Reciclagem de poliestireno expandido: compósito com fibras de sisal para confecção de placas de circuito impresso

• Autor(a) principal: Silva, Kamila Maria de Souza [UNESP]
• Data de Publicação: 2013
• Tipo de documento: Trabalho de conclusão de curso
• Idioma: por
• Título da fonte: Repositório Institucional da UNESP
• Texto Completo: http://hdl.handle.net/11449/121224
• topic: Materiais compostos; Poliestireno; Fibras; Sisal; Termoplasticos; Microscopia eletronica de varredura; Calorimetria; Reaproveitamento (Sobras, refugos, etc.); Composite materials

In this work polystyrene composites reinforced with recycled sisal fibers were processed, in order to apply in the manufacture of printed circuit boards. A thermoplastic matrix of recycled polystyrene was used, this material came from waste expanded polystyrene (EPS) used in appliance's packages. Composites were prepared with 15% and 25% of sisal fibers. To obtain the composites, wasted EPS and natural sisal fibers were chosen, to encourage recycling and reuse of household waste and also the use of renewable resources. The composites were analyzed by standard tensile and flexural test, in order to verify the mechanical properties of the material. The characterization of the composite was done by scanning electron microscopy (SEM) , thermogravimetry (TGA / DTG) , differential scanning calorimetry (DSC) and dielectric analysis . The analysis of the results showed that the percentage of fibers in the composite influences directly the thermal and mechanical properties. Plates with a lower percentage of fibers showed superior properties at a higher percentage. The composite material obtained is easy to process and it's use is feasible for the confection of printed circuit boards, considering it's mechanical, thermal and insulative properties