The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Detalhes bibliográficos
Autor(a) principal: Curtulo, Joanisa P.
Data de Publicação: 2019
Outros Autores: Dias, Marcelino, Bertelli, Felipe, Silva, Bismarck Luiz, Spinelli, José Eduardo, Garcia, Amauri, Cheung, Noé
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Repositório Institucional da UFRN
Texto Completo: https://repositorio.ufrn.br/handle/123456789/32177
Resumo: 2021-01
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spelling Curtulo, Joanisa P.Dias, MarcelinoBertelli, FelipeSilva, Bismarck LuizSpinelli, José EduardoGarcia, AmauriCheung, Noé2021-04-12T20:43:47Z2019-12CURTULO, Joanisa P.; DIAS, Marcelino; BERTELLI, Felipe; SILVA, Bismarck L.; SPINELLI, José E.; GARCIA, Amauri; CHEUNG, Noé. The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a sn-sb peritectic solder alloy on distinct substrates. Journal of Manufacturing Processes, [S.L.], v. 48, p. 164-173, dez. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1526612519303706?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jmapro.2019.10.0291526-6125https://repositorio.ufrn.br/handle/123456789/3217710.1016/j.jmapro.2019.10.029ElsevierAttribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/info:eu-repo/semantics/openAccessSn-Sb alloyPeritecticHeat transferAnalytical modelSolidificationWettabilityInterfaceThe application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substratesinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/article2021-01Three distinct alloy/substrate couples were considered. In order to treat the reaction interface problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low carbon steel were chosen so that solidification of a Sn-Sb peritectic alloy could be evaluated comprehending very different conditions. A straightforward view of the mechanisms affecting the heat transfer efficiencies was consistent with a number of techniques applied in the present investigation, which includes directional solidification experiments, analytical modelling, wettability analyses and characterization of the reactions between the alloy and the substrates. The proposed analytical model was perceptive to these reactions. For the Cu substrate, the motion of Cu towards the alloy was more effective as compared to the motion of Ni from the Ni substrate. As a consequence, the alloy/Cu interface presented a higher level of Kirkendall voids. The higher fraction of voids at the interface resulted in lower interfacial thermal conductance for the Sn-Sb/Cu couple. Hence, the present experimental-theoretical approach is useful to indicate the solder joint integrity in terms of the presence of empty spots. Despite the higher thermal conductivity of Cu and lower contact angle between the alloy and the Cu in comparison to the Ni substrate, the high porosity at the Cu interface during alloy soldering was shown to reduce the heat transfer capabilityengreponame:Repositório Institucional da UFRNinstname:Universidade Federal do Rio Grande do Norte (UFRN)instacron:UFRNORIGINALTheApplicationAnalytical_SILVA_2019.pdfTheApplicationAnalytical_SILVA_2019.pdfapplication/pdf2711006https://repositorio.ufrn.br/bitstream/123456789/32177/1/TheApplicationAnalytical_SILVA_2019.pdf42608b2236aebe242a14f335b4d3d703MD51CC-LICENSElicense_rdflicense_rdfapplication/rdf+xml; charset=utf-8914https://repositorio.ufrn.br/bitstream/123456789/32177/2/license_rdf4d2950bda3d176f570a9f8b328dfbbefMD52LICENSElicense.txtlicense.txttext/plain; charset=utf-81484https://repositorio.ufrn.br/bitstream/123456789/32177/3/license.txte9597aa2854d128fd968be5edc8a28d9MD53TEXTTheApplicationAnalytical_SILVA_2019.pdf.txtTheApplicationAnalytical_SILVA_2019.pdf.txtExtracted texttext/plain45810https://repositorio.ufrn.br/bitstream/123456789/32177/4/TheApplicationAnalytical_SILVA_2019.pdf.txtb45f961c1d249f4111b9dd54964f207fMD54THUMBNAILTheApplicationAnalytical_SILVA_2019.pdf.jpgTheApplicationAnalytical_SILVA_2019.pdf.jpgGenerated Thumbnailimage/jpeg1690https://repositorio.ufrn.br/bitstream/123456789/32177/5/TheApplicationAnalytical_SILVA_2019.pdf.jpgcaf6aa54506f2268efd03b02beaff0d7MD55123456789/321772024-03-19 01:04:22.18oai:https://repositorio.ufrn.br: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Repositório de PublicaçõesPUBhttp://repositorio.ufrn.br/oai/opendoar:2024-03-19T04:04:22Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)false
dc.title.pt_BR.fl_str_mv The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
spellingShingle The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
Curtulo, Joanisa P.
