Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging

Detalhes bibliográficos
Autor(a) principal: Mendes, P. M.
Data de Publicação: 2003
Outros Autores: Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Idioma: eng
Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
Texto Completo: http://hdl.handle.net/1822/1618
Resumo: This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed.
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spelling Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packagingOn-chip antennaThrough-wafer viasGlass processingLaser ablationThis paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed.Fundação para a Ciência e Tecnologia (FCT) (SFRH/BD/4717/2001, POCTI/ESE/38468/2001, FEDER), and EC (project Blue Whale IST-2000-10036).Universidade do MinhoMendes, P. M.Polyakov, A.Bartek, M.Burghartz, J. N.Correia, J. H.2003-112003-11-01T00:00:00Zconference paperinfo:eu-repo/semantics/publishedVersionapplication/pdfhttp://hdl.handle.net/1822/1618engMME. MICROMECHANICS EUROPE WORKSHOP, 14, Delft, 2003 - "Proceedings". Delft : TUDelft, 2003. ISBN 90-808266-1-8. p. 77-80.90-808266-1-8info:eu-repo/semantics/openAccessreponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãoinstacron:RCAAP2024-05-11T05:45:32Zoai:repositorium.sdum.uminho.pt:1822/1618Portal AgregadorONGhttps://www.rcaap.pt/oai/openairemluisa.alvim@gmail.comopendoar:71602024-05-11T05:45:32Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãofalse
dc.title.none.fl_str_mv Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
spellingShingle Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
Mendes, P. M.
On-chip antenna
Through-wafer vias
Glass processing
Laser ablation
title_short Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title_full Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title_fullStr Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title_full_unstemmed Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title_sort Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
author Mendes, P. M.
author_facet Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
author_role author
author2 Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
author2_role author
author
author
author
dc.contributor.none.fl_str_mv Universidade do Minho
dc.contributor.author.fl_str_mv Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
dc.subject.por.fl_str_mv On-chip antenna
Through-wafer vias
Glass processing
Laser ablation
topic On-chip antenna
Through-wafer vias
Glass processing
Laser ablation
description This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed.
publishDate 2003
dc.date.none.fl_str_mv 2003-11
2003-11-01T00:00:00Z
dc.type.driver.fl_str_mv conference paper
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://hdl.handle.net/1822/1618
url http://hdl.handle.net/1822/1618
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv MME. MICROMECHANICS EUROPE WORKSHOP, 14, Delft, 2003 - "Proceedings". Delft : TUDelft, 2003. ISBN 90-808266-1-8. p. 77-80.
90-808266-1-8
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.source.none.fl_str_mv reponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
instacron:RCAAP
instname_str Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
instacron_str RCAAP
institution RCAAP
reponame_str Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
collection Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
repository.name.fl_str_mv Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
repository.mail.fl_str_mv mluisa.alvim@gmail.com
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