Unraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidation

Detalhes bibliográficos
Autor(a) principal: Dartora, Gustavo Henrique Stedile
Data de Publicação: 2017
Outros Autores: Pitthan Filho, Eduardo, Stedile, Fernanda Chiarello
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Repositório Institucional da UFRGS
Texto Completo: http://hdl.handle.net/10183/187943
Resumo: Aiming to understand the processes involved in the formation of the transition region between SiO2 and SiC, known as the interfacial region, early steps of SiC oxidation were investigated using mainly nuclear reaction analyses. Oxidation kinetics reveals that an abrupt change in the oxidation mechanism is observed in C-face oxide films when their thickness is around 10 nm, while a continuous change in the oxidation mechanism is observed in Si-face oxide films with thicknesses up to about 4 nm. This last thickness corresponds to the maximum width of the interfacial region. Changes observed in the oxidation mechanism were related to oxidation reaction and interfacial atom emission that may take place during oxide film growth. Besides, the activation energies of such processes were obtained.
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spelling Dartora, Gustavo Henrique StedilePitthan Filho, EduardoStedile, Fernanda Chiarello2019-01-19T02:34:02Z20170021-8979http://hdl.handle.net/10183/187943001072428Aiming to understand the processes involved in the formation of the transition region between SiO2 and SiC, known as the interfacial region, early steps of SiC oxidation were investigated using mainly nuclear reaction analyses. Oxidation kinetics reveals that an abrupt change in the oxidation mechanism is observed in C-face oxide films when their thickness is around 10 nm, while a continuous change in the oxidation mechanism is observed in Si-face oxide films with thicknesses up to about 4 nm. This last thickness corresponds to the maximum width of the interfacial region. Changes observed in the oxidation mechanism were related to oxidation reaction and interfacial atom emission that may take place during oxide film growth. Besides, the activation energies of such processes were obtained.application/pdfengJournal of applied physics. New York. Vol. 122, no. 21 (Dec. 2017), 215301, 6 p.Oxidação térmicaCarboneto de silícioCapacitores MOSUnraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidationEstrangeiroinfo:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/openAccessreponame:Repositório Institucional da UFRGSinstname:Universidade Federal do Rio Grande do Sul (UFRGS)instacron:UFRGSTEXT001072428.pdf.txt001072428.pdf.txtExtracted Texttext/plain31997http://www.lume.ufrgs.br/bitstream/10183/187943/2/001072428.pdf.txt9d19363f30ef292a63d0d0852508ad3aMD52ORIGINAL001072428.pdfTexto completo (inglês)application/pdf2611517http://www.lume.ufrgs.br/bitstream/10183/187943/1/001072428.pdf119e3573b2aa2a60009b5c5afcf11381MD5110183/1879432019-01-20 02:32:03.052479oai:www.lume.ufrgs.br:10183/187943Repositório de PublicaçõesPUBhttps://lume.ufrgs.br/oai/requestopendoar:2019-01-20T04:32:03Repositório Institucional da UFRGS - Universidade Federal do Rio Grande do Sul (UFRGS)false
dc.title.pt_BR.fl_str_mv Unraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidation
title Unraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidation
spellingShingle Unraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidation
Dartora, Gustavo Henrique Stedile
Oxidação térmica
Carboneto de silício
Capacitores MOS
title_short Unraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidation
title_full Unraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidation
title_fullStr Unraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidation
title_full_unstemmed Unraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidation
title_sort Unraveling the mechanisms responsible for the interfacial region formation in 4H-SiC dry thermal oxidation
author Dartora, Gustavo Henrique Stedile
author_facet Dartora, Gustavo Henrique Stedile
Pitthan Filho, Eduardo
Stedile, Fernanda Chiarello
author_role author
author2 Pitthan Filho, Eduardo
Stedile, Fernanda Chiarello
author2_role author
author
dc.contributor.author.fl_str_mv Dartora, Gustavo Henrique Stedile
Pitthan Filho, Eduardo
Stedile, Fernanda Chiarello
dc.subject.por.fl_str_mv Oxidação térmica
Carboneto de silício
Capacitores MOS
topic Oxidação térmica
Carboneto de silício
Capacitores MOS
description Aiming to understand the processes involved in the formation of the transition region between SiO2 and SiC, known as the interfacial region, early steps of SiC oxidation were investigated using mainly nuclear reaction analyses. Oxidation kinetics reveals that an abrupt change in the oxidation mechanism is observed in C-face oxide films when their thickness is around 10 nm, while a continuous change in the oxidation mechanism is observed in Si-face oxide films with thicknesses up to about 4 nm. This last thickness corresponds to the maximum width of the interfacial region. Changes observed in the oxidation mechanism were related to oxidation reaction and interfacial atom emission that may take place during oxide film growth. Besides, the activation energies of such processes were obtained.
publishDate 2017
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dc.relation.ispartof.pt_BR.fl_str_mv Journal of applied physics. New York. Vol. 122, no. 21 (Dec. 2017), 215301, 6 p.
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