Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid Electronics
Autor(a) principal: | |
---|---|
Data de Publicação: | 2022 |
Outros Autores: | , , , , , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UNESP |
Texto Completo: | http://dx.doi.org/10.1002/aelm.202200175 http://hdl.handle.net/11449/241661 |
Resumo: | The miniaturization of electronic devices highlights the need for robust low-κ materials as an alternative to prevent losses in the performance of integrated circuits. For it, surface-supported metal-organic frameworks (SURMOFs), a class of porous-hybrid materials, may cover such a demand. However, the high-intrinsic porosity makes determining the dielectric properties difficult and promotes the integration of SURMOF thin films. Here, the integration of ultrathin HKUST-1 SURMOF films into a 3D functional device architecture using soft-top electrical contacts is addressed. In this novel approach, the device structure assumes an ultracompact capacitor structure allowing determine the dielectric properties of porous thin films with considerable accuracy. A low-κ value of 2.0 ± 0.5 and robust breakdown strength of 2.8 MV cm−1 are obtained for films below 80 nm. The spontaneous self-encapsulated structure provides a footprint-area reduction of up to 90% and yields good protection for the SURMOF toward different hazardous exposure. Finite-element calculations compare the HKUST-1 performance as dielectric layer with well-established insulators applied in electronics (SiO2 and Al2O3). The possibility of integration and miniaturization of HKUST-1, combined with their interesting insulating properties, place this hybrid material as a robust low-k dielectric for novel electronics. |
id |
UNSP_1b77779fcb8ac8adaa6e268ff0511f82 |
---|---|
oai_identifier_str |
oai:repositorio.unesp.br:11449/241661 |
network_acronym_str |
UNSP |
network_name_str |
Repositório Institucional da UNESP |
repository_id_str |
2946 |
spelling |
Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid ElectronicsdielectricsHKUST-1low-κmetal-organic frameworksSURMOFsThe miniaturization of electronic devices highlights the need for robust low-κ materials as an alternative to prevent losses in the performance of integrated circuits. For it, surface-supported metal-organic frameworks (SURMOFs), a class of porous-hybrid materials, may cover such a demand. However, the high-intrinsic porosity makes determining the dielectric properties difficult and promotes the integration of SURMOF thin films. Here, the integration of ultrathin HKUST-1 SURMOF films into a 3D functional device architecture using soft-top electrical contacts is addressed. In this novel approach, the device structure assumes an ultracompact capacitor structure allowing determine the dielectric properties of porous thin films with considerable accuracy. A low-κ value of 2.0 ± 0.5 and robust breakdown strength of 2.8 MV cm−1 are obtained for films below 80 nm. The spontaneous self-encapsulated structure provides a footprint-area reduction of up to 90% and yields good protection for the SURMOF toward different hazardous exposure. Finite-element calculations compare the HKUST-1 performance as dielectric layer with well-established insulators applied in electronics (SiO2 and Al2O3). The possibility of integration and miniaturization of HKUST-1, combined with their interesting insulating properties, place this hybrid material as a robust low-k dielectric for novel electronics.Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)Laboratório Nacional de Luz SíncrotronConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)Laboratório Nacional de NanotecnologiaPostgraduate Program in Materials Science and Technology (POSMAT) São Paulo State University (UNESP), São PauloBrazilian Nanotechnology National Laboratory (LNNano) Brazilian Center for Research in Energy and Materials (CNPEM), São PauloDepartment of Physical Chemistry Institute of Chemistry (IQ) University of Campinas (UNICAMP), São PauloInstitute of Functional Interfaces (IFG) Karlsruhe Institute of Technology (KIT)Graphene and Nanomaterials Research Center (MackGraphe) Mackenzie Presbyterian InstitutePostgraduate Program in Materials Science and Technology (POSMAT) São Paulo State University (UNESP), São PauloFAPESP: 2014/25979-2FAPESP: 2014/50906-9FAPESP: 2016/25346-5FAPESP: 2017/02317-2FAPESP: 2017/25553-3Laboratório Nacional de Luz Síncrotron: 20170812Laboratório Nacional de Luz Síncrotron: 20180148Laboratório Nacional de Luz Síncrotron: 20180742CNPq: 305305/2016-6CNPq: 306768/2019-4CNPq: 380367/2020-3CNPq: 408770/2018-0CNPq: 442493/2019-3CNPq: 465452/2014-0CAPES: 88881.145646/2017-01CAPES: 88887.497908/2020-00Laboratório Nacional de Nanotecnologia: AFM-24654Laboratório Nacional de Nanotecnologia: AFM-26354Laboratório Nacional de Nanotecnologia: AFM-27465Laboratório Nacional de Nanotecnologia: SEM-C1-25060Universidade Estadual Paulista (UNESP)Brazilian Center for Research in Energy and Materials (CNPEM)Universidade Estadual de Campinas (UNICAMP)Karlsruhe Institute of Technology (KIT)Mackenzie Presbyterian Instituteda Silva, Ricardo M. L. [UNESP]Albano, Luiz G. S.Vello, Tatiana P.de Araújo, Wagner W. R.de Camargo, Davi H. S.Palermo, Leirson D.Corrêa, Cátia C.Wöll, ChristofBufon, Carlos C. B. [UNESP]2023-03-01T21:15:30Z2023-03-01T21:15:30Z2022-09-01info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articlehttp://dx.doi.org/10.1002/aelm.202200175Advanced Electronic Materials, v. 8, n. 9, 2022.2199-160Xhttp://hdl.handle.net/11449/24166110.1002/aelm.2022001752-s2.0-85130271521Scopusreponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPengAdvanced Electronic Materialsinfo:eu-repo/semantics/openAccess2023-03-01T21:15:31Zoai:repositorio.unesp.br:11449/241661Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462024-08-05T19:42:05.163959Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false |
