3R Electronics: Scalable Fabrication of Resilient, Repairable, and Recyclable Soft-Matter Electronics

• Autor(a) principal: Tavakoli, Mahmoud
• Data de Publicação: 2022
• Outros Autores: Lopes, Pedro Alhais, Hajalilou, Abdollah, Silva, André F., Carneiro, Manuel Reis, Carvalheiro, José, Pereira, João Marques, Almeida, Aníbal T. de
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
• Texto Completo: http://hdl.handle.net/10316/101654; https://doi.org/10.1002/adma.202203266
• topic: biphasic liquid metal; electronic waste; recyclable electronics; soft-matter electronics; wearable biomonitoring; Electrodes; Electronics; Humans; Metals; Polymers; Wearable Electronic Devices

E-waste is rapidly turning into another man-made disaster. It is proposed that a paradigm shift toward a more sustainable future can be made through soft-matter electronics that are resilient, repairable if damaged, and recyclable (3R), provided that they achieve the same level of maturity as industrial electronics. This includes high-resolution patterning, multilayer implementation, microchip integration, and automated fabrication. Herein, a novel architecture of materials and methods for microchip-integrated condensed soft-matter 3R electronics is demonstrated. The 3R function is enabled by a biphasic liquid metal-based composite, a block copolymer with nonpermanent physical crosslinks, and an electrochemical technique for material recycling. In addition, an autonomous laser-patterning method for scalable circuit patterning with an exceptional resolution of <30 µm in seconds is developed. The phase-shifting property of the BCPs is utilized for vapor-assisted "soldering" circuit repairing and recycling. The process is performed entirely at room temperature, thereby opening the door for a wide range of heat-sensitive and biodegradable polymers for the next generation of green electronics. The implementation and recycling of sophisticated skin-mounted patches with embedded sensors, electrodes, antennas, and microchips that build a digital fingerprint of the human electrophysiological signals is demonstrated by collecting mechanical, electrical, optical, and thermal data from the epidermis.