Thermal activation of As implanted in bulk Si and separation by implanted oxygen
Autor(a) principal: | |
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Data de Publicação: | 2004 |
Outros Autores: | , , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UFRGS |
Texto Completo: | http://hdl.handle.net/10183/96014 |
Resumo: | We have studied arsenic (As) diffusion and its electrical activation in two different types of silicon substrates: bulk Si and separation by implanted oxygen (SIMOX) wafers. Both substrates were implanted with a dose of 531014 cm-² As+ at 20 keV. The samples were annealed and physical characterization was performed with secondary ion mass spectrometry (SIMS), Rutherford backscattering spectrometry, and medium energy ion scattering. The electrical properties of the film were extracted by Hall measurements. The SIMS results showed a lower dopant outdiffusion loss to the atmosphere during annealing in the SIMOX samples. The electrical results for the SIMOX samples were also superior to those of bulk Si due to the higher dopant retention, likely the result of a higher concentration of vacancies, which in turn increases the relative fraction of As which is activated (in substitutional sites). The net effect was a higher sheet carrier concentration and lower sheet resistance in the SIMOX samples. The implantation damage removal was superior in SIMOX samples compared to bulk Si ones. |
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Dalponte, MateusBoudinov, Henri IvanovGoncharova, L.V.Starodub, D.Garfunkel, E.Gustafsson, T.2014-06-05T01:59:11Z20040021-8979http://hdl.handle.net/10183/96014000503771We have studied arsenic (As) diffusion and its electrical activation in two different types of silicon substrates: bulk Si and separation by implanted oxygen (SIMOX) wafers. Both substrates were implanted with a dose of 531014 cm-² As+ at 20 keV. The samples were annealed and physical characterization was performed with secondary ion mass spectrometry (SIMS), Rutherford backscattering spectrometry, and medium energy ion scattering. The electrical properties of the film were extracted by Hall measurements. The SIMS results showed a lower dopant outdiffusion loss to the atmosphere during annealing in the SIMOX samples. The electrical results for the SIMOX samples were also superior to those of bulk Si due to the higher dopant retention, likely the result of a higher concentration of vacancies, which in turn increases the relative fraction of As which is activated (in substitutional sites). The net effect was a higher sheet carrier concentration and lower sheet resistance in the SIMOX samples. The implantation damage removal was superior in SIMOX samples compared to bulk Si ones.application/pdfengJournal of applied physics. Woodbury. Vol. 96, no. 12 (Dec. 2004), p. 7388-7391Semicondutores elementaresImplantação de íonsEstruturas misRetroespalhamento rutherfordFilmes finosCompostos de silícioSIMOXThermal activation of As implanted in bulk Si and separation by implanted oxygenEstrangeiroinfo:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/openAccessreponame:Repositório Institucional da UFRGSinstname:Universidade Federal do Rio Grande do Sul (UFRGS)instacron:UFRGSORIGINAL000503771.pdf000503771.pdfTexto completo (inglês)application/pdf231539http://www.lume.ufrgs.br/bitstream/10183/96014/1/000503771.pdfd819d18a806c70ac5cb9f1e50a290529MD51TEXT000503771.pdf.txt000503771.pdf.txtExtracted Texttext/plain20219http://www.lume.ufrgs.br/bitstream/10183/96014/2/000503771.pdf.txtf0d12977effcc27965405b4dce63cbadMD52THUMBNAIL000503771.pdf.jpg000503771.pdf.jpgGenerated Thumbnailimage/jpeg1573http://www.lume.ufrgs.br/bitstream/10183/96014/3/000503771.pdf.jpg5367c4a6409bd56718d908da1b4ecd27MD5310183/960142022-02-22 04:46:56.173148oai:www.lume.ufrgs.br:10183/96014Repositório de PublicaçõesPUBhttps://lume.ufrgs.br/oai/requestopendoar:2022-02-22T07:46:56Repositório Institucional da UFRGS - Universidade Federal do Rio Grande do Sul (UFRGS)false |
dc.title.pt_BR.fl_str_mv |
Thermal activation of As implanted in bulk Si and separation by implanted oxygen |
title |
Thermal activation of As implanted in bulk Si and separation by implanted oxygen |
spellingShingle |
Thermal activation of As implanted in bulk Si and separation by implanted oxygen Dalponte, Mateus Semicondutores elementares Implantação de íons Estruturas mis Retroespalhamento rutherford Filmes finos Compostos de silício SIMOX |
title_short |
Thermal activation of As implanted in bulk Si and separation by implanted oxygen |
title_full |
Thermal activation of As implanted in bulk Si and separation by implanted oxygen |
title_fullStr |
Thermal activation of As implanted in bulk Si and separation by implanted oxygen |
title_full_unstemmed |
Thermal activation of As implanted in bulk Si and separation by implanted oxygen |
title_sort |
Thermal activation of As implanted in bulk Si and separation by implanted oxygen |
author |
Dalponte, Mateus |
author_facet |
Dalponte, Mateus Boudinov, Henri Ivanov Goncharova, L.V. Starodub, D. Garfunkel, E. Gustafsson, T. |
author_role |
author |
author2 |
Boudinov, Henri Ivanov Goncharova, L.V. Starodub, D. Garfunkel, E. Gustafsson, T. |
author2_role |
author author author author author |
dc.contributor.author.fl_str_mv |
Dalponte, Mateus Boudinov, Henri Ivanov Goncharova, L.V. Starodub, D. Garfunkel, E. Gustafsson, T. |
dc.subject.por.fl_str_mv |
Semicondutores elementares Implantação de íons Estruturas mis Retroespalhamento rutherford Filmes finos Compostos de silício SIMOX |
topic |
Semicondutores elementares Implantação de íons Estruturas mis Retroespalhamento rutherford Filmes finos Compostos de silício SIMOX |
description |
We have studied arsenic (As) diffusion and its electrical activation in two different types of silicon substrates: bulk Si and separation by implanted oxygen (SIMOX) wafers. Both substrates were implanted with a dose of 531014 cm-² As+ at 20 keV. The samples were annealed and physical characterization was performed with secondary ion mass spectrometry (SIMS), Rutherford backscattering spectrometry, and medium energy ion scattering. The electrical properties of the film were extracted by Hall measurements. The SIMS results showed a lower dopant outdiffusion loss to the atmosphere during annealing in the SIMOX samples. The electrical results for the SIMOX samples were also superior to those of bulk Si due to the higher dopant retention, likely the result of a higher concentration of vacancies, which in turn increases the relative fraction of As which is activated (in substitutional sites). The net effect was a higher sheet carrier concentration and lower sheet resistance in the SIMOX samples. The implantation damage removal was superior in SIMOX samples compared to bulk Si ones. |
publishDate |
2004 |
dc.date.issued.fl_str_mv |
2004 |
dc.date.accessioned.fl_str_mv |
2014-06-05T01:59:11Z |
dc.type.driver.fl_str_mv |
Estrangeiro info:eu-repo/semantics/article |
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info:eu-repo/semantics/publishedVersion |
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article |
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0021-8979 |
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000503771 |
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http://hdl.handle.net/10183/96014 |
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eng |
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dc.relation.ispartof.pt_BR.fl_str_mv |
Journal of applied physics. Woodbury. Vol. 96, no. 12 (Dec. 2004), p. 7388-7391 |
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openAccess |
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