Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations

• Autor(a) principal: Mendes, P. M.
• Data de Publicação: 2006
• Outros Autores: Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
• Texto Completo: http://hdl.handle.net/1822/5939
• topic: Chip-size antenna; Wireless microsystem; Wafer-level packaging; Excimer laser ablation; Via fabrication; water-level packaging; wireless inicrosystein; Science & Technology

This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved.