An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate

Detalhes bibliográficos
Autor(a) principal: Mendes, P. M.
Data de Publicação: 2004
Outros Autores: Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Idioma: eng
Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
Texto Completo: http://hdl.handle.net/1822/1619
Resumo: High-resistivity polycrystalline silicon (HRPS) wafers are utilized as low-loss substrates for three-dimensional integration of on-chip antennas in wafer-level chip-scale packages (WLCSP). Sandwiching of HRPS and silicon wafers enables to integrate complex RF passives with a spacing of >150 µm to the conductive silicon substrate containing the circuitry, while providing mechanical stability, reducing form factor and avoiding any additional RF loss. A folded-patch antenna with dimensions of 2.5x2.5x1 mm3, operating at 5.7 GHz was analysed considering a 10 kΩ-cm HRPS wafer. The antenna has a –10 dB return loss bandwidth of 50 MHz and an efficiency of 58 %, a performance comparable to glass substrates.
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spelling An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrateIntegrated antennaFolded antennaSmall antennaWireless microsystemScience & TechnologyHigh-resistivity polycrystalline silicon (HRPS) wafers are utilized as low-loss substrates for three-dimensional integration of on-chip antennas in wafer-level chip-scale packages (WLCSP). Sandwiching of HRPS and silicon wafers enables to integrate complex RF passives with a spacing of >150 µm to the conductive silicon substrate containing the circuitry, while providing mechanical stability, reducing form factor and avoiding any additional RF loss. A folded-patch antenna with dimensions of 2.5x2.5x1 mm3, operating at 5.7 GHz was analysed considering a 10 kΩ-cm HRPS wafer. The antenna has a –10 dB return loss bandwidth of 50 MHz and an efficiency of 58 %, a performance comparable to glass substrates.Fundação Para a Ciência e Tecnologia (FCT) (SFRH/BD/4717/2001, POCTI/ESE/38468/2001, FEDER).IEEEUniversidade do MinhoMendes, P. M.Polyakov, A.Bartek, M.Burghartz, J. N.Correia, J. H.2004-102004-10-01T00:00:00Zconference paperinfo:eu-repo/semantics/publishedVersionapplication/pdfhttp://hdl.handle.net/1822/1619engASDAM. INTERNATIONAL CONFERENCE ON ADVANCED SEMICONDUCTOR DEVICES AND MICROSYSTEMS, 5, Smolenice Castle, 2004 - "Proceedings". Piscataway : IEEE, 2004. ISBN 0-7803-8535-7. p. 311-314.0-7803-8535-7info:eu-repo/semantics/openAccessreponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãoinstacron:RCAAP2024-05-11T05:02:12Zoai:repositorium.sdum.uminho.pt:1822/1619Portal AgregadorONGhttps://www.rcaap.pt/oai/openairemluisa.alvim@gmail.comopendoar:71602024-05-11T05:02:12Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãofalse
dc.title.none.fl_str_mv An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
title An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
spellingShingle An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
Mendes, P. M.
Integrated antenna
Folded antenna
Small antenna
Wireless microsystem
Science & Technology
title_short An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
title_full An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
title_fullStr An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
title_full_unstemmed An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
title_sort An integrated folded-patch chip-size antenna using high-resistivity polycrystalline silicon substrate
author Mendes, P. M.
author_facet Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
author_role author
author2 Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
author2_role author
author
author
author
dc.contributor.none.fl_str_mv Universidade do Minho
dc.contributor.author.fl_str_mv Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
dc.subject.por.fl_str_mv Integrated antenna
Folded antenna
Small antenna
Wireless microsystem
Science & Technology
topic Integrated antenna
Folded antenna
Small antenna
Wireless microsystem
Science & Technology
description High-resistivity polycrystalline silicon (HRPS) wafers are utilized as low-loss substrates for three-dimensional integration of on-chip antennas in wafer-level chip-scale packages (WLCSP). Sandwiching of HRPS and silicon wafers enables to integrate complex RF passives with a spacing of >150 µm to the conductive silicon substrate containing the circuitry, while providing mechanical stability, reducing form factor and avoiding any additional RF loss. A folded-patch antenna with dimensions of 2.5x2.5x1 mm3, operating at 5.7 GHz was analysed considering a 10 kΩ-cm HRPS wafer. The antenna has a –10 dB return loss bandwidth of 50 MHz and an efficiency of 58 %, a performance comparable to glass substrates.
publishDate 2004
dc.date.none.fl_str_mv 2004-10
2004-10-01T00:00:00Z
dc.type.driver.fl_str_mv conference paper
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://hdl.handle.net/1822/1619
url http://hdl.handle.net/1822/1619
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv ASDAM. INTERNATIONAL CONFERENCE ON ADVANCED SEMICONDUCTOR DEVICES AND MICROSYSTEMS, 5, Smolenice Castle, 2004 - "Proceedings". Piscataway : IEEE, 2004. ISBN 0-7803-8535-7. p. 311-314.
0-7803-8535-7
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv IEEE
publisher.none.fl_str_mv IEEE
dc.source.none.fl_str_mv reponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
instacron:RCAAP
instname_str Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
instacron_str RCAAP
institution RCAAP
reponame_str Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
collection Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
repository.name.fl_str_mv Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
repository.mail.fl_str_mv mluisa.alvim@gmail.com
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