermal performance
dielectric properties
description Abstract Flexible transparent substrate materials, which was able to withstand high dynamic strain, in contrast to traditional substrate materials. A flexible and transparent material with advantages including transparency, stable size, and excellent corrosion and electrical resistance was provided. The polyimide(PI) film was prepared by introducing a structure with a high content of F atom and a fine optimization process to enhance the various properties of the film. However, the properties of the films were optimized effectively by gradient vacuum and secondary dissolution so that the film had a transmittance at 400 nm of 82%. The films with low dielectric constant and low dielectric loss represent the breakdown strength of 202 kV/mm. The glass transition temperature of the film was 267 °C, and the thermal expansion coefficient was 35ppm/k (30 °C~270 °C), indicated outstanding thermal dimensional stability. Therefore, this polyimide film was an optoelectronic device with extremely high application potential on the folding mobile phone and the PI film is the finest materials of screen.
publishDate 2021
dc.date.none.fl_str_mv 2021-01-01
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://old.scielo.br/scielo.php?script=sci_arttext&pid=S0104-14282021000100408
url http://old.scielo.br/scielo.php?script=sci_arttext&pid=S0104-14282021000100408
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv 10.1590/0104-1428.10520
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv text/html
dc.publisher.none.fl_str_mv Associação Brasileira de Polímeros
publisher.none.fl_str_mv Associação Brasileira de Polímeros
dc.source.none.fl_str_mv Polímeros v.31 n.1 2021
reponame:Polímeros (São Carlos. Online)
instname:Associação Brasileira de Polímeros (ABPol)
instacron:ABPO
instname_str Associação Brasileira de Polímeros (ABPol)
instacron_str ABPO
institution ABPO
reponame_str Polímeros (São Carlos. Online)
collection Polímeros (São Carlos. Online)
repository.name.fl_str_mv Polímeros (São Carlos. Online) - Associação Brasileira de Polímeros (ABPol)
repository.mail.fl_str_mv ||revista@abpol.org.br
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