Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
Autor(a) principal: | |
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Data de Publicação: | 2003 |
Outros Autores: | , , , |
Idioma: | eng |
Título da fonte: | Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
Texto Completo: | http://hdl.handle.net/1822/1618 |
Resumo: | This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed. |
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Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
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Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packagingOn-chip antennaThrough-wafer viasGlass processingLaser ablationThis paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed.Fundação para a Ciência e Tecnologia (FCT) (SFRH/BD/4717/2001, POCTI/ESE/38468/2001, FEDER), and EC (project Blue Whale IST-2000-10036).Universidade do MinhoMendes, P. M.Polyakov, A.Bartek, M.Burghartz, J. N.Correia, J. H.2003-112003-11-01T00:00:00Zconference paperinfo:eu-repo/semantics/publishedVersionapplication/pdfhttp://hdl.handle.net/1822/1618engMME. MICROMECHANICS EUROPE WORKSHOP, 14, Delft, 2003 - "Proceedings". Delft : TUDelft, 2003. ISBN 90-808266-1-8. p. 77-80.90-808266-1-8info:eu-repo/semantics/openAccessreponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãoinstacron:RCAAP2024-05-11T05:45:32Zoai:repositorium.sdum.uminho.pt:1822/1618Portal AgregadorONGhttps://www.rcaap.pt/oai/openairemluisa.alvim@gmail.comopendoar:71602024-05-11T05:45:32Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãofalse |
dc.title.none.fl_str_mv |
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging |
title |
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging |
spellingShingle |
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging Mendes, P. M. On-chip antenna Through-wafer vias Glass processing Laser ablation |
title_short |
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging |
title_full |
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging |
title_fullStr |
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging |
title_full_unstemmed |
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging |
title_sort |
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging |
author |
Mendes, P. M. |
author_facet |
Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
author_role |
author |
author2 |
Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
author2_role |
author author author author |
dc.contributor.none.fl_str_mv |
Universidade do Minho |
dc.contributor.author.fl_str_mv |
Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. |
dc.subject.por.fl_str_mv |
On-chip antenna Through-wafer vias Glass processing Laser ablation |
topic |
On-chip antenna Through-wafer vias Glass processing Laser ablation |
description |
This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed. |
publishDate |
2003 |
dc.date.none.fl_str_mv |
2003-11 2003-11-01T00:00:00Z |
dc.type.driver.fl_str_mv |
conference paper |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://hdl.handle.net/1822/1618 |
url |
http://hdl.handle.net/1822/1618 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
MME. MICROMECHANICS EUROPE WORKSHOP, 14, Delft, 2003 - "Proceedings". Delft : TUDelft, 2003. ISBN 90-808266-1-8. p. 77-80. 90-808266-1-8 |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
application/pdf |
dc.source.none.fl_str_mv |
reponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação instacron:RCAAP |
instname_str |
Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação |
instacron_str |
RCAAP |
institution |
RCAAP |
reponame_str |
Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
collection |
Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
repository.name.fl_str_mv |
Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação |
repository.mail.fl_str_mv |
mluisa.alvim@gmail.com |
_version_ |
1817544729776095232 |