Sn-Sb alloy
Peritectic
Heat transfer
Analytical model
Solidification
Wettability
Interface
title_short The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title_full The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title_fullStr The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title_full_unstemmed The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title_sort The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
author Curtulo, Joanisa P.
author_facet Curtulo, Joanisa P.
Dias, Marcelino
Bertelli, Felipe
Silva, Bismarck Luiz
Spinelli, José Eduardo
Garcia, Amauri
Cheung, Noé
author_role author
author2 Dias, Marcelino
Bertelli, Felipe
Silva, Bismarck Luiz
Spinelli, José Eduardo
Garcia, Amauri
Cheung, Noé
author2_role author
author
author
author
author
author
dc.contributor.author.fl_str_mv Curtulo, Joanisa P.
Dias, Marcelino
Bertelli, Felipe
Silva, Bismarck Luiz
Spinelli, José Eduardo
Garcia, Amauri
Cheung, Noé
dc.subject.por.fl_str_mv Sn-Sb alloy
Peritectic
Heat transfer
Analytical model
Solidification
Wettability
Interface
topic Sn-Sb alloy
Peritectic
Heat transfer
Analytical model
Solidification
Wettability
Interface
description 2021-01
publishDate 2019
dc.date.issued.fl_str_mv 2019-12
dc.date.accessioned.fl_str_mv 2021-04-12T20:43:47Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.citation.fl_str_mv CURTULO, Joanisa P.; DIAS, Marcelino; BERTELLI, Felipe; SILVA, Bismarck L.; SPINELLI, José E.; GARCIA, Amauri; CHEUNG, Noé. The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a sn-sb peritectic solder alloy on distinct substrates. Journal of Manufacturing Processes, [S.L.], v. 48, p. 164-173, dez. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1526612519303706?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jmapro.2019.10.029
dc.identifier.uri.fl_str_mv https://repositorio.ufrn.br/handle/123456789/32177
dc.identifier.issn.none.fl_str_mv 1526-6125
dc.identifier.doi.none.fl_str_mv 10.1016/j.jmapro.2019.10.029
identifier_str_mv CURTULO, Joanisa P.; DIAS, Marcelino; BERTELLI, Felipe; SILVA, Bismarck L.; SPINELLI, José E.; GARCIA, Amauri; CHEUNG, Noé. The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a sn-sb peritectic solder alloy on distinct substrates. Journal of Manufacturing Processes, [S.L.], v. 48, p. 164-173, dez. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1526612519303706?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jmapro.2019.10.029
1526-6125
10.1016/j.jmapro.2019.10.029
url https://repositorio.ufrn.br/handle/123456789/32177
dc.language.iso.fl_str_mv eng
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dc.rights.driver.fl_str_mv Attribution 3.0 Brazil
http://creativecommons.org/licenses/by/3.0/br/
info:eu-repo/semantics/openAccess
rights_invalid_str_mv Attribution 3.0 Brazil
http://creativecommons.org/licenses/by/3.0/br/
eu_rights_str_mv openAccess
dc.publisher.none.fl_str_mv Elsevier
publisher.none.fl_str_mv Elsevier
dc.source.none.fl_str_mv reponame:Repositório Institucional da UFRN
instname:Universidade Federal do Rio Grande do Norte (UFRN)
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