New challenges of printed high-к oxide dielectrics
Autor(a) principal: | |
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Data de Publicação: | 2021 |
Outros Autores: | , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
Texto Completo: | http://hdl.handle.net/10362/135513 |
Resumo: | High-permittivity (к) oxide dielectrics have been widely demanded concerning the Internet of Things (IoT) requirements, such as flexible large-area manufacturing, energy efficiency, low-cost processes, and sustainable electronics, especially in thin-film transistors (TFTs). From there emerged the necessity of printing energy-efficient (vacuum-free) eco-devices using low-temperature methods (e.g., combustion synthesis, post-treatments) in the production and processing of nanomaterials, thus reducing the human carbon footprint. However, currently the main deposition method used is typically spin-coating which requires higher temperatures and long annealing times, not compatible with the printing industry. Besides the concerns with process integration, the market highly demands high-к dielectrics with great stability and high yield. To surpass these challenges, some crucial parameters in the ink design need to be considered to guarantee successful upscale for large-area electronics manufacturing. |
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New challenges of printed high-к oxide dielectricsHigh-к oxide dielectricsLarge-scale manufacturingPrinted electronicsScale-up challengesSolution-processedThin film devicesElectronic, Optical and Magnetic MaterialsCondensed Matter PhysicsElectrical and Electronic EngineeringMaterials ChemistrySDG 7 - Affordable and Clean EnergySDG 13 - Climate ActionHigh-permittivity (к) oxide dielectrics have been widely demanded concerning the Internet of Things (IoT) requirements, such as flexible large-area manufacturing, energy efficiency, low-cost processes, and sustainable electronics, especially in thin-film transistors (TFTs). From there emerged the necessity of printing energy-efficient (vacuum-free) eco-devices using low-temperature methods (e.g., combustion synthesis, post-treatments) in the production and processing of nanomaterials, thus reducing the human carbon footprint. However, currently the main deposition method used is typically spin-coating which requires higher temperatures and long annealing times, not compatible with the printing industry. Besides the concerns with process integration, the market highly demands high-к dielectrics with great stability and high yield. To surpass these challenges, some crucial parameters in the ink design need to be considered to guarantee successful upscale for large-area electronics manufacturing.UNINOVA-Instituto de Desenvolvimento de Novas TecnologiasCENIMAT-i3N - Centro de Investigação de Materiais (Lab. Associado I3N)DCM - Departamento de Ciência dos MateriaisRUNCarlos, EmanuelBranquinho, RitaMartins, RodrigoFortunato, Elvira2023-06-11T00:31:55Z2021-092021-09-01T00:00:00Zinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleapplication/pdfhttp://hdl.handle.net/10362/135513eng0038-1101PURE: 32998543https://doi.org/10.1016/j.sse.2021.108044info:eu-repo/semantics/openAccessreponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãoinstacron:RCAAP2024-03-11T05:13:49Zoai:run.unl.pt:10362/135513Portal AgregadorONGhttps://www.rcaap.pt/oai/openaireopendoar:71602024-03-20T03:48:25.243272Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãofalse |
dc.title.none.fl_str_mv |
New challenges of printed high-к oxide dielectrics |
title |
New challenges of printed high-к oxide dielectrics |
spellingShingle |
New challenges of printed high-к oxide dielectrics Carlos, Emanuel High-к oxide dielectrics Large-scale manufacturing Printed electronics Scale-up challenges Solution-processed Thin film devices Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering Materials Chemistry SDG 7 - Affordable and Clean Energy SDG 13 - Climate Action |
title_short |
New challenges of printed high-к oxide dielectrics |
title_full |
New challenges of printed high-к oxide dielectrics |
title_fullStr |
New challenges of printed high-к oxide dielectrics |
title_full_unstemmed |
New challenges of printed high-к oxide dielectrics |
title_sort |
New challenges of printed high-к oxide dielectrics |
author |
Carlos, Emanuel |
author_facet |
Carlos, Emanuel Branquinho, Rita Martins, Rodrigo Fortunato, Elvira |
author_role |
author |
author2 |
Branquinho, Rita Martins, Rodrigo Fortunato, Elvira |
author2_role |
author author author |
dc.contributor.none.fl_str_mv |
UNINOVA-Instituto de Desenvolvimento de Novas Tecnologias CENIMAT-i3N - Centro de Investigação de Materiais (Lab. Associado I3N) DCM - Departamento de Ciência dos Materiais RUN |
dc.contributor.author.fl_str_mv |
Carlos, Emanuel Branquinho, Rita Martins, Rodrigo Fortunato, Elvira |
dc.subject.por.fl_str_mv |
High-к oxide dielectrics Large-scale manufacturing Printed electronics Scale-up challenges Solution-processed Thin film devices Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering Materials Chemistry SDG 7 - Affordable and Clean Energy SDG 13 - Climate Action |
topic |
High-к oxide dielectrics Large-scale manufacturing Printed electronics Scale-up challenges Solution-processed Thin film devices Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering Materials Chemistry SDG 7 - Affordable and Clean Energy SDG 13 - Climate Action |
description |
High-permittivity (к) oxide dielectrics have been widely demanded concerning the Internet of Things (IoT) requirements, such as flexible large-area manufacturing, energy efficiency, low-cost processes, and sustainable electronics, especially in thin-film transistors (TFTs). From there emerged the necessity of printing energy-efficient (vacuum-free) eco-devices using low-temperature methods (e.g., combustion synthesis, post-treatments) in the production and processing of nanomaterials, thus reducing the human carbon footprint. However, currently the main deposition method used is typically spin-coating which requires higher temperatures and long annealing times, not compatible with the printing industry. Besides the concerns with process integration, the market highly demands high-к dielectrics with great stability and high yield. To surpass these challenges, some crucial parameters in the ink design need to be considered to guarantee successful upscale for large-area electronics manufacturing. |
publishDate |
2021 |
dc.date.none.fl_str_mv |
2021-09 2021-09-01T00:00:00Z 2023-06-11T00:31:55Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://hdl.handle.net/10362/135513 |
url |
http://hdl.handle.net/10362/135513 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
0038-1101 PURE: 32998543 https://doi.org/10.1016/j.sse.2021.108044 |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
application/pdf |
dc.source.none.fl_str_mv |
reponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação instacron:RCAAP |
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Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação |
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RCAAP |
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RCAAP |
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Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
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Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
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Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação |
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1799138085491965952 |