Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves

Detalhes bibliográficos
Autor(a) principal: Sun,Xuemin
Data de Publicação: 2020
Outros Autores: Yu,Weiyuan, Wu,Baolei, Yang,Guoqing
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Materials research (São Carlos. Online)
Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000100224
Resumo: Ultrasonic-assisted soldering, as a type of new welding method, is widely used in the field of electronic packaging. This research used the immersion method to study the dissolution behavior of copper in liquid tin and the growth of IMC at 513, 543, and 573 K with/without ultrasonic waves. The amount of copper dissolved and IMC layer thickness were measured and the dissolution activation energy of Cu/Sn was calculated. Experimental results indicated that Without ultrasonic waves, the amount of copper dissolved increased nonlinearly with immersion time. However, with ultrasonic waves, the amount of copper dissolved increased linearly with immersion time. The amount of copper dissolved in liquid tin increased considerably with ultrasonic waves, and the dissolution rate increased by 7–8 times. The thickness of the IMC layer decreased as the ultrasonic time and ultrasonic power increased. Meanwhile, the ultrasonic waves reduced the dissolution activation energy of the Sn/Cu system.
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spelling Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic WavesUltrasonic waveDissolution rateActivation energyUltrasonic powerUltrasonic-assisted soldering, as a type of new welding method, is widely used in the field of electronic packaging. This research used the immersion method to study the dissolution behavior of copper in liquid tin and the growth of IMC at 513, 543, and 573 K with/without ultrasonic waves. The amount of copper dissolved and IMC layer thickness were measured and the dissolution activation energy of Cu/Sn was calculated. Experimental results indicated that Without ultrasonic waves, the amount of copper dissolved increased nonlinearly with immersion time. However, with ultrasonic waves, the amount of copper dissolved increased linearly with immersion time. The amount of copper dissolved in liquid tin increased considerably with ultrasonic waves, and the dissolution rate increased by 7–8 times. The thickness of the IMC layer decreased as the ultrasonic time and ultrasonic power increased. Meanwhile, the ultrasonic waves reduced the dissolution activation energy of the Sn/Cu system.ABM, ABC, ABPol2020-01-01info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersiontext/htmlhttp://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000100224Materials Research v.23 n.1 2020reponame:Materials research (São Carlos. Online)instname:Universidade Federal de São Carlos (UFSCAR)instacron:ABM ABC ABPOL10.1590/1980-5373-mr-2019-0392info:eu-repo/semantics/openAccessSun,XueminYu,WeiyuanWu,BaoleiYang,Guoqingeng2020-05-27T00:00:00Zoai:scielo:S1516-14392020000100224Revistahttp://www.scielo.br/mrPUBhttps://old.scielo.br/oai/scielo-oai.phpdedz@power.ufscar.br1980-53731516-1439opendoar:2020-05-27T00:00Materials research (São Carlos. Online) - Universidade Federal de São Carlos (UFSCAR)false
dc.title.none.fl_str_mv Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves
title Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves
spellingShingle Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves
Sun,Xuemin
Ultrasonic wave
Dissolution rate
Activation energy
Ultrasonic power
title_short Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves
title_full Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves
title_fullStr Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves
title_full_unstemmed Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves
title_sort Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves
author Sun,Xuemin
author_facet Sun,Xuemin
Yu,Weiyuan
Wu,Baolei
Yang,Guoqing
author_role author
author2 Yu,Weiyuan
Wu,Baolei
Yang,Guoqing
author2_role author
author
author
dc.contributor.author.fl_str_mv Sun,Xuemin
Yu,Weiyuan
Wu,Baolei
Yang,Guoqing
dc.subject.por.fl_str_mv Ultrasonic wave
Dissolution rate
Activation energy
Ultrasonic power
topic Ultrasonic wave
Dissolution rate
Activation energy
Ultrasonic power
description Ultrasonic-assisted soldering, as a type of new welding method, is widely used in the field of electronic packaging. This research used the immersion method to study the dissolution behavior of copper in liquid tin and the growth of IMC at 513, 543, and 573 K with/without ultrasonic waves. The amount of copper dissolved and IMC layer thickness were measured and the dissolution activation energy of Cu/Sn was calculated. Experimental results indicated that Without ultrasonic waves, the amount of copper dissolved increased nonlinearly with immersion time. However, with ultrasonic waves, the amount of copper dissolved increased linearly with immersion time. The amount of copper dissolved in liquid tin increased considerably with ultrasonic waves, and the dissolution rate increased by 7–8 times. The thickness of the IMC layer decreased as the ultrasonic time and ultrasonic power increased. Meanwhile, the ultrasonic waves reduced the dissolution activation energy of the Sn/Cu system.
publishDate 2020
dc.date.none.fl_str_mv 2020-01-01
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000100224
url http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392020000100224
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv 10.1590/1980-5373-mr-2019-0392
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv text/html
dc.publisher.none.fl_str_mv ABM, ABC, ABPol
publisher.none.fl_str_mv ABM, ABC, ABPol
dc.source.none.fl_str_mv Materials Research v.23 n.1 2020
reponame:Materials research (São Carlos. Online)
instname:Universidade Federal de São Carlos (UFSCAR)
instacron:ABM ABC ABPOL
instname_str Universidade Federal de São Carlos (UFSCAR)
instacron_str ABM ABC ABPOL
institution ABM ABC ABPOL
reponame_str Materials research (São Carlos. Online)
collection Materials research (São Carlos. Online)
repository.name.fl_str_mv Materials research (São Carlos. Online) - Universidade Federal de São Carlos (UFSCAR)
repository.mail.fl_str_mv dedz@power.ufscar.br
_version_ 1754212676914905088

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