Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys
Autor(a) principal: | |
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Data de Publicação: | 2015 |
Outros Autores: | , , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UFRN |
Texto Completo: | https://repositorio.ufrn.br/handle/123456789/31883 |
Resumo: | Bi–Ag lead-free alloys are considered interesting alternatives to Pb-based traditional solders due to compatible melting point and strength. During soldering, the ability of a liquid alloy to flow or spread over the substrate is crucial for the formation of a metallic bond driven by the physicochemical properties of the liquid solder/solid substrate system. In addition, the wettability is intimately associated with the solder/substrate thermal conductance represented by a heat transfer coefficient, hi. In this work, three Bi–Ag alloys (hypoeutectic—1.5 wt%Ag, eutectic—2.5 wt%Ag and hypereutectic—4.0 wt%Ag) were directionally solidified under upward unsteady state heat flow conditions. Both time-dependent hi profiles and wetting behavior represented by contact angles (θ) were determined for the three alloys examined. The dependence of θ on the alloy Ag content is assessed experimentally. Also, thermal readings collected during directional solidification of the Bi 1.5, 2.5 and 4.0 wt% Ag alloys are used with a view to permitting hi versus time (t) profiles to be computed. It is shown that along a first solidification stage (t < 16 s) the hi values followed the trend experimentally observed by the contact angles for the three alloys examined, while for t > 16 s the volumetric expansion of the Bi-rich phase is shown to have a dominant role inducing a sudden increase in hi. For each alloy a couple of time-dependent hi expressions is needed to represent the entire solidification progress |
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Silva, Bismarck LuizBertelli, FelipeCanté, Manuel VenceslauSpinelli, José EduardoCheung, NoéGarcia, Amauri2021-03-15T20:29:56Z2021-03-15T20:29:56Z2015-10-31SILVA, Bismarck Luiz; BERTELLI, Felipe; CANTÉ, Manuel V.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys. Journal Of Materials Science: Materials in Electronics, [S.L.], v. 27, n. 2, p. 1994-2003, 31 out. 2015. Disponível em: https://link.springer.com/article/10.1007%2Fs10854-015-3983-2. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1007/s10854-015-3983-20957-45221573-482Xhttps://repositorio.ufrn.br/handle/123456789/3188310.1007/s10854-015-3983-2SpringerAttribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/info:eu-repo/semantics/openAccessContact AngleHeat Transfer CoefficientSolder AlloyDirectionally SolidifyVolumetric ExpansionSolder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloysinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleBi–Ag lead-free alloys are considered interesting alternatives to Pb-based traditional solders due to compatible melting point and strength. During soldering, the ability of a liquid alloy to flow or spread over the substrate is crucial for the formation of a metallic bond driven by the physicochemical properties of the liquid solder/solid substrate system. In addition, the wettability is intimately associated with the solder/substrate thermal conductance represented by a heat transfer coefficient, hi. In this work, three Bi–Ag alloys (hypoeutectic—1.5 wt%Ag, eutectic—2.5 wt%Ag and hypereutectic—4.0 wt%Ag) were directionally solidified under upward unsteady state heat flow conditions. Both time-dependent hi profiles and wetting behavior represented by contact angles (θ) were determined for the three alloys examined. The dependence of θ on the alloy Ag content is assessed experimentally. Also, thermal readings collected during directional solidification of the Bi 1.5, 2.5 and 4.0 wt% Ag alloys are used with a view to permitting hi versus time (t) profiles to be computed. It is shown that along a first solidification stage (t < 16 s) the hi values followed the trend experimentally observed by the contact angles for the three alloys examined, while for t > 16 s the volumetric expansion of the Bi-rich phase is shown to have a dominant role inducing a sudden increase in hi. For each alloy a couple of time-dependent hi expressions is needed to represent the entire solidification progressengreponame:Repositório Institucional da UFRNinstname:Universidade Federal do Rio Grande do Norte (UFRN)instacron:UFRNORIGINALSolderInterfacial_SILVA_2016.pdfSolderInterfacial_SILVA_2016.pdfapplication/pdf1048972https://repositorio.ufrn.br/bitstream/123456789/31883/1/SolderInterfacial_SILVA_2016.pdfc50b793b098f831b4a6683eee88caa8dMD51CC-LICENSElicense_rdflicense_rdfapplication/rdf+xml; charset=utf-8914https://repositorio.ufrn.br/bitstream/123456789/31883/2/license_rdf4d2950bda3d176f570a9f8b328dfbbefMD52LICENSElicense.txtlicense.txttext/plain; charset=utf-81484https://repositorio.ufrn.br/bitstream/123456789/31883/3/license.txte9597aa2854d128fd968be5edc8a28d9MD53TEXTSolderInterfacial_SILVA_2016.pdf.txtSolderInterfacial_SILVA_2016.pdf.txtExtracted texttext/plain32669https://repositorio.ufrn.br/bitstream/123456789/31883/4/SolderInterfacial_SILVA_2016.pdf.txtec929ecbc5ea66aecdaf89e0cc272237MD54THUMBNAILSolderInterfacial_SILVA_2016.pdf.jpgSolderInterfacial_SILVA_2016.pdf.jpgGenerated Thumbnailimage/jpeg1801https://repositorio.ufrn.br/bitstream/123456789/31883/5/SolderInterfacial_SILVA_2016.pdf.jpgd7d2379f0450e5e7e1f7e58e84b5aa2aMD55123456789/318832021-03-21 05:47:05.065oai:https://repositorio.ufrn.br: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Repositório de PublicaçõesPUBhttp://repositorio.ufrn.br/oai/opendoar:2021-03-21T08:47:05Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)false |
