GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNING

Detalhes bibliográficos
Autor(a) principal: Rossi, Vera Lucia
Data de Publicação: 2008
Outros Autores: Amarante, Cassandro Vidal Talamini do, Fleig, Frederico Dimas
Tipo de documento: Artigo
Idioma: por
Título da fonte: Ciência Florestal (Online)
Texto Completo: https://periodicos.ufsm.br/cienciaflorestal/article/view/427
Resumo: This work was carried out to study the effects of roots pruning with cupper sulphate, cupper oxychlorate and ethephon (2-cloroethtlphosphonic acid) on growth and quality of Pinus taeda L. seedlings produced in tubes. The treatments with cupper sulphate or cupper oxychlorate were applied on the tubes (before their filling with the substrate for plantation), by immersing them into a mixture of equal parts of water and latex paint, at cupper doses of 0, 12, 24, 36, and 48g L-1 of solution (paint + water). The ethefon was sprayed to the aerial part of seedlings (10-15cm height) at 0, 50, 75, 100, and 125 mg (a.i.) L-1. The experiment followed a completely randomized block design with five replicates. Considering the cupper sources, only cupper sulphate reduced the attributes of root dry matter (mainly by inhibiting the development of lateral roots), collar diameter, seedlings height, and aerial dry matter, with the increase of product dose. The increment of cupper sulphate doses resulted in a higher increase of copper concentration in the substrate than the increase of cupper oxychlorate doses. The increment of cupper oxychlorate doses did not reduce the total root dry matter, but increased the number of lateral roots at the median and higher portion of the root system. Cupper sulphate significantly reduced the emission of lateral roots, as opposed to the effect of cupper oxychlorate. Therefore, the use of increasing doses of cupper oxychlorate seems to show a more positive effect on root pruning, compared to cupper sulphate, since a seedling with a large number of lateral roots of small length is desirable aiming the seedling establishment after transplantation. The increase of ethefon dose sprayed at seedlings aerial part increased the principal root dry matter and the number of later roots at the median (linear effect) and lower (quadratic effect) parts of root system. There was no effect of ethefon on the other seedling growth attributes.
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spelling GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNINGCrescimento e qualidade de mudas de Pinus taeda L. submetidas à poda química de raízes.root growthseedling morphologycupper2-chloroethylphosphonic acid.crescimento radicularmorfologia de mudacobreácido 2-cloroetilfosfônico.This work was carried out to study the effects of roots pruning with cupper sulphate, cupper oxychlorate and ethephon (2-cloroethtlphosphonic acid) on growth and quality of Pinus taeda L. seedlings produced in tubes. The treatments with cupper sulphate or cupper oxychlorate were applied on the tubes (before their filling with the substrate for plantation), by immersing them into a mixture of equal parts of water and latex paint, at cupper doses of 0, 12, 24, 36, and 48g L-1 of solution (paint + water). The ethefon was sprayed to the aerial part of seedlings (10-15cm height) at 0, 50, 75, 100, and 125 mg (a.i.) L-1. The experiment followed a completely randomized block design with five replicates. Considering the cupper sources, only cupper sulphate reduced the attributes of root dry matter (mainly by inhibiting the development of lateral roots), collar diameter, seedlings height, and aerial dry matter, with the increase of product dose. The increment of cupper sulphate doses resulted in a higher increase of copper concentration in the substrate than the increase of cupper oxychlorate doses. The increment of cupper oxychlorate doses did not reduce the total root dry matter, but increased the number of lateral roots at the median and higher portion of the root system. Cupper sulphate significantly reduced the emission of lateral roots, as opposed to the effect of cupper oxychlorate. Therefore, the