Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation
Autor(a) principal: | |
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Data de Publicação: | 2021 |
Outros Autores: | , , , , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
Texto Completo: | https://hdl.handle.net/1822/81244 |
Resumo: | The use of Ta/TaN barrier bilayer systems in electronic applications has been ubiquitous over the last decade. Alternative materials such as Co-W or Ru-W alloys have gathered interest as possible replacements due to their conjugation of favourable electrical properties and barrier layer efficiency at reduced thicknesses while enabling seedless Cu electroplating. The microstructure, morphology, and electrical properties of Cu films directly electrodeposited onto Co-W or Ru-W are important to assess, concomitant with their ability to withstand the electroplating baths/conditions. This work investigates the effects of the current application method and pH value of the electroplating solution on the electrocrystallisation behaviour of Cu deposited onto a Co-W barrier layer. The film structure, morphology, and chemical composition were studied by X-ray diffraction, scanning electron microscopy and atomic force microscopy, as well as photoelectron spectroscopy. The results show that the electrolyte solution at pH 1.8 is incapable of creating a compact Cu film over the Co-W layer in either pulsed or direct-current modes. At higher pH, a continuous film is formed. A mechanism is proposed for the nucleation and growth of Cu on Co-W, where a balance between Cu nucleation, growth, and preferential Co dissolution dictates the substrate area coverage and compactness of the electrodeposited films. |
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Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formationseedless electroplatingCuCo-WCo-WInterconnectacidicEngenharia e Tecnologia::Engenharia dos MateriaisScience & TechnologyThe use of Ta/TaN barrier bilayer systems in electronic applications has been ubiquitous over the last decade. Alternative materials such as Co-W or Ru-W alloys have gathered interest as possible replacements due to their conjugation of favourable electrical properties and barrier layer efficiency at reduced thicknesses while enabling seedless Cu electroplating. The microstructure, morphology, and electrical properties of Cu films directly electrodeposited onto Co-W or Ru-W are important to assess, concomitant with their ability to withstand the electroplating baths/conditions. This work investigates the effects of the current application method and pH value of the electroplating solution on the electrocrystallisation behaviour of Cu deposited onto a Co-W barrier layer. The film structure, morphology, and chemical composition were studied by X-ray diffraction, scanning electron microscopy and atomic force microscopy, as well as photoelectron spectroscopy. The results show that the electrolyte solution at pH 1.8 is incapable of creating a compact Cu film over the Co-W layer in either pulsed or direct-current modes. At higher pH, a continuous film is formed. A mechanism is proposed for the nucleation and growth of Cu on Co-W, where a balance between Cu nucleation, growth, and preferential Co dissolution dictates the substrate area coverage and compactness of the electrodeposited films.Portugal 2020 through European Regional Development Fund (FEDER) in the frame of Operational Competitiveness and Internationalisation Programme (POCI) and in the scope of the project USECoIN with grant number PTDC/CTM-CTM/31953/2017. This work was also supported by FCT, through IDMEC, under LAETA project UIDB/50022/2020MDPIUniversidade do MinhoSantos, Rúben F.Oliveira, Bruno M. C.Chícharo, AlexandreAlpuim, P.Ferreira, Paulo J.Simões, SóniaViana, FilomenaVieira, Manuel F.2021-07-082021-07-08T00:00:00Zinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleapplication/pdfhttps://hdl.handle.net/1822/81244engSantos, R. F., Oliveira, B. M., Chícharo, A., Alpuim, P., et. al (2021). Seedless Cu Electroplating on Co-W Thin Films in Low pH Electrolyte: Early Stages of Formation. Nanomaterials, 11(8), 19142079-499110.3390/nano11081914https://www.mdpi.com/2079-4991/11/8/1914info:eu-repo/semantics/openAccessreponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãoinstacron:RCAAP2023-07-21T12:17:56Zoai:repositorium.sdum.uminho.pt:1822/81244Portal AgregadorONGhttps://www.rcaap.pt/oai/openaireopendoar:71602024-03-19T19:10:38.986993Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãofalse |
