Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate

Detalhes bibliográficos
Autor(a) principal: Silva, Bismarck Luiz
Data de Publicação: 2019
Outros Autores: Garcia, Amauri, Spinelli, José Eduardo
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Repositório Institucional da UFRN
Texto Completo: https://repositorio.ufrn.br/handle/123456789/31679
Resumo: Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn–0.7Cu–(1; 2 and 3Ag) and four Sn–34Bi–(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both θ and cooling rate. An opposite correlation between cooling rate and θ is observed when Sn–34Bi and the Sn–34Bi–0.1Cu alloys are compared
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spelling Silva, Bismarck LuizGarcia, AmauriSpinelli, José Eduardo2021-03-04T15:06:03Z2021-03-04T15:06:03Z2019Silva, B.L.; Garcia, A. ; SPINELLI, J. E. . Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. Journal of Materials Research and Technology-JMR&T, v. 8, p. 1581-1586, 2019. Disponível em: https://www.sciencedirect.com/science/article/pii/S2238785418302254?via%3Dihub. Acesso em: 21 jan. 2021. https://doi.org/10.1016/j.jmrt.2018.06.0162238-7854https://repositorio.ufrn.br/handle/123456789/3167910.1016/j.jmrt.2018.06.016ElsevierAttribution 3.0 Brazilhttp://creativecommons.org/licenses/by/3.0/br/info:eu-repo/semantics/openAccessSolder alloysSolidificationWettabilityThermal analysisWetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rateinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleBased on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn–0.7Cu–(1; 2 and 3Ag) and four Sn–34Bi–(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both θ and cooling rate. An opposite correlation between cooling rate and θ is observed when Sn–34Bi and the Sn–34Bi–0.1Cu alloys are comparedengreponame:Repositório Institucional da UFRNinstname:Universidade Federal do Rio Grande do Norte (UFRN)instacron:UFRNORIGINALWettingBehavior_SILVA_2019 (1).pdfWettingBehavior_SILVA_2019 (1).pdfapplication/pdf1123432https://repositorio.ufrn.br/bitstream/123456789/31679/1/WettingBehavior_SILVA_2019%20%281%29.pdfd1344b26e794e9199a9795a223c1ffe1MD51CC-LICENSElicense_rdflicense_rdfapplication/rdf+xml; charset=utf-8914https://repositorio.ufrn.br/bitstream/123456789/31679/2/license_rdf4d2950bda3d176f570a9f8b328dfbbefMD52LICENSElicense.txtlicense.txttext/plain; charset=utf-81484https://repositorio.ufrn.br/bitstream/123456789/31679/3/license.txte9597aa2854d128fd968be5edc8a28d9MD53TEXTWettingBehavior_SILVA_2019 (1).pdf.txtWettingBehavior_SILVA_2019 (1).pdf.txtExtracted texttext/plain17512https://repositorio.ufrn.br/bitstream/123456789/31679/4/WettingBehavior_SILVA_2019%20%281%29.pdf.txt2c215ccb3d19fa7dc26e5b7f2f699fa8MD54THUMBNAILWettingBehavior_SILVA_2019 (1).pdf.jpgWettingBehavior_SILVA_2019 (1).pdf.jpgGenerated Thumbnailimage/jpeg1796https://repositorio.ufrn.br/bitstream/123456789/31679/5/WettingBehavior_SILVA_2019%20%281%29.pdf.jpg61910d6cb8a86df57a66d3ca0edf37d4MD55123456789/316792021-03-07 05:48:51.65oai:https://repositorio.ufrn.br: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Repositório de PublicaçõesPUBhttp://repositorio.ufrn.br/oai/opendoar:2021-03-07T08:48:51Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)false
dc.title.pt_BR.fl_str_mv Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
spellingShingle Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
Silva, Bismarck Luiz
Solder alloys
Solidification
Wettability
Thermal analysis
title_short Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title_full Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title_fullStr Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title_full_unstemmed Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title_sort Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
author Silva, Bismarck Luiz
author_facet Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
author_role author
author2 Garcia, Amauri
Spinelli, José Eduardo
author2_role author
author
dc.contributor.author.fl_str_mv Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
dc.subject.por.fl_str_mv Solder alloys
Solidification
Wettability
Thermal analysis
topic Solder alloys
Solidification
Wettability
Thermal analysis
description Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn–0.7Cu–(1; 2 and 3Ag) and four Sn–34Bi–(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both θ and cooling rate. An opposite correlation between cooling rate and θ is observed when Sn–34Bi and the Sn–34Bi–0.1Cu alloys are compared
publishDate 2019
dc.date.issued.fl_str_mv 2019
dc.date.accessioned.fl_str_mv 2021-03-04T15:06:03Z
dc.date.available.fl_str_mv 2021-03-04T15:06:03Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.citation.fl_str_mv Silva, B.L.; Garcia, A. ; SPINELLI, J. E. . Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. Journal of Materials Research and Technology-JMR&T, v. 8, p. 1581-1586, 2019. Disponível em: https://www.sciencedirect.com/science/article/pii/S2238785418302254?via%3Dihub. Acesso em: 21 jan. 2021. https://doi.org/10.1016/j.jmrt.2018.06.016
dc.identifier.uri.fl_str_mv https://repositorio.ufrn.br/handle/123456789/31679
dc.identifier.issn.none.fl_str_mv 2238-7854
dc.identifier.doi.none.fl_str_mv 10.1016/j.jmrt.2018.06.016
identifier_str_mv Silva, B.L.; Garcia, A. ; SPINELLI, J. E. . Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. Journal of Materials Research and Technology-JMR&T, v. 8, p. 1581-1586, 2019. Disponível em: https://www.sciencedirect.com/science/article/pii/S2238785418302254?via%3Dihub. Acesso em: 21 jan. 2021. https://doi.org/10.1016/j.jmrt.2018.06.016
2238-7854
10.1016/j.jmrt.2018.06.016
url https://repositorio.ufrn.br/handle/123456789/31679
dc.language.iso.fl_str_mv eng
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dc.rights.driver.fl_str_mv Attribution 3.0 Brazil
http://creativecommons.org/licenses/by/3.0/br/
info:eu-repo/semantics/openAccess
rights_invalid_str_mv Attribution 3.0 Brazil
http://creativecommons.org/licenses/by/3.0/br/
eu_rights_str_mv openAccess
dc.publisher.none.fl_str_mv Elsevier
publisher.none.fl_str_mv Elsevier
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