dc.title.pt_BR.fl_str_mv |
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys |
title |
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys |
spellingShingle |
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys Silva, Bismarck Luiz Contact Angle Heat Transfer Coefficient Solder Alloy Directionally Solidify Volumetric Expansion |
title_short |
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys |
title_full |
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys |
title_fullStr |
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys |
title_full_unstemmed |
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys |
title_sort |
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys |
author |
Silva, Bismarck Luiz |
author_facet |
Silva, Bismarck Luiz Bertelli, Felipe Canté, Manuel Venceslau Spinelli, José Eduardo Cheung, Noé Garcia, Amauri |
author_role |
author |
author2 |
Bertelli, Felipe Canté, Manuel Venceslau Spinelli, José Eduardo Cheung, Noé Garcia, Amauri |
author2_role |
author author author author author |
dc.contributor.author.fl_str_mv |
Silva, Bismarck Luiz Bertelli, Felipe Canté, Manuel Venceslau Spinelli, José Eduardo Cheung, Noé Garcia, Amauri |
dc.subject.por.fl_str_mv |
Contact Angle Heat Transfer Coefficient Solder Alloy Directionally Solidify Volumetric Expansion |
topic |
Contact Angle Heat Transfer Coefficient Solder Alloy Directionally Solidify Volumetric Expansion |
description |
Bi–Ag lead-free alloys are considered interesting alternatives to Pb-based traditional solders due to compatible melting point and strength. During soldering, the ability of a liquid alloy to flow or spread over the substrate is crucial for the formation of a metallic bond driven by the physicochemical properties of the liquid solder/solid substrate system. In addition, the wettability is intimately associated with the solder/substrate thermal conductance represented by a heat transfer coefficient, hi. In this work, three Bi–Ag alloys (hypoeutectic—1.5 wt%Ag, eutectic—2.5 wt%Ag and hypereutectic—4.0 wt%Ag) were directionally solidified under upward unsteady state heat flow conditions. Both time-dependent hi profiles and wetting behavior represented by contact angles (θ) were determined for the three alloys examined. The dependence of θ on the alloy Ag content is assessed experimentally. Also, thermal readings collected during directional solidification of the Bi 1.5, 2.5 and 4.0 wt% Ag alloys are used with a view to permitting hi versus time (t) profiles to be computed. It is shown that along a first solidification stage (t < 16 s) the hi values followed the trend experimentally observed by the contact angles for the three alloys examined, while for t > 16 s the volumetric expansion of the Bi-rich phase is shown to have a dominant role inducing a sudden increase in hi. For each alloy a couple of time-dependent hi expressions is needed to represent the entire solidification progress |
publishDate |
2015 |
dc.date.issued.fl_str_mv |
2015-10-31 |
dc.date.accessioned.fl_str_mv |
2021-03-15T20:29:56Z |
dc.date.available.fl_str_mv |
2021-03-15T20:29:56Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.citation.fl_str_mv |
SILVA, Bismarck Luiz; BERTELLI, Felipe; CANTÉ, Manuel V.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys. Journal Of Materials Science: Materials in Electronics, [S.L.], v. 27, n. 2, p. 1994-2003, 31 out. 2015. Disponível em: https://link.springer.com/article/10.1007%2Fs10854-015-3983-2. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1007/s10854-015-3983-2 |
dc.identifier.uri.fl_str_mv |
https://repositorio.ufrn.br/handle/123456789/31883 |
dc.identifier.issn.none.fl_str_mv |
0957-4522 1573-482X |
dc.identifier.doi.none.fl_str_mv |
10.1007/s10854-015-3983-2 |
identifier_str_mv |
SILVA, Bismarck Luiz; BERTELLI, Felipe; CANTÉ, Manuel V.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys. Journal Of Materials Science: Materials in Electronics, [S.L.], v. 27, n. 2, p. 1994-2003, 31 out. 2015. Disponível em: https://link.springer.com/article/10.1007%2Fs10854-015-3983-2. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1007/s10854-015-3983-2 0957-4522 1573-482X 10.1007/s10854-015-3983-2 |
url |
https://repositorio.ufrn.br/handle/123456789/31883 |
dc.language.iso.fl_str_mv |
eng |
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eng |
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Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ info:eu-repo/semantics/openAccess |
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Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ |
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openAccess |
dc.publisher.none.fl_str_mv |
Springer |
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Springer |
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Universidade Federal do Rio Grande do Norte (UFRN) |
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UFRN |
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UFRN |
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Repositório Institucional da UFRN |
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