A particle swarm-based algorithm for optimization of multi-layered and graded dental ceramics

• Autor(a) principal: Renani, Ehsan Askari
• Data de Publicação: 2018
• Outros Autores: Flores, Paulo, Silva, Filipe Samuel
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
• Texto Completo: http://hdl.handle.net/1822/50108
• topic: Dental restoration; Multi-layered and graded material; Porcelain; Ceramic; Particle swarm optimization; Thermal and bending stresses; Engenharia e Tecnologia::Engenharia Mecânica; Science & Technology

The thermal residual stresses (TRSs) generated owing to the cooling down from the processing temperature in layered ceramic systems can lead to crack formation as well as influence the bending stress distribution and the strength of the structure. The purpose of this study is to minimize the thermal residual and bending stresses in dental ceramics to enhance their strength as well as to prevent the structure failure. Analytical parametric models are developed to evaluate thermal residual stresses in zirconia-porcelain multi-layered and graded discs and to simulate the piston-on-ring test. To identify optimal designs of zirconia-based dental restorations, a particle swarm optimizer is also developed. The thickness of each interlayer and compositional distribution are referred to as design variables. The effect of layers number constituting the interlayer between two based materials on the performance of graded prosthetic systems is also investigated. The developed methodology is validated against results available in literature and a finite element model constructed in the present study. Three different cases are considered to determine the optimal design of graded prosthesis based on minimizing (a) TRSs; (b) bending stresses; and (c) both TRS and bending stresses. It is demonstrated that each layer thickness and composition profile have important contributions into the resulting stress field and magnitude.