Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Detalhes bibliográficos
Autor(a) principal: Silva,Bismarck Luiz
Data de Publicação: 2018
Outros Autores: Spinelli,José Eduardo
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Materials research (São Carlos. Online)
Texto Completo: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392018000202109
Resumo: The microstructure length-scales (dendritic and eutectic), morphologies and tensile properties of a ternary Sn-9wt.%Zn-2wt.%Cu alloy are compared with those of a binary eutectic Sn-9wt.%Zn alloy. The following experimental/analytical steps were performed: transient directional solidification experiments of the Sn-9wt.%Zn-2wt.%Cu alloy; measurements of secondary dendrite arm (λ2) and interphase spacing (λ); morphology of the eutectic α-Zn phase; determination of thermal parameters such as cooling rate (ṪL) and their evolutions during solidification; and, finally, interrelations of microstructure vs. tensile properties. The addition of 2wt.%Cu causes significant refinement of the eutectic structure. Hall-Petch type experimental expressions outlined the variations of strength and ductility with both λ2 and λ. Very fine Zn globules and needles forming the eutectic in the ternary alloy seems to cause a reversal on ductility behavior, as compared to the tendency observed for the binary Sn-9wt.%Zn alloy. Here, for the ternary Sn-9wt.%Zn-2wt.%Cu alloy ductility increases with decreasing interphase spacing.
id ABMABCABPOL-1_c79d7cbfe50f355c5262ca4bcd18d0d8
oai_identifier_str oai:scielo:S1516-14392018000202109
network_acronym_str ABMABCABPOL-1
network_name_str Materials research (São Carlos. Online)
repository_id_str
spelling Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloySn-Zn-CusolidificationmicrostructureThe microstructure length-scales (dendritic and eutectic), morphologies and tensile properties of a ternary Sn-9wt.%Zn-2wt.%Cu alloy are compared with those of a binary eutectic Sn-9wt.%Zn alloy. The following experimental/analytical steps were performed: transient directional solidification experiments of the Sn-9wt.%Zn-2wt.%Cu alloy; measurements of secondary dendrite arm (λ2) and interphase spacing (λ); morphology of the eutectic α-Zn phase; determination of thermal parameters such as cooling rate (ṪL) and their evolutions during solidification; and, finally, interrelations of microstructure vs. tensile properties. The addition of 2wt.%Cu causes significant refinement of the eutectic structure. Hall-Petch type experimental expressions outlined the variations of strength and ductility with both λ2 and λ. Very fine Zn globules and needles forming the eutectic in the ternary alloy seems to cause a reversal on ductility behavior, as compared to the tendency observed for the binary Sn-9wt.%Zn alloy. Here, for the ternary Sn-9wt.%Zn-2wt.%Cu alloy ductility increases with decreasing interphase spacing.ABM, ABC, ABPol2018-01-01info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersiontext/htmlhttp://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392018000202109Materials Research v.21 n.2 2018reponame:Materials research (São Carlos. Online)instname:Universidade Federal de São Carlos (UFSCAR)instacron:ABM ABC ABPOL10.1590/1980-5373-mr-2017-0877info:eu-repo/semantics/openAccessSilva,Bismarck LuizSpinelli,José Eduardoeng2018-05-15T00:00:00Zoai:scielo:S1516-14392018000202109Revistahttp://www.scielo.br/mrPUBhttps://old.scielo.br/oai/scielo-oai.phpdedz@power.ufscar.br1980-53731516-1439opendoar:2018-05-15T00:00Materials research (São Carlos. Online) - Universidade Federal de São Carlos (UFSCAR)false
dc.title.none.fl_str_mv Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy
title Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy
spellingShingle Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy
Silva,Bismarck Luiz
Sn-Zn-Cu
solidification
microstructure
title_short Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy
title_full Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy
title_fullStr Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy
title_full_unstemmed Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy
title_sort Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy
author Silva,Bismarck Luiz
author_facet Silva,Bismarck Luiz
Spinelli,José Eduardo
author_role author
author2 Spinelli,José Eduardo
author2_role author
dc.contributor.author.fl_str_mv Silva,Bismarck Luiz
Spinelli,José Eduardo
dc.subject.por.fl_str_mv Sn-Zn-Cu
solidification
microstructure
topic Sn-Zn-Cu
solidification
microstructure
description The microstructure length-scales (dendritic and eutectic), morphologies and tensile properties of a ternary Sn-9wt.%Zn-2wt.%Cu alloy are compared with those of a binary eutectic Sn-9wt.%Zn alloy. The following experimental/analytical steps were performed: transient directional solidification experiments of the Sn-9wt.%Zn-2wt.%Cu alloy; measurements of secondary dendrite arm (λ2) and interphase spacing (λ); morphology of the eutectic α-Zn phase; determination of thermal parameters such as cooling rate (ṪL) and their evolutions during solidification; and, finally, interrelations of microstructure vs. tensile properties. The addition of 2wt.%Cu causes significant refinement of the eutectic structure. Hall-Petch type experimental expressions outlined the variations of strength and ductility with both λ2 and λ. Very fine Zn globules and needles forming the eutectic in the ternary alloy seems to cause a reversal on ductility behavior, as compared to the tendency observed for the binary Sn-9wt.%Zn alloy. Here, for the ternary Sn-9wt.%Zn-2wt.%Cu alloy ductility increases with decreasing interphase spacing.
publishDate 2018
dc.date.none.fl_str_mv 2018-01-01
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392018000202109
url http://old.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392018000202109
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv 10.1590/1980-5373-mr-2017-0877
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv text/html
dc.publisher.none.fl_str_mv ABM, ABC, ABPol
publisher.none.fl_str_mv ABM, ABC, ABPol
dc.source.none.fl_str_mv Materials Research v.21 n.2 2018
reponame:Materials research (São Carlos. Online)
instname:Universidade Federal de São Carlos (UFSCAR)
instacron:ABM ABC ABPOL
instname_str Universidade Federal de São Carlos (UFSCAR)
instacron_str ABM ABC ABPOL
institution ABM ABC ABPOL
reponame_str Materials research (São Carlos. Online)
collection Materials research (São Carlos. Online)
repository.name.fl_str_mv Materials research (São Carlos. Online) - Universidade Federal de São Carlos (UFSCAR)
repository.mail.fl_str_mv dedz@power.ufscar.br
_version_ 1754212673721991168

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