Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring

Detalhes bibliográficos
Autor(a) principal: Lopes, Thiago Glissoi [UNESP]
Data de Publicação: 2019
Outros Autores: Rocha, Renata Maia [UNESP], Aguiar, Paulo Roberto De [UNESP], Alexandre, Felipe Aparecido [UNESP], Conceicao, Pedro De Oliveira [UNESP], Viera, Martin Antonio Aulestia [UNESP], Franca, Thiago Valle [UNESP]
Tipo de documento: Artigo de conferência
Idioma: spa
Título da fonte: Repositório Institucional da UNESP
Texto Completo: http://dx.doi.org/10.1109/IESTEC46403.2019.00103
http://hdl.handle.net/11449/201483
Resumo: The pencil lead break method (PLB) is widely used on account of its efficiency in the characterization of acoustic emission sensors (AE), which are used in the monitoring of structures. The piezoelectric diaphragm (PZT) has been studied in recent years as an alternative to conventional AE sensors. The present work aims to study the influence of temperature on the piezoelectric diaphragm response for the monitoring of the 3D printing process. Fifteen PLB tests were performed on the glass surface of a 3D printer at three different temperatures. The results demonstrate that the frequency response of the sensor is directly influenced by the temperature variations. When comparing the frequency response of the signals obtained at different temperatures, it was possible to identify frequency bands that were not altered by the temperature variations. Thus, based on the results of this study, the 3D printing process can be monitored through the PZT diaphragm signals, along with the application of digital filters and signal processing.
id UNSP_30a8358ea67ed98d0ea6eee3da783f66
oai_identifier_str oai:repositorio.unesp.br:11449/201483
network_acronym_str UNSP
network_name_str Repositório Institucional da UNESP
repository_id_str 2946
spelling Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring3D printingPencil lead break methodProcess monitoringTemperatureThe pencil lead break method (PLB) is widely used on account of its efficiency in the characterization of acoustic emission sensors (AE), which are used in the monitoring of structures. The piezoelectric diaphragm (PZT) has been studied in recent years as an alternative to conventional AE sensors. The present work aims to study the influence of temperature on the piezoelectric diaphragm response for the monitoring of the 3D printing process. Fifteen PLB tests were performed on the glass surface of a 3D printer at three different temperatures. The results demonstrate that the frequency response of the sensor is directly influenced by the temperature variations. When comparing the frequency response of the signals obtained at different temperatures, it was possible to identify frequency bands that were not altered by the temperature variations. Thus, based on the results of this study, the 3D printing process can be monitored through the PZT diaphragm signals, along with the application of digital filters and signal processing.Department of Electrical Engineering São Paulo State University - UNESPDepartment of Electrical Engineering São Paulo State University - UNESPUniversidade Estadual Paulista (Unesp)Lopes, Thiago Glissoi [UNESP]Rocha, Renata Maia [UNESP]Aguiar, Paulo Roberto De [UNESP]Alexandre, Felipe Aparecido [UNESP]Conceicao, Pedro De Oliveira [UNESP]Viera, Martin Antonio Aulestia [UNESP]Franca, Thiago Valle [UNESP]2020-12-12T02:33:38Z2020-12-12T02:33:38Z2019-10-01info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/conferenceObject544-549http://dx.doi.org/10.1109/IESTEC46403.2019.00103Proceedings - 2019 7th International Engineering, Sciences and Technology Conference, IESTEC 2019, p. 544-549.http://hdl.handle.net/11449/20148310.1109/IESTEC46403.2019.001032-s2.0-85078209932Scopusreponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPspaProceedings - 2019 7th International Engineering, Sciences and Technology Conference, IESTEC 2019info:eu-repo/semantics/openAccess2024-06-28T13:34:35Zoai:repositorio.unesp.br:11449/201483Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462024-08-05T14:06:30.752300Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false
dc.title.none.fl_str_mv Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring
title Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring
spellingShingle Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring
Lopes, Thiago Glissoi [UNESP]
3D printing
Pencil lead break method
Process monitoring
Temperature
title_short Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring
title_full Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring
title_fullStr Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring
title_full_unstemmed Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring
title_sort Study of the influence of temperature on low-cost piezoelectric transducer response for 3d printing process monitoring
author Lopes, Thiago Glissoi [UNESP]
author_facet Lopes, Thiago Glissoi [UNESP]
Rocha, Renata Maia [UNESP]
Aguiar, Paulo Roberto De [UNESP]
Alexandre, Felipe Aparecido [UNESP]
Conceicao, Pedro De Oliveira [UNESP]
Viera, Martin Antonio Aulestia [UNESP]
Franca, Thiago Valle [UNESP]
author_role author
author2 Rocha, Renata Maia [UNESP]
Aguiar, Paulo Roberto De [UNESP]
Alexandre, Felipe Aparecido [UNESP]
Conceicao, Pedro De Oliveira [UNESP]
Viera, Martin Antonio Aulestia [UNESP]
Franca, Thiago Valle [UNESP]
author2_role author
author
author
author
author
author
dc.contributor.none.fl_str_mv Universidade Estadual Paulista (Unesp)
dc.contributor.author.fl_str_mv Lopes, Thiago Glissoi [UNESP]
Rocha, Renata Maia [UNESP]
Aguiar, Paulo Roberto De [UNESP]
Alexandre, Felipe Aparecido [UNESP]
Conceicao, Pedro De Oliveira [UNESP]
Viera, Martin Antonio Aulestia [UNESP]
Franca, Thiago Valle [UNESP]
dc.subject.por.fl_str_mv 3D printing
Pencil lead break method
Process monitoring
Temperature
topic 3D printing
Pencil lead break method
Process monitoring
Temperature
description The pencil lead break method (PLB) is widely used on account of its efficiency in the characterization of acoustic emission sensors (AE), which are used in the monitoring of structures. The piezoelectric diaphragm (PZT) has been studied in recent years as an alternative to conventional AE sensors. The present work aims to study the influence of temperature on the piezoelectric diaphragm response for the monitoring of the 3D printing process. Fifteen PLB tests were performed on the glass surface of a 3D printer at three different temperatures. The results demonstrate that the frequency response of the sensor is directly influenced by the temperature variations. When comparing the frequency response of the signals obtained at different temperatures, it was possible to identify frequency bands that were not altered by the temperature variations. Thus, based on the results of this study, the 3D printing process can be monitored through the PZT diaphragm signals, along with the application of digital filters and signal processing.
publishDate 2019
dc.date.none.fl_str_mv 2019-10-01
2020-12-12T02:33:38Z
2020-12-12T02:33:38Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/conferenceObject
format conferenceObject
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://dx.doi.org/10.1109/IESTEC46403.2019.00103
Proceedings - 2019 7th International Engineering, Sciences and Technology Conference, IESTEC 2019, p. 544-549.
http://hdl.handle.net/11449/201483
10.1109/IESTEC46403.2019.00103
2-s2.0-85078209932
url http://dx.doi.org/10.1109/IESTEC46403.2019.00103
http://hdl.handle.net/11449/201483
identifier_str_mv Proceedings - 2019 7th International Engineering, Sciences and Technology Conference, IESTEC 2019, p. 544-549.
10.1109/IESTEC46403.2019.00103
2-s2.0-85078209932
dc.language.iso.fl_str_mv spa
language spa
dc.relation.none.fl_str_mv Proceedings - 2019 7th International Engineering, Sciences and Technology Conference, IESTEC 2019
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv 544-549
dc.source.none.fl_str_mv Scopus
reponame:Repositório Institucional da UNESP
instname:Universidade Estadual Paulista (UNESP)
instacron:UNESP
instname_str Universidade Estadual Paulista (UNESP)
instacron_str UNESP
institution UNESP
reponame_str Repositório Institucional da UNESP
collection Repositório Institucional da UNESP
repository.name.fl_str_mv Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)
repository.mail.fl_str_mv
_version_ 1808128317094625280