Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes

Detalhes bibliográficos
Autor(a) principal: Sá, A.I. De
Data de Publicação: 2011
Outros Autores: Eugénio, S., Quaresma, S., Rangel, C. M., Vilar, Rui
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
Texto Completo: http://hdl.handle.net/10400.9/1425
Resumo: Recent research has suggested a number of applications for gold in fuel cells and related hydrogen fuel processing, which include coatings for light weight corrosion resistance bipolar plates and the incorporation of gold as catalyst to provide improvements in electrode conductivity, among others. This paper reports on the electroless deposition of gold on copper substrates from a HAuCl4.3H2O solution in 1-butyl-1-methylpyrrolidinium dicyanamide (BMP-DCA), in normal atmospheric conditions. The electrochemical behaviour of the plating solution was studied by potential sweep techniques. Results indicate that gold ions are deposited on copper without the aid of external polarization. The deposition process probably involves a displacement reaction involving copper dissolution, since no other oxidation reaction was identified. Preliminary studies using SEM/EDX showed that gold thin films, deposited on copper substrates at 333 K, present a granular nanostructured morphology, typical of electrodeposited films from DCA containing ionic liquids.
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spelling Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytesElectroless depositionGoldIonic liquidsThin filmsRecent research has suggested a number of applications for gold in fuel cells and related hydrogen fuel processing, which include coatings for light weight corrosion resistance bipolar plates and the incorporation of gold as catalyst to provide improvements in electrode conductivity, among others. This paper reports on the electroless deposition of gold on copper substrates from a HAuCl4.3H2O solution in 1-butyl-1-methylpyrrolidinium dicyanamide (BMP-DCA), in normal atmospheric conditions. The electrochemical behaviour of the plating solution was studied by potential sweep techniques. Results indicate that gold ions are deposited on copper without the aid of external polarization. The deposition process probably involves a displacement reaction involving copper dissolution, since no other oxidation reaction was identified. Preliminary studies using SEM/EDX showed that gold thin films, deposited on copper substrates at 333 K, present a granular nanostructured morphology, typical of electrodeposited films from DCA containing ionic liquids.Repositório do LNEGSá, A.I. DeEugénio, S.Quaresma, S.Rangel, C. M.Vilar, Rui2012-02-01T16:35:03Z2011-01-01T00:00:00Z2011-01-01T00:00:00Zinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articleapplication/pdfhttp://hdl.handle.net/10400.9/1425engSá, A. I. C.; Quaresma, S.; Eugénio, S.; Rangel, C. M.; Vilar, R. Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes. In: Ciência e Tecnologia dos Materiais, 2011, vol. 23, nº 1-2, p. 53-58info:eu-repo/semantics/openAccessreponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãoinstacron:RCAAP2022-09-06T12:25:58Zoai:repositorio.lneg.pt:10400.9/1425Portal AgregadorONGhttps://www.rcaap.pt/oai/openaireopendoar:71602024-03-19T15:34:15.492958Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãofalse
dc.title.none.fl_str_mv Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes
title Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes
spellingShingle Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes
Sá, A.I. De
Electroless deposition
Gold
Ionic liquids
Thin films
title_short Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes
title_full Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes
title_fullStr Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes
title_full_unstemmed Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes
title_sort Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes
author Sá, A.I. De
author_facet Sá, A.I. De
Eugénio, S.
Quaresma, S.
Rangel, C. M.
Vilar, Rui
author_role author
author2 Eugénio, S.
Quaresma, S.
Rangel, C. M.
Vilar, Rui
author2_role author
author
author
author
dc.contributor.none.fl_str_mv Repositório do LNEG
dc.contributor.author.fl_str_mv Sá, A.I. De
Eugénio, S.
Quaresma, S.
Rangel, C. M.
Vilar, Rui
dc.subject.por.fl_str_mv Electroless deposition
Gold
Ionic liquids
Thin films
topic Electroless deposition
Gold
Ionic liquids
Thin films
description Recent research has suggested a number of applications for gold in fuel cells and related hydrogen fuel processing, which include coatings for light weight corrosion resistance bipolar plates and the incorporation of gold as catalyst to provide improvements in electrode conductivity, among others. This paper reports on the electroless deposition of gold on copper substrates from a HAuCl4.3H2O solution in 1-butyl-1-methylpyrrolidinium dicyanamide (BMP-DCA), in normal atmospheric conditions. The electrochemical behaviour of the plating solution was studied by potential sweep techniques. Results indicate that gold ions are deposited on copper without the aid of external polarization. The deposition process probably involves a displacement reaction involving copper dissolution, since no other oxidation reaction was identified. Preliminary studies using SEM/EDX showed that gold thin films, deposited on copper substrates at 333 K, present a granular nanostructured morphology, typical of electrodeposited films from DCA containing ionic liquids.
publishDate 2011
dc.date.none.fl_str_mv 2011-01-01T00:00:00Z
2011-01-01T00:00:00Z
2012-02-01T16:35:03Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://hdl.handle.net/10400.9/1425
url http://hdl.handle.net/10400.9/1425
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv Sá, A. I. C.; Quaresma, S.; Eugénio, S.; Rangel, C. M.; Vilar, R. Towards an electroless deposition of gold on metallic substrates using ionic liquids as electrolytes. In: Ciência e Tecnologia dos Materiais, 2011, vol. 23, nº 1-2, p. 53-58
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.source.none.fl_str_mv reponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
instacron:RCAAP
instname_str Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
instacron_str RCAAP
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reponame_str Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
collection Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
repository.name.fl_str_mv Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
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