Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems

Detalhes bibliográficos
Autor(a) principal: CHIMELI,Talita Baumgratz Cachapuz
Data de Publicação: 2014
Outros Autores: D'ALPINO,Paulo Henrique Perlatti, PEREIRA,Patrícia Nóbrega, HILGERT,Leandro Augusto, DI HIPÓLITO,Vinicius, GARCIA,Fernanda Cristina Pimentel
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Journal of applied oral science (Online)
Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1678-77572014000400294
Resumo: Objective: To evaluate the influence of solvent evaporation in the kinetics of water diffusion (water sorption-WS, solubility-SL, and net water uptake) and nanoleakage of adhesive systems. Material and Methods: Disk-shaped specimens (5.0 mm in diameter x 0.8 mm in thickness) were produced (N=48) using the adhesives: Clearfil S3 Bond (CS3)/Kuraray, Clearfil SE Bond - control group (CSE)/Kuraray, Optibond Solo Plus (OS)/Kerr and Scotchbond Universal Adhesive (SBU)/3M ESPE. The solvents were either evaporated for 30 s or not evaporated (N=24/per group), and then photoactivated for 80 s (550 mW/cm2). After desiccation, the specimens were weighed and stored in distilled water (N=12) or mineral oil (N=12) to evaluate the water diffusion over a 7-day period. Net water uptake (%) was also calculated as the sum of WS and SL. Data were submitted to 3-way ANOVA/Tukey's test (α=5%). The nanoleakage expression in three additional specimens per group was also evaluated after ammoniacal silver impregnation after 7 days of water storage under SEM. Results: Statistical analysis revealed that only the factor "adhesive" was significant (p<0.05). Solvent evaporation had no influence in the WS and SL of the adhesives. CSE (control) presented significantly lower net uptake (5.4%). The nanoleakage was enhanced by the presence of solvent in the adhesives. Conclusions: Although the evaporation has no effect in the kinetics of water diffusion, the nanoleakage expression of the adhesives tested increases when the solvents are not evaporated.
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spelling Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systemsDentin-bonding agentsSolventsSolubilityLeakage Objective: To evaluate the influence of solvent evaporation in the kinetics of water diffusion (water sorption-WS, solubility-SL, and net water uptake) and nanoleakage of adhesive systems. Material and Methods: Disk-shaped specimens (5.0 mm in diameter x 0.8 mm in thickness) were produced (N=48) using the adhesives: Clearfil S3 Bond (CS3)/Kuraray, Clearfil SE Bond - control group (CSE)/Kuraray, Optibond Solo Plus (OS)/Kerr and Scotchbond Universal Adhesive (SBU)/3M ESPE. The solvents were either evaporated for 30 s or not evaporated (N=24/per group), and then photoactivated for 80 s (550 mW/cm2). After desiccation, the specimens were weighed and stored in distilled water (N=12) or mineral oil (N=12) to evaluate the water diffusion over a 7-day period. Net water uptake (%) was also calculated as the sum of WS and SL. Data were submitted to 3-way ANOVA/Tukey's test (α=5%). The nanoleakage expression in three additional specimens per group was also evaluated after ammoniacal silver impregnation after 7 days of water storage under SEM. Results: Statistical analysis revealed that only the factor "adhesive" was significant (p<0.05). Solvent evaporation had no influence in the WS and SL of the adhesives. CSE (control) presented significantly lower net uptake (5.4%). The nanoleakage was enhanced by the presence of solvent in the adhesives. Conclusions: Although the evaporation has no effect in the kinetics of water diffusion, the nanoleakage expression of the adhesives tested increases when the solvents are not evaporated. Faculdade De Odontologia De Bauru - USP2014-08-01info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersiontext/htmlhttp://old.scielo.br/scielo.php?script=sci_arttext&pid=S1678-77572014000400294Journal of Applied Oral Science v.22 n.4 2014reponame:Journal of applied oral science (Online)instname:Universidade de São Paulo (USP)instacron:USP10.1590/1678-775720130653info:eu-repo/semantics/openAccessCHIMELI,Talita Baumgratz CachapuzD'ALPINO,Paulo Henrique PerlattiPEREIRA,Patrícia NóbregaHILGERT,Leandro AugustoDI HIPÓLITO,ViniciusGARCIA,Fernanda Cristina Pimenteleng2014-08-22T00:00:00Zoai:scielo:S1678-77572014000400294Revistahttp://www.scielo.br/jaosPUBhttps://old.scielo.br/oai/scielo-oai.php||jaos@usp.br1678-77651678-7757opendoar:2014-08-22T00:00Journal of applied oral science (Online) - Universidade de São Paulo (USP)false
