Electrochemical behavior of carbon steel pre-treated with an organo functional bis-silane filled with copper phthalocyanine

• Autor(a) principal: Suegama,Patricia H.
• Data de Publicação: 2008
• Outros Autores: Aoki,Idalina V.
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Journal of the Brazilian Chemical Society (Online)
• Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S0103-50532008000400019
• topic: corrosion; silane film; BTSPA; inhibitor

The bis-[trimethoxysilylpropyl]amine (BTSPA) film filled with copper phthalocyanine (Cu-Ph) was prepared by adding different concentrations of copper phthalocyanine - Cu-Ph and deposited on a carbon steel substrate using 120 ºC and 150 ºC as curing temperatures. For samples cured at 150 ºC a second layer was also deposited. The electrochemical behavior of carbon steel coated with BTSPA filled with Cu-Ph was studied by electrochemical measurements, electrochemical impedance spectroscopy (EIS) and polarization curves, in aerated 0.1 mol L-1 NaCl solution. Physical and chemical characterization was made by thermogravimetric analysis (TGA), scanning electron microscopy, contact angle measurements and infrared spectroscopy. TGA showed no decomposition of Cu-Ph during the curing process. Cu-Ph added into the silane film showed a strong influence on its corrosion resistance, mainly when the samples are cured at 150 ºC. The results showed that lower inhibitor concentrations led to a higher corrosion resistance and the second layer increased by one order of magnitude the corrosion resistance.