dc.title.none.fl_str_mv |
Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid Electronics |
title |
Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid Electronics |
spellingShingle |
Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid Electronics da Silva, Ricardo M. L. [UNESP] dielectrics HKUST-1 low-κ metal-organic frameworks SURMOFs |
title_short |
Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid Electronics |
title_full |
Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid Electronics |
title_fullStr |
Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid Electronics |
title_full_unstemmed |
Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid Electronics |
title_sort |
Surface-Supported Metal-Organic Framework as Low-Dielectric-Constant Thin Films for Novel Hybrid Electronics |
author |
da Silva, Ricardo M. L. [UNESP] |
author_facet |
da Silva, Ricardo M. L. [UNESP] Albano, Luiz G. S. Vello, Tatiana P. de Araújo, Wagner W. R. de Camargo, Davi H. S. Palermo, Leirson D. Corrêa, Cátia C. Wöll, Christof Bufon, Carlos C. B. [UNESP] |
author_role |
author |
author2 |
Albano, Luiz G. S. Vello, Tatiana P. de Araújo, Wagner W. R. de Camargo, Davi H. S. Palermo, Leirson D. Corrêa, Cátia C. Wöll, Christof Bufon, Carlos C. B. [UNESP] |
author2_role |
author author author author author author author author |
dc.contributor.none.fl_str_mv |
Universidade Estadual Paulista (UNESP) Brazilian Center for Research in Energy and Materials (CNPEM) Universidade Estadual de Campinas (UNICAMP) Karlsruhe Institute of Technology (KIT) Mackenzie Presbyterian Institute |
dc.contributor.author.fl_str_mv |
da Silva, Ricardo M. L. [UNESP] Albano, Luiz G. S. Vello, Tatiana P. de Araújo, Wagner W. R. de Camargo, Davi H. S. Palermo, Leirson D. Corrêa, Cátia C. Wöll, Christof Bufon, Carlos C. B. [UNESP] |
dc.subject.por.fl_str_mv |
dielectrics HKUST-1 low-κ metal-organic frameworks SURMOFs |
topic |
dielectrics HKUST-1 low-κ metal-organic frameworks SURMOFs |
description |
The miniaturization of electronic devices highlights the need for robust low-κ materials as an alternative to prevent losses in the performance of integrated circuits. For it, surface-supported metal-organic frameworks (SURMOFs), a class of porous-hybrid materials, may cover such a demand. However, the high-intrinsic porosity makes determining the dielectric properties difficult and promotes the integration of SURMOF thin films. Here, the integration of ultrathin HKUST-1 SURMOF films into a 3D functional device architecture using soft-top electrical contacts is addressed. In this novel approach, the device structure assumes an ultracompact capacitor structure allowing determine the dielectric properties of porous thin films with considerable accuracy. A low-κ value of 2.0 ± 0.5 and robust breakdown strength of 2.8 MV cm−1 are obtained for films below 80 nm. The spontaneous self-encapsulated structure provides a footprint-area reduction of up to 90% and yields good protection for the SURMOF toward different hazardous exposure. Finite-element calculations compare the HKUST-1 performance as dielectric layer with well-established insulators applied in electronics (SiO2 and Al2O3). The possibility of integration and miniaturization of HKUST-1, combined with their interesting insulating properties, place this hybrid material as a robust low-k dielectric for novel electronics. |
publishDate |
2022 |
dc.date.none.fl_str_mv |
2022-09-01 2023-03-01T21:15:30Z 2023-03-01T21:15:30Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://dx.doi.org/10.1002/aelm.202200175 Advanced Electronic Materials, v. 8, n. 9, 2022. 2199-160X http://hdl.handle.net/11449/241661 10.1002/aelm.202200175 2-s2.0-85130271521 |
url |
http://dx.doi.org/10.1002/aelm.202200175 http://hdl.handle.net/11449/241661 |
identifier_str_mv |
Advanced Electronic Materials, v. 8, n. 9, 2022. 2199-160X 10.1002/aelm.202200175 2-s2.0-85130271521 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
Advanced Electronic Materials |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.source.none.fl_str_mv |
Scopus reponame:Repositório Institucional da UNESP instname:Universidade Estadual Paulista (UNESP) instacron:UNESP |
instname_str |
Universidade Estadual Paulista (UNESP) |
instacron_str |
UNESP |
institution |
UNESP |
reponame_str |
Repositório Institucional da UNESP |
collection |
Repositório Institucional da UNESP |
repository.name.fl_str_mv |
Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP) |
repository.mail.fl_str_mv |
|
_version_ |
1808129107747143680 |