Ku-band Transition with not Metalized Air-Vias between Microstrip Line and Substrate Integrated Waveguide

• Autor(a) principal: Grine,Farouk
• Data de Publicação: 2017
• Outros Autores: Benhabiles,Mohamed Taoufik, Riabi,Mohamed Lahdi
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Journal of Microwaves. Optoelectronics and Electromagnetic Applications
• Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S2179-10742017000100050
• topic: Substrate Integrated Waveguide; Microstrip Line; Tapred Transition; Air-Vias

Abstract In this letter, a new transition between microstrip line and substrate integrated waveguide in Ku-band frequency is proposed. This transition composed of one row of not metallized air-vias drilled on both sides of the microstrip line with taper end. The electromagnetic analysis is carried out using a commercial software tool. The presented transition achieves return losses better than 41 dB in Ku-band frequency (12.4–18GHz). In order to validate the simulated results of the proposed concept, a back-to-back transition prototype is designed, fabricated and measured. The measured results demonstrate a minimum return loss of 29.05 dB and maximum insertion loss of 0.685 dB over the entire Ku-band frequency.