Microstructure of brazed joints between mechanically metallized Si3N4 and stainless steel

• Autor(a) principal: Nascimento, Rubens Maribondo do
• Data de Publicação: 2005
• Outros Autores: Martinelli, Antonio Eduardo, Buschinelli, Augusto José de Almeida, Reisgen, Uwe, Remmel, Josef
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Repositório Institucional da UFRN
• Texto Completo: https://repositorio.ufrn.br/handle/123456789/31278
• topic: Average Thickness; Alternative Route; Microstructure; Stainless Steel; Thermal Stress

Brazing has been increasingly used to join metals to advanced ceramics. Brazing covalent materials requires either the use of active filler alloys or the previous metallization of the surface. To that end, a new and simple mechanical technique has been applied to metallize advanced ceramics, thus avoiding the use of costly Ti-based active filler alloys. The mechanical metallization of Si3N4 with Ti was employed as an alternative route to deposit active metallic films prior to brazing with stainless steel using 72% Ag--28% Cu or 82% Au—18% Ni eutectic alloys. The brazing temperatures were set to 40°C or 75°C above the eutectic temperature of each filler alloy. Ti-films of average thickness 4 μm produced adequate spreading of both filler alloys onto Si3N4 substrates, which were subsequently brazed to stainless steel. The interface of Si3N4/310 stainless steel basically consisted of a reaction layer, a precipitation zone and an eutectic microconstituent. Mechanically sound and vacuum-tight joints were obtained, especially upon brazing at relatively lower temperatures. Increasing the brazing temperature resulted in thermal cracking of the Si3N4, possibly due to increased thermal stress