Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp
Autor(a) principal: | |
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Data de Publicação: | 2020 |
Outros Autores: | , , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UNESP |
Texto Completo: | http://dx.doi.org/10.1155/2020/3905804 http://hdl.handle.net/11449/196730 |
Resumo: | We present a capacitive smart sensor based on printed circuit board (PCB) technology to measure the amount of water content in a paper pulp at the wet end of a paper machine. The developed sensor incorporates in the same PCB the signal processing circuits. It is a handheld portable device, and its output is sent to the reading equipment using a Bluetooth wireless connection, providing to the sensor's operator ease of mobility around the wet end of a paper machine. The prototype was tested in a laboratory, using a wire mesh to emulate the end of a paper machine, and we were able to measure and easily detect when it reaches the water content in the range of 90% to 92%, as required in the paper fabrication process. Standard deviation of the capacitance measurements at various moisture levels is four orders of magnitude smaller than the mean. The smart sensor was tested in the 20 degrees C to 40 degrees C temperature range, in a paper pulp with a gravimetric water content of 91%. Since the variation of capacitance with temperature is practically linear, we propose a simple linear compensation equation to correct the observed sensitivity with the temperature. To keep the signal processing circuits small, low cost, simple, and robust, a novel direct interface sensor to microcontroller circuit technique was used to make the capacitive measurement, allowing for measuring small capacitance deviations without high-frequency oscillators. It was shown that it is possible to integrate the signal processing circuits in the top layer of the PCB interdigitated sensor without adding noise or degrading the performance of the capacitive sensor. |
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Repositório Institucional da UNESP |
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Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper PulpWe present a capacitive smart sensor based on printed circuit board (PCB) technology to measure the amount of water content in a paper pulp at the wet end of a paper machine. The developed sensor incorporates in the same PCB the signal processing circuits. It is a handheld portable device, and its output is sent to the reading equipment using a Bluetooth wireless connection, providing to the sensor's operator ease of mobility around the wet end of a paper machine. The prototype was tested in a laboratory, using a wire mesh to emulate the end of a paper machine, and we were able to measure and easily detect when it reaches the water content in the range of 90% to 92%, as required in the paper fabrication process. Standard deviation of the capacitance measurements at various moisture levels is four orders of magnitude smaller than the mean. The smart sensor was tested in the 20 degrees C to 40 degrees C temperature range, in a paper pulp with a gravimetric water content of 91%. Since the variation of capacitance with temperature is practically linear, we propose a simple linear compensation equation to correct the observed sensitivity with the temperature. To keep the signal processing circuits small, low cost, simple, and robust, a novel direct interface sensor to microcontroller circuit technique was used to make the capacitive measurement, allowing for measuring small capacitance deviations without high-frequency oscillators. It was shown that it is possible to integrate the signal processing circuits in the top layer of the PCB interdigitated sensor without adding noise or degrading the performance of the capacitive sensor.Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)Sao Paulo State Univ Julio de Mesquita Filho, Fac Sci & Engn, Tupa, SP, BrazilParana Fed Univ Technol UTFPR, Cornelio Procopio, PR, BrazilFEEC UNICAMP, Dept Semicond Instrumentat & Photon, Campinas, SP, BrazilUninove Campus Vergueiro, Sao Paulo, SP, BrazilSao Paulo State Univ Julio de Mesquita Filho, Fac Sci & Engn, Tupa, SP, BrazilCAPES: 001Hindawi LtdUniversidade Estadual Paulista (Unesp)Parana Fed Univ Technol UTFPRUniversidade Estadual de Campinas (UNICAMP)Uninove Campus VergueiroMorais, Flavio [UNESP]Carvalhaes-Dias, PedroDuarte, LuisCosta, EduardoFerreira, AlexandreDias, Jose Siqueira2020-12-10T19:54:25Z2020-12-10T19:54:25Z2020-03-04info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/article13http://dx.doi.org/10.1155/2020/3905804Journal Of Sensors. London: Hindawi Ltd, v. 2020, 13 p., 2020.1687-725Xhttp://hdl.handle.net/11449/19673010.1155/2020/3905804WOS:000522361700001Web of Sciencereponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPengJournal Of Sensorsinfo:eu-repo/semantics/openAccess2024-06-10T14:49:03Zoai:repositorio.unesp.br:11449/196730Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462024-08-05T16:22:40.143847Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false |