dc.title.none.fl_str_mv Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems
title Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems
spellingShingle Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems
CHIMELI,Talita Baumgratz Cachapuz
Dentin-bonding agents
Solvents
Solubility
Leakage
title_short Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems
title_full Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems
title_fullStr Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems
title_full_unstemmed Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems
title_sort Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems
author CHIMELI,Talita Baumgratz Cachapuz
author_facet CHIMELI,Talita Baumgratz Cachapuz
D'ALPINO,Paulo Henrique Perlatti
PEREIRA,Patrícia Nóbrega
HILGERT,Leandro Augusto
DI HIPÓLITO,Vinicius
GARCIA,Fernanda Cristina Pimentel
author_role author
author2 D'ALPINO,Paulo Henrique Perlatti
PEREIRA,Patrícia Nóbrega
HILGERT,Leandro Augusto
DI HIPÓLITO,Vinicius
GARCIA,Fernanda Cristina Pimentel
author2_role author
author
author
author
author
dc.contributor.author.fl_str_mv CHIMELI,Talita Baumgratz Cachapuz
D'ALPINO,Paulo Henrique Perlatti
PEREIRA,Patrícia Nóbrega
HILGERT,Leandro Augusto
DI HIPÓLITO,Vinicius
GARCIA,Fernanda Cristina Pimentel
dc.subject.por.fl_str_mv Dentin-bonding agents
Solvents
Solubility
Leakage
topic Dentin-bonding agents
Solvents
Solubility
Leakage
description Objective: To evaluate the influence of solvent evaporation in the kinetics of water diffusion (water sorption-WS, solubility-SL, and net water uptake) and nanoleakage of adhesive systems. Material and Methods: Disk-shaped specimens (5.0 mm in diameter x 0.8 mm in thickness) were produced (N=48) using the adhesives: Clearfil S3 Bond (CS3)/Kuraray, Clearfil SE Bond - control group (CSE)/Kuraray, Optibond Solo Plus (OS)/Kerr and Scotchbond Universal Adhesive (SBU)/3M ESPE. The solvents were either evaporated for 30 s or not evaporated (N=24/per group), and then photoactivated for 80 s (550 mW/cm2). After desiccation, the specimens were weighed and stored in distilled water (N=12) or mineral oil (N=12) to evaluate the water diffusion over a 7-day period. Net water uptake (%) was also calculated as the sum of WS and SL. Data were submitted to 3-way ANOVA/Tukey's test (α=5%). The nanoleakage expression in three additional specimens per group was also evaluated after ammoniacal silver impregnation after 7 days of water storage under SEM. Results: Statistical analysis revealed that only the factor "adhesive" was significant (p<0.05). Solvent evaporation had no influence in the WS and SL of the adhesives. CSE (control) presented significantly lower net uptake (5.4%). The nanoleakage was enhanced by the presence of solvent in the adhesives. Conclusions: Although the evaporation has no effect in the kinetics of water diffusion, the nanoleakage expression of the adhesives tested increases when the solvents are not evaporated.
publishDate 2014
dc.date.none.fl_str_mv 2014-08-01
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1678-77572014000400294
url http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1678-77572014000400294
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv 10.1590/1678-775720130653
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv text/html
dc.publisher.none.fl_str_mv Faculdade De Odontologia De Bauru - USP
publisher.none.fl_str_mv Faculdade De Odontologia De Bauru - USP
dc.source.none.fl_str_mv Journal of Applied Oral Science v.22 n.4 2014
reponame:Journal of applied oral science (Online)
instname:Universidade de São Paulo (USP)
instacron:USP
instname_str Universidade de São Paulo (USP)
instacron_str USP
institution USP
reponame_str Journal of applied oral science (Online)
collection Journal of applied oral science (Online)
repository.name.fl_str_mv Journal of applied oral science (Online) - Universidade de São Paulo (USP)
repository.mail.fl_str_mv ||jaos@usp.br
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