Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração
Autor(a) principal: | |
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Data de Publicação: | 2018 |
Tipo de documento: | Dissertação |
Idioma: | por |
Título da fonte: | Repositório Institucional da UFSCAR |
Texto Completo: | https://repositorio.ufscar.br/handle/ufscar/10111 |
Resumo: | The present investigation examined the microstructural arrangements formed during the transient solidification of the eutectic Sn-0.2wt.%Ni and the hypereutectic Sn-0.5wt.%Ni alloys using two different substrates as mold sheets separating the alloy casting from the cooling fluid: copper and low carbon steel. The examination of the obtained microstructures was carried out highlighting not only the micromorphology aspects of the formed β-Sn phase but also the nature and the shape of the intermetallic compounds (IMCs) developed. The purpose of this research work is to verify the influences that both substrates of different materials and Ni content may have on the alloy solidification kinetics, resultant microstructures and tensile properties of the Sn-Ni solder alloys. The dissolution of Cu from the popper mold in the eutectic alloy contributed to the prevalent growth of the (Cu,Ni)6Sn5 fiber-like eutectic phase along the length of the casting. Furthermore, a β-Sn morphological cellular/dendritic transition occurs in the eutectic alloy against copper mold for ṪE>5.5°C/s. On the other hand, for the alloy solidified against the steel mold, a predominance of the non-equilibrium NiSn4 eutectic phase with plate-like shape has been identified by SEM/EDS. For the solidified hypereutectic Sn-0.5wt.%Ni alloy in copper mold, the results indicate that the increase in Ni content may have influenced both thermal behavior and cellular spacing (λC). A transition from high cooling rate cells to plate like cells characterizes the hypereutectic alloy for ṪE>2.7°C/s. The NiSn4 intermetallic particles are also present in the eutectic mixture of the Sn-0.5wt.%Ni. Experimental growth laws relating the microstructural spacings, λ1,C, to the cooling rate and eutectic growth rate have been proposed, as well as Hall-Petch type experimental equations associated with tensile properties as a function of the length scale of the β-Sn matrix, for both the eutectic and hypereutectic chemistries. |
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Xavier, Marcella Gautê CavalcanteSpinelli, José Eduardohttp://lattes.cnpq.br/8882038118634925Silva, Bismarck Luizhttp://lattes.cnpq.br/4377238190630005http://lattes.cnpq.br/146146537358324803363993-b1ea-4c09-965f-9e552e0735392018-05-24T12:45:56Z2018-05-24T12:45:56Z2018-02-28XAVIER, Marcella Gautê Cavalcante. Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração. 2018. Dissertação (Mestrado em Ciência e Engenharia de Materiais) – Universidade Federal de São Carlos, São Carlos, 2018. Disponível em: https://repositorio.ufscar.br/handle/ufscar/10111.https://repositorio.ufscar.br/handle/ufscar/10111The present investigation examined the microstructural arrangements formed during the transient solidification of the eutectic Sn-0.2wt.%Ni and the hypereutectic Sn-0.5wt.%Ni alloys using two different substrates as mold sheets separating the alloy casting from the cooling fluid: copper and low carbon steel. The examination of the obtained microstructures was carried out highlighting not only the micromorphology aspects of the formed β-Sn phase but also the nature and the shape of the intermetallic compounds (IMCs) developed. The purpose of this research work is to verify the influences that both substrates of different materials and Ni content may have on the alloy solidification kinetics, resultant microstructures and tensile properties of the Sn-Ni solder alloys. The dissolution of Cu from the popper mold in the eutectic alloy contributed to the prevalent growth of the (Cu,Ni)6Sn5 fiber-like eutectic phase along the length of the casting. Furthermore, a β-Sn morphological cellular/dendritic transition occurs in the eutectic alloy against copper mold for ṪE>5.5°C/s. On the other hand, for the alloy solidified against the steel mold, a predominance of the non-equilibrium NiSn4 eutectic phase with plate-like shape has been identified by SEM/EDS. For the solidified hypereutectic Sn-0.5wt.%Ni alloy in copper mold, the results indicate that the increase in Ni content may have influenced both thermal behavior and cellular spacing (λC). A transition from high cooling rate cells to plate like cells characterizes the hypereutectic alloy for ṪE>2.7°C/s. The NiSn4 intermetallic particles are also present in the eutectic mixture of the Sn-0.5wt.