Heat Dissipation and Thermal Analysis for 3D ICs

Detalhes bibliográficos
Autor(a) principal: CRISTIANO LOPES DOS SANTOS
Data de Publicação: 2015
Tipo de documento: Tese
Título da fonte: Portal de Dados Abertos da CAPES
Texto Completo: https://sucupira.capes.gov.br/sucupira/public/consultas/coleta/trabalhoConclusao/viewTrabalhoConclusao.jsf?popup=true&id_trabalho=1701581
id BRCRIS_21d046e8b571befbe33be6d62b766a87
network_acronym_str CAPES
network_name_str Portal de Dados Abertos da CAPES
dc.title.pt-BR.fl_str_mv Heat Dissipation and Thermal Analysis for 3D ICs
title Heat Dissipation and Thermal Analysis for 3D ICs
spellingShingle Heat Dissipation and Thermal Analysis for 3D ICs
3D integration. Thermal analysis. Heat dissipation. Thermal mitigation.
CRISTIANO LOPES DOS SANTOS
title_short Heat Dissipation and Thermal Analysis for 3D ICs
title_full Heat Dissipation and Thermal Analysis for 3D ICs
title_fullStr Heat Dissipation and Thermal Analysis for 3D ICs
Heat Dissipation and Thermal Analysis for 3D ICs
title_full_unstemmed Heat Dissipation and Thermal Analysis for 3D ICs
Heat Dissipation and Thermal Analysis for 3D ICs
title_sort Heat Dissipation and Thermal Analysis for 3D ICs
topic 3D integration. Thermal analysis. Heat dissipation. Thermal mitigation.
publishDate 2015
format doctoralThesis
url https://sucupira.capes.gov.br/sucupira/public/consultas/coleta/trabalhoConclusao/viewTrabalhoConclusao.jsf?popup=true&id_trabalho=1701581
author_role author
author CRISTIANO LOPES DOS SANTOS
author_facet CRISTIANO LOPES DOS SANTOS
dc.contributor.authorLattes.fl_str_mv http://lattes.cnpq.br/1979936839014544
dc.contributor.advisor1.fl_str_mv RICARDO AUGUSTO DA LUZ REIS
dc.publisher.none.fl_str_mv UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL
publisher.none.fl_str_mv UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL
instname_str UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL
dc.publisher.program.fl_str_mv MICROELETRÔNICA
dc.description.course.none.fl_txt_mv MICROELETRÔNICA
reponame_str Portal de Dados Abertos da CAPES
collection Portal de Dados Abertos da CAPES
spelling CAPESPortal de Dados Abertos da CAPESHeat Dissipation and Thermal Analysis for 3D ICsHeat Dissipation and Thermal Analysis for 3D ICsHeat Dissipation and Thermal Analysis for 3D ICsHeat Dissipation and Thermal Analysis for 3D ICsHeat Dissipation and Thermal Analysis for 3D ICsHeat Dissipation and Thermal Analysis for 3D ICsHeat Dissipation and Thermal Analysis for 3D ICs3D integration. Thermal analysis. Heat dissipation. Thermal mitigation.2015doctoralThesishttps://sucupira.capes.gov.br/sucupira/public/consultas/coleta/trabalhoConclusao/viewTrabalhoConclusao.jsf?popup=true&id_trabalho=1701581authorCRISTIANO LOPES DOS SANTOShttp://lattes.cnpq.br/1979936839014544RICARDO AUGUSTO DA LUZ REISUNIVERSIDADE FEDERAL DO RIO GRANDE DO SULUNIVERSIDADE FEDERAL DO RIO GRANDE DO SULUNIVERSIDADE FEDERAL DO RIO GRANDE DO SULMICROELETRÔNICAMICROELETRÔNICAPortal de Dados Abertos da CAPESPortal de Dados Abertos da CAPES
identifier_str_mv SANTOS, CRISTIANO LOPES DOS. Heat Dissipation and Thermal Analysis for 3D ICs. 2015. Tese.
dc.identifier.citation.fl_str_mv SANTOS, CRISTIANO LOPES DOS. Heat Dissipation and Thermal Analysis for 3D ICs. 2015. Tese.
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