use of increasing doses of cupper oxychlorate seems to show a more positive effect on root pruning, compared to cupper sulphate, since a seedling with a large number of lateral roots of small length is desirable aiming the seedling establishment after transplantation. The increase of ethefon dose sprayed at seedlings aerial part increased the principal root dry matter and the number of later roots at the median (linear effect) and lower (quadratic effect) parts of root system. There was no effect of ethefon on the other seedling growth attributes. O presente trabalho teve como objetivo avaliar os efeitos da poda química de raízes com sulfato de cobre, oxicloreto de cobre e ethefon (ácido 2-cloroetilfosfônico) sobre o crescimento e qualidade de mudas de Pinus taeda L. produzidas em tubetes. Os tratamentos à base de sulfato de cobre ou oxicloreto de cobre foram feitos nos tubetes (antes da sua utilização para preenchimento com substrato e semeadura), por meio da sua imersão em uma mistura de partes iguais de água e tinta látex comum, contendo 0, 12, 24, 36 e 48g de cobre L-1 de solução (tinta + água). O ethefon foi aplicado via aérea em mudas com 10-15cm de altura nas concentrações de 0, 50, 75, 100 e 125 mg (i.a.) L-1. Foi utilizado o delineamento em blocos ao acaso com cinco repetições. Considerando as fontes de cobre testadas, apenas o sulfato de cobre ocasionou redução significativa na massa seca total do sistema radicular, pela inibição do desenvolvimento de raízes secundárias, bem como no diâmetro do colo e na altura e massa secada parte aérea, com o aumento da dose aplicada. O incremento nas doses de sulfato de cobre ocasionou aumento maior na concentração de cobre presente no substrato em relação ao oxicloreto de cobre. O incremento nas doses de oxicloreto de cobre não causou redução na massa seca total do sistema radicular, mas promoveu aumento no número de raízes secundárias, concentradas especialmente nas porções mediana e superior do sistema radicular. O sulfato de cobre reduziu a emissão de raízes laterais, o mesmo fato não ocorrendo com o oxicloreto de cobre. Dessa forma, o incremento nas doses de oxicloreto de cobre parece apresentar efeito positivo em relação ao sulfato de cobre, já que um sistema radicular com maior número de raízes secundárias curtas é desejável visando estabelecimento das mudas a campo. O incremento nas doses de ethefon pulverizado na parte aérea das mudas ocasionou aumento significativo no acúmulo de massa seca de raiz primária e no número de raízes secundárias presentes nas porções mediana (efeito linear) e inferior (efeito quadrático) do sistema radicular. Não houve efeito de dose do ethefon sobre os demais atributos de crescimento analisados.Universidade Federal de Santa Maria2008-12-30info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionapplication/pdfhttps://periodicos.ufsm.br/cienciaflorestal/article/view/42710.5902/19805098427Ciência Florestal; Vol. 18 No. 4 (2008); 435-442Ciência Florestal; v. 18 n. 4 (2008); 435-4421980-50980103-9954reponame:Ciência Florestal (Online)instname:Universidade Federal de Santa Maria (UFSM)instacron:UFSMporhttps://periodicos.ufsm.br/cienciaflorestal/article/view/427/303Rossi, Vera LuciaAmarante, Cassandro Vidal Talamini doFleig, Frederico Dimasinfo:eu-repo/semantics/openAccess2017-05-09T12:01:33Zoai:ojs.pkp.sfu.ca:article/427Revistahttp://www.ufsm.br/cienciaflorestal/ONGhttps://old.scielo.br/oai/scielo-oai.php||cienciaflorestal@ufsm.br|| cienciaflorestal@gmail.com|| cf@smail.ufsm.br1980-50980103-9954opendoar:2017-05-09T12:01:33Ciência Florestal (Online) - Universidade Federal de Santa Maria (UFSM)false
dc.title.none.fl_str_mv GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNING
Crescimento e qualidade de mudas de Pinus taeda L. submetidas à poda química de raízes.
title GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNING
spellingShingle GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNING
Rossi, Vera Lucia
root growth
seedling morphology
cupper
2-chloroethylphosphonic acid.
crescimento radicular
morfologia de muda
cobre
ácido 2-cloroetilfosfônico.