%Ni. Experimental growth laws relating the microstructural spacings, λ1,C, to the cooling rate and eutectic growth rate have been proposed, as well as Hall-Petch type experimental equations associated with tensile properties as a function of the length scale of the β-Sn matrix, for both the eutectic and hypereutectic chemistries.O presente trabalho de Mestrado examinou os arranjos microestruturais formados durante a solidificação direcional transitória das ligas eutética Sn-0,2%Ni e hipereutética Sn-0,5%Ni contra chapa-moldes de cobre e aço carbono 1020. Foram destacados não somente os aspectos micromorfológicos da fase β-Sn, mas também a natureza e a morfologia dos compostos intermetálicos desenvolvidos. O objetivo deste trabalho foi verificar os efeitos proporcionados tanto por substratos de diferentes materiais quanto pelo teor de Ni sobre a cinética de solidificação da liga na formação da microestrutura e nas propriedades de tração. A dissolução de Cu, proveniente da chapa-molde de cobre, na liga eutética Sn-0,2%Ni contribuiu para o crescimento predominante da fase fibrosa eutética (Cu, Ni)6Sn5. Além disso, uma transição morfológica do tipo dendritas/ células β-Sn ocorre neste caso para taxas de resfriamento, ṪE> 5,5°C/s. Por outro lado, para a liga Sn-0,2%Ni, solidificada contra molde de aço, a predominância da fase eutética de não equilíbrio NiSn4 com morfologia do tipo placas foi identificada por MEV/EDS. Quanto à liga hipereutética Sn-0,5%Ni, solidificada em molde de cobre, os resultados apontam que o aumento do teor de Ni pode ter influenciado o comportamento térmico e o espaçamento celular (λC). Uma transição de células do tipo placa para células de alta taxa de resfriamento caracteriza essa liga hipereutética, para ṪE> 2,7°C/s. O intermetálico NiSn4 está presente compondo a mistura eutética dessa liga. Foram propostas as leis de crescimento experimental relativas aos espaçamentos microestruturais (λ1,C) em função da taxa de resfriamento e da velocidade de crescimento do eutético, bem como as equações experimentais do tipo Hall-Petch associadas às propriedades mecânicas de tração em função dos espaçamentos microestruturais (λ1,C) para ambas as ligas Sn-0,2%Ni e Sn-0,5%Ni.Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)FAPESP: 2015/11863-5porUniversidade Federal de São CarlosCâmpus São CarlosPrograma de Pós-Graduação em Ciência e Engenharia de Materiais - PPGCEMUFSCarLigas Sn-NiSolidificação direcionalCrescimento celularEutéticoIntermetálicosPropriedades mecânicas de traçãoTensile propertiesIntermetallicsEutecticsCellular growthDirectional solidificationSn-Ni alloysENGENHARIAS::ENGENHARIA DE MATERIAIS E METALURGICA::METALURGIA DE TRANSFORMACAOENGENHARIAS::ENGENHARIA DE MATERIAIS E METALURGICALigas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de traçãoSn-Ni alloys: effects of cooling rate and microstructure on the tensile propertiesinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/masterThesisOnline6006008fc158b0-a390-45b3-a0bc-c39839f98f75info:eu-repo/semantics/openAccessreponame:Repositório Institucional da UFSCARinstname:Universidade Federal de São Carlos (UFSCAR)instacron:UFSCARLICENSElicense.txtlicense.txttext/plain; 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dc.title.por.fl_str_mv |
Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração |
dc.title.alternative.eng.fl_str_mv |
Sn-Ni alloys: effects of cooling rate and microstructure on the tensile properties |
title |
Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração |
spellingShingle |
Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração Xavier, Marcella Gautê Cavalcante Ligas Sn-Ni Solidificação direcional Crescimento celular Eutético Intermetálicos Propriedades mecânicas de tração Tensile properties Intermetallics Eutectics Cellular growth Directional solidification Sn-Ni alloys ENGENHARIAS::ENGENHARIA DE MATERIAIS E METALURGICA::METALURGIA DE TRANSFORMACAO ENGENHARIAS::ENGENHARIA DE MATERIAIS E METALURGICA |
title_short |
Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração |
title_full |
Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração |
title_fullStr |
Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração |
title_full_unstemmed |
Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração |
title_sort |
Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração |
author |
Xavier, Marcella Gautê Cavalcante |
author_facet |
Xavier, Marcella Gautê Cavalcante |
author_role |
author |
dc.contributor.authorlattes.por.fl_str_mv |
http://lattes.cnpq.br/1461465373583248 |
dc.contributor.author.fl_str_mv |
Xavier, Marcella Gautê Cavalcante |
dc.contributor.advisor1.fl_str_mv |
Spinelli, José Eduardo |
dc.contributor.advisor1Lattes.fl_str_mv |
http://lattes.cnpq.br/8882038118634925 |
dc.contributor.advisor-co1.fl_str_mv |
