Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factors
Autor(a) principal: | |
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Data de Publicação: | 2009 |
Outros Autores: | , |
Tipo de documento: | Artigo de conferência |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UNESP |
Texto Completo: | http://dx.doi.org/10.1115/IMECE2008-68778 http://hdl.handle.net/11449/71148 |
Resumo: | This paper discusses the investigation of an abrasive process for finishing flat workpieces, based on the combination of important grinding and lapping characteristics. Instead of loose abrasive grains between the workpiece and the lapping plate, a resinoid grinding wheel of hot-pressed silicon carbide is placed on the plate of a device resembling a lapping machine. The resin bond grinding wheel is dressed with a single-point diamond. In addition to keeping the plate flat, dressing also plays the role of interfering in the behavior of the process by varying the overlap factor (Ud). It was found that the studied process simplify the set-up and can be controlled more easily than in lapping, whose is a painstaking process. The surface roughness and flatness deviation proved comparable to those of lapping, or even finer than it, with the additional advantage of a less contaminated workpiece surface with a shiny appearance. The process was also monitored by acoustic emission (AE), which indicates to be a promissing and suitable technique for use in this process. Copyright © 2008 by ASME. |
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Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factorsAbrasive processFlatness deviationLoose abrasive grainsResin-bondWork piecesAbrasivesAcoustic emission testingAcoustic emissionsGrinding (comminution)Grinding (machining)Grinding machinesGrinding millsGrinding wheelsMechanical engineeringResinsSilicon carbideSurface roughnessLappingThis paper discusses the investigation of an abrasive process for finishing flat workpieces, based on the combination of important grinding and lapping characteristics. Instead of loose abrasive grains between the workpiece and the lapping plate, a resinoid grinding wheel of hot-pressed silicon carbide is placed on the plate of a device resembling a lapping machine. The resin bond grinding wheel is dressed with a single-point diamond. In addition to keeping the plate flat, dressing also plays the role of interfering in the behavior of the process by varying the overlap factor (Ud). It was found that the studied process simplify the set-up and can be controlled more easily than in lapping, whose is a painstaking process. The surface roughness and flatness deviation proved comparable to those of lapping, or even finer than it, with the additional advantage of a less contaminated workpiece surface with a shiny appearance. The process was also monitored by acoustic emission (AE), which indicates to be a promissing and suitable technique for use in this process. Copyright © 2008 by ASME.Department of Mechanical Engineering São Paulo State University - Unesp, Bauru, São PauloDepartment of Mechanical Engineering São Paulo State University - Unesp, Bauru, São PauloUniversidade Estadual Paulista (Unesp)Sanchez, L. E. A. [UNESP]Jun, N. Z. X. [UNESP]Fiocchi, A. A. [UNESP]2014-05-27T11:23:58Z2014-05-27T11:23:58Z2009-09-14info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/conferenceObject411-418http://dx.doi.org/10.1115/IMECE2008-68778ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 4, p. 411-418.http://hdl.handle.net/11449/7114810.1115/IMECE2008-68778WOS:0002688767000542-s2.0-69949149591Scopusreponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPengASME International Mechanical Engineering Congress and Exposition, Proceedingsinfo:eu-repo/semantics/openAccess2024-06-28T13:55:18Zoai:repositorio.unesp.br:11449/71148Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462024-08-05T13:50:16.752046Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false |
dc.title.none.fl_str_mv |
Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factors |
title |
Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factors |
spellingShingle |
Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factors Sanchez, L. E. A. [UNESP] Abrasive process Flatness deviation Loose abrasive grains Resin-bond Work pieces Abrasives Acoustic emission testing Acoustic emissions Grinding (comminution) Grinding (machining) Grinding machines Grinding mills Grinding wheels Mechanical engineering Resins Silicon carbide Surface roughness Lapping |
title_short |
Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factors |
title_full |
Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factors |
title_fullStr |
Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factors |
title_full_unstemmed |
Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factors |
title_sort |
Finishing of flat parts led by lapping kinematics on abrasive disc dressed in agreement with overlap factors |
author |
Sanchez, L. E. A. [UNESP] |
author_facet |
Sanchez, L. E. A. [UNESP] Jun, N. Z. X. [UNESP] Fiocchi, A. A. [UNESP] |
author_role |
author |
author2 |
Jun, N. Z. X. [UNESP] Fiocchi, A. A. [UNESP] |
author2_role |
author author |
dc.contributor.none.fl_str_mv |
Universidade Estadual Paulista (Unesp) |
dc.contributor.author.fl_str_mv |
Sanchez, L. E. A. [UNESP] Jun, N. Z. X. [UNESP] Fiocchi, A. A. [UNESP] |
dc.subject.por.fl_str_mv |
Abrasive process Flatness deviation Loose abrasive grains Resin-bond Work pieces Abrasives Acoustic emission testing Acoustic emissions Grinding (comminution) Grinding (machining) Grinding machines Grinding mills Grinding wheels Mechanical engineering Resins Silicon carbide Surface roughness Lapping |
topic |
Abrasive process Flatness deviation Loose abrasive grains Resin-bond Work pieces Abrasives Acoustic emission testing Acoustic emissions Grinding (comminution) Grinding (machining) Grinding machines Grinding mills Grinding wheels Mechanical engineering Resins Silicon carbide Surface roughness Lapping |
description |
This paper discusses the investigation of an abrasive process for finishing flat workpieces, based on the combination of important grinding and lapping characteristics. Instead of loose abrasive grains between the workpiece and the lapping plate, a resinoid grinding wheel of hot-pressed silicon carbide is placed on the plate of a device resembling a lapping machine. The resin bond grinding wheel is dressed with a single-point diamond. In addition to keeping the plate flat, dressing also plays the role of interfering in the behavior of the process by varying the overlap factor (Ud). It was found that the studied process simplify the set-up and can be controlled more easily than in lapping, whose is a painstaking process. The surface roughness and flatness deviation proved comparable to those of lapping, or even finer than it, with the additional advantage of a less contaminated workpiece surface with a shiny appearance. The process was also monitored by acoustic emission (AE), which indicates to be a promissing and suitable technique for use in this process. Copyright © 2008 by ASME. |
publishDate |
2009 |
dc.date.none.fl_str_mv |
2009-09-14 2014-05-27T11:23:58Z 2014-05-27T11:23:58Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/conferenceObject |
format |
conferenceObject |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://dx.doi.org/10.1115/IMECE2008-68778 ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 4, p. 411-418. http://hdl.handle.net/11449/71148 10.1115/IMECE2008-68778 WOS:000268876700054 2-s2.0-69949149591 |
url |
http://dx.doi.org/10.1115/IMECE2008-68778 http://hdl.handle.net/11449/71148 |
identifier_str_mv |
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 4, p. 411-418. 10.1115/IMECE2008-68778 WOS:000268876700054 2-s2.0-69949149591 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
ASME International Mechanical Engineering Congress and Exposition, Proceedings |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
411-418 |
dc.source.none.fl_str_mv |
Scopus reponame:Repositório Institucional da UNESP instname:Universidade Estadual Paulista (UNESP) instacron:UNESP |
instname_str |
Universidade Estadual Paulista (UNESP) |
instacron_str |
UNESP |
institution |
UNESP |
reponame_str |
Repositório Institucional da UNESP |
collection |
Repositório Institucional da UNESP |
repository.name.fl_str_mv |
Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP) |
repository.mail.fl_str_mv |
|
_version_ |
1808128281708331008 |