Bonding CVD diamond to WC-Co by high pressure : high temperature processing
Autor(a) principal: | |
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Data de Publicação: | 2007 |
Outros Autores: | , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional do INMETRO |
Texto Completo: | http://hdl.handle.net/10926/912 |
Resumo: | ABSTRACT: In this work we investigate the effect of processing at high pressure-high temperature (HPHT) on the adhesion of CVD diamond coatings on WC-Co substrates. The samples consisted of WC-Co substrates coated with thin diamond films (10 – 40 μm thick) grown by microwave plasma (MWCVD) CVD. The substrates were previously etched in order to remove the Co from the surface region. The adhesion of the film and its wear resistance improved after the HPHT treatment. SEM images of the cross section of the coated substrate revealed that Co infiltrated back to the region where it was previously removed. The results indicate that it is possible to take advantage of the HPHT plants already available around the world to produce, besides PCD’s and diamond powder, high-performance CVD diamond cutting tools with the advantage of requiring less demanding processing conditions. |
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info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleBonding CVD diamond to WC-Co by high pressure : high temperature processing20072011-03-31T20:14:59Z2011-03-31T20:14:59ZABSTRACT: In this work we investigate the effect of processing at high pressure-high temperature (HPHT) on the adhesion of CVD diamond coatings on WC-Co substrates. The samples consisted of WC-Co substrates coated with thin diamond films (10 – 40 μm thick) grown by microwave plasma (MWCVD) CVD. The substrates were previously etched in order to remove the Co from the surface region. The adhesion of the film and its wear resistance improved after the HPHT treatment. SEM images of the cross section of the coated substrate revealed that Co infiltrated back to the region where it was previously removed. The results indicate that it is possible to take advantage of the HPHT plants already available around the world to produce, besides PCD’s and diamond powder, high-performance CVD diamond cutting tools with the advantage of requiring less demanding processing conditions.6 p. : il.Submitted by Regina Mello (mrmello@inmetro.gov.br) on 2011-02-17T12:47:59Z No. of bitstreams: 1 2007_BalzarettiPereiraJornada.pdf: 287724 bytes, checksum: bb7eeb0b3d81e0508d49572e1b639b6e (MD5)Approved for entry into archive by Claudia Araujo(caraujo@inmetro.gov.br) on 2011-03-31T20:14:59Z (GMT) No. of bitstreams: 1 2007_BalzarettiPereiraJornada.pdf: 287724 bytes, checksum: bb7eeb0b3d81e0508d49572e1b639b6e (MD5)Made available in DSpace on 2011-03-31T20:14:59Z (GMT). No. of bitstreams: 1 2007_BalzarettiPereiraJornada.pdf: 287724 bytes, checksum: bb7eeb0b3d81e0508d49572e1b639b6e (MD5) Previous issue date: 2007enghttp://hdl.handle.net/10926/912DMD_hdl_10926/912BALZARETTI, Naira Maria et al. Bonding cvd diamond to wc-co by high pressure: high temperature processing. Materials Research Society Simposium Proceedings, v. 987, 2007.Balzaretti, Naira MariaPereira, Altair SoriaCamerini, Rafael VieiraSantos, Sérgio Ivan dosJornada, João Alziro Herz dainfo:eu-repo/semantics/openAccessreponame:Repositório Institucional do INMETROinstname:Instituto Nacional de Metrologia, Qualidade e Tecnologia (INMETRO)instacron:INMETROBalzaretti_2007.pdf.txthttp://xrepo01s.inmetro.gov.br/bitstream/10926/912/6/Balzaretti_2007.pdf.txttext/plain11211http://xrepo01s.inmetro.gov.br/bitstream/10926/912/6/Balzaretti_2007.pdf.txtc442d7c395af14049db815678c9daba7MD510926_912_6Balzaretti_2007.pdfhttp://xrepo01s.inmetro.gov.br/bitstream/10926/912/1/Balzaretti_2007.pdfapplication/pdf287724http://xrepo01s.inmetro.gov.br/bitstream/10926/912/1/Balzaretti_2007.pdfbb7eeb0b3d81e0508d49572e1b639b6eMD510926_912_12024-06-10T15:24:31Zoai:xrepo01s.inmetro.gov.br:10926/912Repositório de Publicaçõeshttp://repositorios.inmetro.gov.br/oai/requestopendoar:2012-10-29T16:39:37Repositório Institucional do INMETRO - Instituto Nacional de Metrologia, Qualidade e Tecnologia (INMETRO)false |