Silva, Bismarck Luiz |
dc.contributor.advisor-co1Lattes.fl_str_mv |
http://lattes.cnpq.br/4377238190630005 |
dc.contributor.authorID.fl_str_mv |
03363993-b1ea-4c09-965f-9e552e073539 |
contributor_str_mv |
Spinelli, José Eduardo Silva, Bismarck Luiz |
dc.subject.por.fl_str_mv |
Ligas Sn-Ni Solidificação direcional Crescimento celular Eutético Intermetálicos Propriedades mecânicas de tração |
topic |
Ligas Sn-Ni Solidificação direcional Crescimento celular Eutético Intermetálicos Propriedades mecânicas de tração Tensile properties Intermetallics Eutectics Cellular growth Directional solidification Sn-Ni alloys ENGENHARIAS::ENGENHARIA DE MATERIAIS E METALURGICA::METALURGIA DE TRANSFORMACAO ENGENHARIAS::ENGENHARIA DE MATERIAIS E METALURGICA |
dc.subject.eng.fl_str_mv |
Tensile properties Intermetallics Eutectics Cellular growth Directional solidification Sn-Ni alloys |
dc.subject.cnpq.fl_str_mv |
ENGENHARIAS::ENGENHARIA DE MATERIAIS E METALURGICA::METALURGIA DE TRANSFORMACAO ENGENHARIAS::ENGENHARIA DE MATERIAIS E METALURGICA |
description |
The present investigation examined the microstructural arrangements formed during the transient solidification of the eutectic Sn-0.2wt.%Ni and the hypereutectic Sn-0.5wt.%Ni alloys using two different substrates as mold sheets separating the alloy casting from the cooling fluid: copper and low carbon steel. The examination of the obtained microstructures was carried out highlighting not only the micromorphology aspects of the formed β-Sn phase but also the nature and the shape of the intermetallic compounds (IMCs) developed. The purpose of this research work is to verify the influences that both substrates of different materials and Ni content may have on the alloy solidification kinetics, resultant microstructures and tensile properties of the Sn-Ni solder alloys. The dissolution of Cu from the popper mold in the eutectic alloy contributed to the prevalent growth of the (Cu,Ni)6Sn5 fiber-like eutectic phase along the length of the casting. Furthermore, a β-Sn morphological cellular/dendritic transition occurs in the eutectic alloy against copper mold for ṪE>5.5°C/s. On the other hand, for the alloy solidified against the steel mold, a predominance of the non-equilibrium NiSn4 eutectic phase with plate-like shape has been identified by SEM/EDS. For the solidified hypereutectic Sn-0.5wt.%Ni alloy in copper mold, the results indicate that the increase in Ni content may have influenced both thermal behavior and cellular spacing (λC). A transition from high cooling rate cells to plate like cells characterizes the hypereutectic alloy for ṪE>2.7°C/s. The NiSn4 intermetallic particles are also present in the eutectic mixture of the Sn-0.5wt.%Ni. Experimental growth laws relating the microstructural spacings, λ1,C, to the cooling rate and eutectic growth rate have been proposed, as well as Hall-Petch type experimental equations associated with tensile properties as a function of the length scale of the β-Sn matrix, for both the eutectic and hypereutectic chemistries. |
publishDate |
2018 |
dc.date.accessioned.fl_str_mv |
2018-05-24T12:45:56Z |
dc.date.available.fl_str_mv |
2018-05-24T12:45:56Z |
dc.date.issued.fl_str_mv |
2018-02-28 |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/masterThesis |
format |
masterThesis |
status_str |
publishedVersion |
dc.identifier.citation.fl_str_mv |
XAVIER, Marcella Gautê Cavalcante. Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração. 2018. Dissertação (Mestrado em Ciência e Engenharia de Materiais) – Universidade Federal de São Carlos, São Carlos, 2018. Disponível em: https://repositorio.ufscar.br/handle/ufscar/10111. |
dc.identifier.uri.fl_str_mv |
https://repositorio.ufscar.br/handle/ufscar/10111 |
identifier_str_mv |
XAVIER, Marcella Gautê Cavalcante. Ligas Sn-Ni: efeitos da taxa de resfriamento e da microestrutura nas propriedades mecânicas de tração. 2018. Dissertação (Mestrado em Ciência e Engenharia de Materiais) – Universidade Federal de São Carlos, São Carlos, 2018. Disponível em: https://repositorio.ufscar.br/handle/ufscar/10111. |
url |
https://repositorio.ufscar.br/handle/ufscar/10111 |
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por |
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openAccess |
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Universidade Federal de São Carlos Câmpus São Carlos |
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Programa de Pós-Graduação em Ciência e Engenharia de Materiais - PPGCEM |
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UFSCar |
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Universidade Federal de São Carlos Câmpus São Carlos |
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