Packaging of photonic integrated circuits for PON networks

• Autor(a) principal: Costa, Filipe Almeida
• Data de Publicação: 2018
• Tipo de documento: Dissertação
• Idioma: eng
• Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
• Texto Completo: http://hdl.handle.net/10773/24946
• topic: Electrical packaging; Thermal packaging; Photonic integrated circuit( PIC); Thermal design rules (TDR)

Nowadays, optical communication systems are capable of providing high bit rates. With technological evolution of these systems, it is necessary to study and improve domains like their packaging techniques, such as optical, electrical, thermal, mechanical and chemical packaging. In an early stage of this work, packaging design rules currently used in opto-electronic integrated circuit (OEIC) are listed. Furthermore, thermal dependence of some components placed in a photonic integrated circuit (PIC) is presented. Later on, the electrical packaging is performed which consists of developing a printed circuit board (PCB) for testing a photonic integrated circuit (PIC). The connection between the microscopic optical circuit and the electric circuit is made through wire-bonding technology. This work is finalized with thermal packaging where it is created a list of thermal design rules TDRs containing information about the minimum distance between active components in an optical integrated circuit for not having thermal interference.