An alternative thermal approach to evaluate the wettability of solder alloys
Autor(a) principal: | |
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Data de Publicação: | 2016 |
Outros Autores: | , , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UFRN |
Texto Completo: | https://repositorio.ufrn.br/handle/123456789/31887 |
Resumo: | The aim of the work is to propose an alternative method to qualitatively evaluate the wettability of different alloys of a particular alloy system. The technique is based on a thermal approach supported by experimental/theoretical methodologies involving a directional solidification procedure and numerical simulations based on the solution of the inverse heat conduction problem (IHCP). The wettability strongly affects the heat ability to flow across the alloy/substrate interface during solidification, which is construed as a heat transfer coefficient (hg). Particularly, for the alloys used in soldering processes, the wettability plays an important role in the integrity of solder junctions, being a fundamental parameter for selecting the most appropriate solder composition. The experiments were carried out with high temperature Zn-Sn solder alloys (10, 20, 30 and 40 wt%Sn) in a solidification device in which heat is extracted only through a water-cooled steel bottom. Experimental thermal profiles collected during solidification are used as input data to solve the IHCP and determine expressions hg vs. time for each alloy examined, permitting a tendency of wettability to be established. In order to validate the wetting behavior indicated by the hg values, alloy/substrate contact angles (θ) were measured on a steel substrate using a goniometer. It is shown that both hg and θ indicate improvements in wettability with the decrease in the alloy Sn content |
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Santos, Washington Luis ReisSilva, Bismarck LuizBertelli, FelipeSpinelli, José EduardoCheung, NoéGarcia, Amauri2021-03-15T21:09:16Z2021-03-15T21:09:16Z2016-08-25SANTOS, Washington L.R.; SILVA, Bismarck L.; BERTELLI, Felipe; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. An alternative thermal approach to evaluate the wettability of solder alloys. Applied Thermal Engineering, [S.L.], v. 107, p. 431-440, ago. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1359431116310912?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.applthermaleng.2016.06.1771359-4311https://repositorio.ufrn.br/handle/123456789/3188710.1016/j.applthermaleng.2016.06.177ElsevierZn-Sn solder alloysSolidificationWettabilityInterfacial heat transfer coefficientAn alternative thermal approach to evaluate the wettability of solder alloysinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleThe aim of the work is to propose an alternative method to qualitatively evaluate the wettability of different alloys of a particular alloy system. The technique is based on a thermal approach supported by experimental/theoretical methodologies involving a directional solidification procedure and numerical simulations based on the solution of the inverse heat conduction problem (IHCP). The wettability strongly affects the heat ability to flow across the alloy/substrate interface during solidification, which is construed as a heat transfer coefficient (hg). Particularly, for the alloys used in soldering processes, the wettability plays an important role in the integrity of solder junctions, being a fundamental parameter for selecting the most appropriate solder composition. The experiments were carried out with high temperature Zn-Sn solder alloys (10, 20, 30 and 40 wt%Sn) in a solidification device in which heat is extracted only through a water-cooled steel bottom. Experimental thermal profiles collected during solidification are used as input data to solve the IHCP and determine expressions hg vs. time for each alloy examined, permitting a tendency of wettability to be established. In order to validate the wetting behavior indicated by the hg values, alloy/substrate contact angles (θ) were measured on a steel substrate using a goniometer. It is shown that both hg and θ indicate improvements in wettability with the decrease in the alloy Sn contentengreponame:Repositório Institucional da UFRNinstname:Universidade Federal do Rio Grande do Norte (UFRN)instacron:UFRNinfo:eu-repo/semantics/openAccessCC-LICENSElicense_rdflicense_rdfapplication/rdf+xml; charset=utf-8914https://repositorio.ufrn.br/bitstream/123456789/31887/2/license_rdf4d2950bda3d176f570a9f8b328dfbbefMD52LICENSElicense.txtlicense.txttext/plain; charset=utf-81484https://repositorio.ufrn.br/bitstream/123456789/31887/3/license.txte9597aa2854d128fd968be5edc8a28d9MD53TEXTAnAlternativeThermal_SILVA_2016.pdf.txtAnAlternativeThermal_SILVA_2016.pdf.txtExtracted texttext/plain43485https://repositorio.ufrn.br/bitstream/123456789/31887/4/AnAlternativeThermal_SILVA_2016.pdf.txt8f0ac14adcced8e4bb6fd6e39ea2dd2eMD54THUMBNAILAnAlternativeThermal_SILVA_2016.pdf.jpgAnAlternativeThermal_SILVA_2016.pdf.jpgGenerated Thumbnailimage/jpeg1669https://repositorio.ufrn.br/bitstream/123456789/31887/5/AnAlternativeThermal_SILVA_2016.pdf.jpg0cc0d72267b469263e850c3d0d1deda8MD55123456789/318872022-12-15 18:01:50.647oai:https://repositorio.ufrn.br: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Repositório de PublicaçõesPUBhttp://repositorio.ufrn.br/oai/opendoar:2022-12-15T21:01:50Repositório Institucional da UFRN - Universidade Federal do Rio Grande do Norte (UFRN)false |