dc.title.none.fl_str_mv |
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation |
title |
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation |
spellingShingle |
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation Santos, Rúben F. seedless electroplating Cu Co-W Co-W Interconnect acidic Engenharia e Tecnologia::Engenharia dos Materiais Science & Technology |
title_short |
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation |
title_full |
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation |
title_fullStr |
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation |
title_full_unstemmed |
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation |
title_sort |
Seedless Cu electroplating on Co-W thin films in low pH electrolyte: early stages of formation |
author |
Santos, Rúben F. |
author_facet |
Santos, Rúben F. Oliveira, Bruno M. C. Chícharo, Alexandre Alpuim, P. Ferreira, Paulo J. Simões, Sónia Viana, Filomena Vieira, Manuel F. |
author_role |
author |
author2 |
Oliveira, Bruno M. C. Chícharo, Alexandre Alpuim, P. Ferreira, Paulo J. Simões, Sónia Viana, Filomena Vieira, Manuel F. |
author2_role |
author author author author author author author |
dc.contributor.none.fl_str_mv |
Universidade do Minho |
dc.contributor.author.fl_str_mv |
Santos, Rúben F. Oliveira, Bruno M. C. Chícharo, Alexandre Alpuim, P. Ferreira, Paulo J. Simões, Sónia Viana, Filomena Vieira, Manuel F. |
dc.subject.por.fl_str_mv |
seedless electroplating Cu Co-W Co-W Interconnect acidic Engenharia e Tecnologia::Engenharia dos Materiais Science & Technology |
topic |
seedless electroplating Cu Co-W Co-W Interconnect acidic Engenharia e Tecnologia::Engenharia dos Materiais Science & Technology |
description |
The use of Ta/TaN barrier bilayer systems in electronic applications has been ubiquitous over the last decade. Alternative materials such as Co-W or Ru-W alloys have gathered interest as possible replacements due to their conjugation of favourable electrical properties and barrier layer efficiency at reduced thicknesses while enabling seedless Cu electroplating. The microstructure, morphology, and electrical properties of Cu films directly electrodeposited onto Co-W or Ru-W are important to assess, concomitant with their ability to withstand the electroplating baths/conditions. This work investigates the effects of the current application method and pH value of the electroplating solution on the electrocrystallisation behaviour of Cu deposited onto a Co-W barrier layer. The film structure, morphology, and chemical composition were studied by X-ray diffraction, scanning electron microscopy and atomic force microscopy, as well as photoelectron spectroscopy. The results show that the electrolyte solution at pH 1.8 is incapable of creating a compact Cu film over the Co-W layer in either pulsed or direct-current modes. At higher pH, a continuous film is formed. A mechanism is proposed for the nucleation and growth of Cu on Co-W, where a balance between Cu nucleation, growth, and preferential Co dissolution dictates the substrate area coverage and compactness of the electrodeposited films. |
publishDate |
2021 |
dc.date.none.fl_str_mv |
2021-07-08 2021-07-08T00:00:00Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
https://hdl.handle.net/1822/81244 |
url |
https://hdl.handle.net/1822/81244 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
Santos, R. F., Oliveira, B. M., Chícharo, A., Alpuim, P., et. al (2021). Seedless Cu Electroplating on Co-W Thin Films in Low pH Electrolyte: Early Stages of Formation. Nanomaterials, 11(8), 1914 2079-4991 10.3390/nano11081914 https://www.mdpi.com/2079-4991/11/8/1914 |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
application/pdf |
dc.publisher.none.fl_str_mv |
MDPI |
publisher.none.fl_str_mv |
MDPI |
dc.source.none.fl_str_mv |
reponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação instacron:RCAAP |
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Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação |
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RCAAP |
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Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
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Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
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Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação |
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