dc.title.none.fl_str_mv |
Bonding CVD diamond to WC-Co by high pressure : high temperature processing |
title |
Bonding CVD diamond to WC-Co by high pressure : high temperature processing |
spellingShingle |
Bonding CVD diamond to WC-Co by high pressure : high temperature processing Balzaretti, Naira Maria |
title_short |
Bonding CVD diamond to WC-Co by high pressure : high temperature processing |
title_full |
Bonding CVD diamond to WC-Co by high pressure : high temperature processing |
title_fullStr |
Bonding CVD diamond to WC-Co by high pressure : high temperature processing |
title_full_unstemmed |
Bonding CVD diamond to WC-Co by high pressure : high temperature processing |
title_sort |
Bonding CVD diamond to WC-Co by high pressure : high temperature processing |
author |
Balzaretti, Naira Maria |
author_facet |
Balzaretti, Naira Maria Pereira, Altair Soria Camerini, Rafael Vieira Santos, Sérgio Ivan dos Jornada, João Alziro Herz da |
author_role |
author |
author2 |
Pereira, Altair Soria Camerini, Rafael Vieira Santos, Sérgio Ivan dos Jornada, João Alziro Herz da |
author2_role |
author author author author |
dc.contributor.author.fl_str_mv |
Balzaretti, Naira Maria Pereira, Altair Soria Camerini, Rafael Vieira Santos, Sérgio Ivan dos Jornada, João Alziro Herz da |
description |
ABSTRACT: In this work we investigate the effect of processing at high pressure-high temperature (HPHT) on the adhesion of CVD diamond coatings on WC-Co substrates. The samples consisted of WC-Co substrates coated with thin diamond films (10 – 40 μm thick) grown by microwave plasma (MWCVD) CVD. The substrates were previously etched in order to remove the Co from the surface region. The adhesion of the film and its wear resistance improved after the HPHT treatment. SEM images of the cross section of the coated substrate revealed that Co infiltrated back to the region where it was previously removed. The results indicate that it is possible to take advantage of the HPHT plants already available around the world to produce, besides PCD’s and diamond powder, high-performance CVD diamond cutting tools with the advantage of requiring less demanding processing conditions. |
publishDate |
2007 |
dc.date.issued.fl_str_mv |
2007 |
dc.date.available.fl_str_mv |
2011-03-31T20:14:59Z |
dc.date.accessioned.fl_str_mv |
2011-03-31T20:14:59Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://hdl.handle.net/10926/912 DMD_hdl_10926/912 |
dc.identifier.citation.fl_str_mv |
BALZARETTI, Naira Maria et al. Bonding cvd diamond to wc-co by high pressure: high temperature processing. Materials Research Society Simposium Proceedings, v. 987, 2007. |
url |
http://hdl.handle.net/10926/912 |
identifier_str_mv |
DMD_hdl_10926/912 BALZARETTI, Naira Maria et al. Bonding cvd diamond to wc-co by high pressure: high temperature processing. Materials Research Society Simposium Proceedings, v. 987, 2007. |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.bitstream.fl_str_mv |
text/plain application/pdf |
dc.source.none.fl_str_mv |
reponame:Repositório Institucional do INMETRO instname:Instituto Nacional de Metrologia, Qualidade e Tecnologia (INMETRO) instacron:INMETRO |
instname_str |
Instituto Nacional de Metrologia, Qualidade e Tecnologia (INMETRO) |
instacron_str |
INMETRO |
institution |
INMETRO |
reponame_str |
Repositório Institucional do INMETRO |
collection |
Repositório Institucional do INMETRO |
repository.name.fl_str_mv |
Repositório Institucional do INMETRO - Instituto Nacional de Metrologia, Qualidade e Tecnologia (INMETRO) |
repository.mail.fl_str_mv |
|
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1801499965490462720 |