dc.title.pt_BR.fl_str_mv |
An alternative thermal approach to evaluate the wettability of solder alloys |
title |
An alternative thermal approach to evaluate the wettability of solder alloys |
spellingShingle |
An alternative thermal approach to evaluate the wettability of solder alloys Santos, Washington Luis Reis Zn-Sn solder alloys Solidification Wettability Interfacial heat transfer coefficient |
title_short |
An alternative thermal approach to evaluate the wettability of solder alloys |
title_full |
An alternative thermal approach to evaluate the wettability of solder alloys |
title_fullStr |
An alternative thermal approach to evaluate the wettability of solder alloys |
title_full_unstemmed |
An alternative thermal approach to evaluate the wettability of solder alloys |
title_sort |
An alternative thermal approach to evaluate the wettability of solder alloys |
author |
Santos, Washington Luis Reis |
author_facet |
Santos, Washington Luis Reis Silva, Bismarck Luiz Bertelli, Felipe Spinelli, José Eduardo Cheung, Noé Garcia, Amauri |
author_role |
author |
author2 |
Silva, Bismarck Luiz Bertelli, Felipe Spinelli, José Eduardo Cheung, Noé Garcia, Amauri |
author2_role |
author author author author author |
dc.contributor.author.fl_str_mv |
Santos, Washington Luis Reis Silva, Bismarck Luiz Bertelli, Felipe Spinelli, José Eduardo Cheung, Noé Garcia, Amauri |
dc.subject.por.fl_str_mv |
Zn-Sn solder alloys Solidification Wettability Interfacial heat transfer coefficient |
topic |
Zn-Sn solder alloys Solidification Wettability Interfacial heat transfer coefficient |
description |
The aim of the work is to propose an alternative method to qualitatively evaluate the wettability of different alloys of a particular alloy system. The technique is based on a thermal approach supported by experimental/theoretical methodologies involving a directional solidification procedure and numerical simulations based on the solution of the inverse heat conduction problem (IHCP). The wettability strongly affects the heat ability to flow across the alloy/substrate interface during solidification, which is construed as a heat transfer coefficient (hg). Particularly, for the alloys used in soldering processes, the wettability plays an important role in the integrity of solder junctions, being a fundamental parameter for selecting the most appropriate solder composition. The experiments were carried out with high temperature Zn-Sn solder alloys (10, 20, 30 and 40 wt%Sn) in a solidification device in which heat is extracted only through a water-cooled steel bottom. Experimental thermal profiles collected during solidification are used as input data to solve the IHCP and determine expressions hg vs. time for each alloy examined, permitting a tendency of wettability to be established. In order to validate the wetting behavior indicated by the hg values, alloy/substrate contact angles (θ) were measured on a steel substrate using a goniometer. It is shown that both hg and θ indicate improvements in wettability with the decrease in the alloy Sn content |
publishDate |
2016 |
dc.date.issued.fl_str_mv |
2016-08-25 |
dc.date.accessioned.fl_str_mv |
2021-03-15T21:09:16Z |
dc.date.available.fl_str_mv |
2021-03-15T21:09:16Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.citation.fl_str_mv |
SANTOS, Washington L.R.; SILVA, Bismarck L.; BERTELLI, Felipe; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. An alternative thermal approach to evaluate the wettability of solder alloys. Applied Thermal Engineering, [S.L.], v. 107, p. 431-440, ago. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1359431116310912?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.applthermaleng.2016.06.177 |
dc.identifier.uri.fl_str_mv |
https://repositorio.ufrn.br/handle/123456789/31887 |
dc.identifier.issn.none.fl_str_mv |
1359-4311 |
dc.identifier.doi.none.fl_str_mv |
10.1016/j.applthermaleng.2016.06.177 |
identifier_str_mv |
SANTOS, Washington L.R.; SILVA, Bismarck L.; BERTELLI, Felipe; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. An alternative thermal approach to evaluate the wettability of solder alloys. Applied Thermal Engineering, [S.L.], v. 107, p. 431-440, ago. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1359431116310912?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.applthermaleng.2016.06.177 1359-4311 10.1016/j.applthermaleng.2016.06.177 |
url |
https://repositorio.ufrn.br/handle/123456789/31887 |
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eng |
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eng |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
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openAccess |
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Elsevier |
publisher.none.fl_str_mv |
Elsevier |
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