Piezoelectric composite film for acoustic emission detection

• Autor(a) principal: Sakamoto, Walter Katsumi [UNESP]
• Data de Publicação: 2009
• Outros Autores: Higuti, Ricardo Tokio [UNESP], Tiago, Marcelo Moreira [UNESP]
• Tipo de documento: Artigo de conferência
• Idioma: eng
• Título da fonte: Repositório Institucional da UNESP
• Texto Completo: http://dx.doi.org/10.1109/ULTSYM.2009.5441422; http://hdl.handle.net/11449/71303
• topic: Acoustic emission detection; Constituent phasis; Conventional materials; Dense ceramics; Low density; Material property; Multiphase materials; Non destructive; Non destructive evaluation; Piezoelectric composite; Piezoelectric property; Polymeric matrices; Sensing material; Technological advances; Transient elastic waves; Acoustic emissions; Ceramic materials; Composite films; Composite micromechanics; Cracks; Elastic waves; Impact resistance; Materials properties; Piezoelectricity; Polymers; Ultrasonics; Polymer matrix composites

The continuous technological advances require materials with properties that conventional material cannot display. Material property combinations are being the focus to the development of composite materials, which are considered a multiphase material that exhibits properties of the constituent phases. One interesting material to be studied as sensing material is the composite made of ferroelectric ceramic and polymeric matrix as a two-phases composite material. In that case, the combinations properties intended are the high piezo and pyroelectric activities of the dense ceramic with the impact resistance, flexibility, formability and low densities of the polymer. Using the piezoelectric property of the composite film, it can be used to detect acoustic emission (AE), which is a transient elastic wave generated by sudden deformation in materials under stress. AE can be applied for evaluating the health of structures in a nondestructive way and without any lapse of time. The preliminary result indicates that the composite Pz34/PEEK can be used as sensing material for nondestructive evaluation. ©2009 IEEE.