title_short GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNING
title_full GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNING
title_fullStr GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNING
title_full_unstemmed GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNING
title_sort GROWTH AND QUALITY OF Pinus taeda. L. SEEDLINGS SUBMITTED TO CHEMICAL ROOT PRUNING
author Rossi, Vera Lucia
author_facet Rossi, Vera Lucia
Amarante, Cassandro Vidal Talamini do
Fleig, Frederico Dimas
author_role author
author2 Amarante, Cassandro Vidal Talamini do
Fleig, Frederico Dimas
author2_role author
author
dc.contributor.author.fl_str_mv Rossi, Vera Lucia
Amarante, Cassandro Vidal Talamini do
Fleig, Frederico Dimas
dc.subject.por.fl_str_mv root growth
seedling morphology
cupper
2-chloroethylphosphonic acid.
crescimento radicular
morfologia de muda
cobre
ácido 2-cloroetilfosfônico.
topic root growth
seedling morphology
cupper
2-chloroethylphosphonic acid.
crescimento radicular
morfologia de muda
cobre
ácido 2-cloroetilfosfônico.
description This work was carried out to study the effects of roots pruning with cupper sulphate, cupper oxychlorate and ethephon (2-cloroethtlphosphonic acid) on growth and quality of Pinus taeda L. seedlings produced in tubes. The treatments with cupper sulphate or cupper oxychlorate were applied on the tubes (before their filling with the substrate for plantation), by immersing them into a mixture of equal parts of water and latex paint, at cupper doses of 0, 12, 24, 36, and 48g L-1 of solution (paint + water). The ethefon was sprayed to the aerial part of seedlings (10-15cm height) at 0, 50, 75, 100, and 125 mg (a.i.) L-1. The experiment followed a completely randomized block design with five replicates. Considering the cupper sources, only cupper sulphate reduced the attributes of root dry matter (mainly by inhibiting the development of lateral roots), collar diameter, seedlings height, and aerial dry matter, with the increase of product dose. The increment of cupper sulphate doses resulted in a higher increase of copper concentration in the substrate than the increase of cupper oxychlorate doses. The increment of cupper oxychlorate doses did not reduce the total root dry matter, but increased the number of lateral roots at the median and higher portion of the root system. Cupper sulphate significantly reduced the emission of lateral roots, as opposed to the effect of cupper oxychlorate. Therefore, the use of increasing doses of cupper oxychlorate seems to show a more positive effect on root pruning, compared to cupper sulphate, since a seedling with a large number of lateral roots of small length is desirable aiming the seedling establishment after transplantation. The increase of ethefon dose sprayed at seedlings aerial part increased the principal root dry matter and the number of later roots at the median (linear effect) and lower (quadratic effect) parts of root system. There was no effect of ethefon on the other seedling growth attributes.
publishDate 2008
dc.date.none.fl_str_mv 2008-12-30
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
info:eu-repo/semantics/publishedVersion
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv https://periodicos.ufsm.br/cienciaflorestal/article/view/427
10.5902/19805098427
url https://periodicos.ufsm.br/cienciaflorestal/article/view/427
identifier_str_mv 10.5902/19805098427
dc.language.iso.fl_str_mv por
language por
dc.relation.none.fl_str_mv https://periodicos.ufsm.br/cienciaflorestal/article/view/427/303
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv Universidade Federal de Santa Maria
publisher.none.fl_str_mv Universidade Federal de Santa Maria
dc.source.none.fl_str_mv Ciência Florestal; Vol. 18 No. 4 (2008); 435-442
Ciência Florestal; v. 18 n. 4 (2008); 435-442
1980-5098
0103-9954
reponame:Ciência Florestal (Online)
instname:Universidade Federal de Santa Maria (UFSM)
instacron:UFSM
instname_str Universidade Federal de Santa Maria (UFSM)
instacron_str UFSM
institution UFSM
reponame_str Ciência Florestal (Online)
collection Ciência Florestal (Online)
repository.name.fl_str_mv Ciência Florestal (Online) - Universidade Federal de Santa Maria (UFSM)
repository.mail.fl_str_mv ||cienciaflorestal@ufsm.br|| cienciaflorestal@gmail.com|| cf@smail.ufsm.br
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