Microleakage at the composite-repair interface: effect of different adhesive systems

• Autor(a) principal: Cavalcanti,Andrea Nóbrega
• Data de Publicação: 2004
• Outros Autores: Lavigne,Catarina, Fontes,Céres Mendonça, Mathias,Paula
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Journal of applied oral science (Online)
• Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1678-77572004000300011
• topic: Repair; Composite resin; Microleakage

The purpose of the present study was to evaluate the microleakage at the composite-repair interface using different bonding systems. Composite resin specimens (Filtek Z250 - 3M-ESPE) were divided into five groups (n=20) according to the following bonding mechanism: C - control - etching with 35% phosphoric acid; SB1 - etching and application of one coat of Single Bond (3M-ESPE); SB2 - etching and application of two coats of Single Bond (3M-ESPE); SMP1 - etching, application of Scotchbond Multi-Purpose primer (3M-ESPE) followed by the adhesive and, SMP2 - etching, application of Scotchbond Multi-Purpose adhesive (3M-ESPE) without the primer. Thereafter, all groups received new resin application. Samples were thermocycled (500 cycles / 5ºC - 55ºC [±2]) and immersed for 4h in 2% methylene blue buffered dye solution (7.0 pH). Three examiners measured the extent of microleakage in a stereoscope microscope, using four representative scores. For all experimental groups, no significant difference in microleakage at the repair was identified by Kruskal-Wallis test (p > 0.05). Therefore, different types of bonding systems presented the same effect on the dye penetration along the repair interface.