dc.title.none.fl_str_mv |
Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp |
title |
Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp |
spellingShingle |
Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp Morais, Flavio [UNESP] |
title_short |
Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp |
title_full |
Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp |
title_fullStr |
Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp |
title_full_unstemmed |
Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp |
title_sort |
Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp |
author |
Morais, Flavio [UNESP] |
author_facet |
Morais, Flavio [UNESP] Carvalhaes-Dias, Pedro Duarte, Luis Costa, Eduardo Ferreira, Alexandre Dias, Jose Siqueira |
author_role |
author |
author2 |
Carvalhaes-Dias, Pedro Duarte, Luis Costa, Eduardo Ferreira, Alexandre Dias, Jose Siqueira |
author2_role |
author author author author author |
dc.contributor.none.fl_str_mv |
Universidade Estadual Paulista (Unesp) Parana Fed Univ Technol UTFPR Universidade Estadual de Campinas (UNICAMP) Uninove Campus Vergueiro |
dc.contributor.author.fl_str_mv |
Morais, Flavio [UNESP] Carvalhaes-Dias, Pedro Duarte, Luis Costa, Eduardo Ferreira, Alexandre Dias, Jose Siqueira |
description |
We present a capacitive smart sensor based on printed circuit board (PCB) technology to measure the amount of water content in a paper pulp at the wet end of a paper machine. The developed sensor incorporates in the same PCB the signal processing circuits. It is a handheld portable device, and its output is sent to the reading equipment using a Bluetooth wireless connection, providing to the sensor's operator ease of mobility around the wet end of a paper machine. The prototype was tested in a laboratory, using a wire mesh to emulate the end of a paper machine, and we were able to measure and easily detect when it reaches the water content in the range of 90% to 92%, as required in the paper fabrication process. Standard deviation of the capacitance measurements at various moisture levels is four orders of magnitude smaller than the mean. The smart sensor was tested in the 20 degrees C to 40 degrees C temperature range, in a paper pulp with a gravimetric water content of 91%. Since the variation of capacitance with temperature is practically linear, we propose a simple linear compensation equation to correct the observed sensitivity with the temperature. To keep the signal processing circuits small, low cost, simple, and robust, a novel direct interface sensor to microcontroller circuit technique was used to make the capacitive measurement, allowing for measuring small capacitance deviations without high-frequency oscillators. It was shown that it is possible to integrate the signal processing circuits in the top layer of the PCB interdigitated sensor without adding noise or degrading the performance of the capacitive sensor. |
publishDate |
2020 |
dc.date.none.fl_str_mv |
2020-12-10T19:54:25Z 2020-12-10T19:54:25Z 2020-03-04 |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://dx.doi.org/10.1155/2020/3905804 Journal Of Sensors. London: Hindawi Ltd, v. 2020, 13 p., 2020. 1687-725X http://hdl.handle.net/11449/196730 10.1155/2020/3905804 WOS:000522361700001 |
url |
http://dx.doi.org/10.1155/2020/3905804 http://hdl.handle.net/11449/196730 |
identifier_str_mv |
Journal Of Sensors. London: Hindawi Ltd, v. 2020, 13 p., 2020. 1687-725X 10.1155/2020/3905804 WOS:000522361700001 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
Journal Of Sensors |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
13 |
dc.publisher.none.fl_str_mv |
Hindawi Ltd |
publisher.none.fl_str_mv |
Hindawi Ltd |
dc.source.none.fl_str_mv |
Web of Science reponame:Repositório Institucional da UNESP instname:Universidade Estadual Paulista (UNESP) instacron:UNESP |
instname_str |
Universidade Estadual Paulista (UNESP) |
instacron_str |
UNESP |
institution |
UNESP |
reponame_str |
Repositório Institucional da UNESP |
collection |
Repositório Institucional da UNESP |
repository.name.fl_str_mv |
Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP) |
repository.mail.fl_str_mv |
|
_version_ |
1808128640361168896 |