A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology

Detalhes bibliográficos
Autor(a) principal: Morais Franca, Maria Bernadete de
Data de Publicação: 2019
Outros Autores: Morais, Flavio J. O. [UNESP], Carvalhaes-Dias, Pedro, Duarte, Luis Caparroz, Siqueira Dias, Jose A.
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Repositório Institucional da UNESP
Texto Completo: http://dx.doi.org/10.1109/TIM.2018.2843605
http://hdl.handle.net/11449/185247
Resumo: Heat dissipation sensors operate based on the temperature dependence of the transient heat conduction within the soil, which is a function of the soil characteristics and its water content. After a heat pulse with controlled energy is applied to a heater, it is possible to show that the maximum temperature rise Delta T-M measured in the temperature sensing element can be related to the volumetric water content of the soil theta(v) [m(3) m(-3)]. The design and fabrication of a low-cost soil moisture multiprobe heat pulse sensor system using conventional printed circuit boards and surface-mount devices is presented. The proposed sensor is free of the needles' deflection problem present in conventional multiprobe sensors and is manufactured using conventional off-the-shelf electronic components. A precision low-power electronic signal conditioning circuit, using an instrumentation switched-capacitor building block, was developed and successfully used in the prototype. Due to an energy-efficient topology for the sensor and a low-power signal conditioning circuit, the average current consumption of the system (with one measurement per day) is only 3 mu A. To demonstrate the feasibility of the concept, a prototype of the sensor was tested in soils with volumetric humidity in the range from theta(v) = 0.05 m(3) m(-3) to theta(v) = 0.41 m(3) m(-3) and, with a very low heating energy pulse (3 J), showed a sensitivity, normalized by the total energy applied, Gamma = 211 x 10(-3) degrees C m(3) m(-3) J(-1). Compared with a button heat pulse probe sensor which has Gamma = 192 x 10(-3) degrees C m(3) m(-3) J(-1), the developed sensor shows a higher normalized sensitivity.
id UNSP_abec16f9690637786be2f7631d8e2c44
oai_identifier_str oai:repositorio.unesp.br:11449/185247
network_acronym_str UNSP
network_name_str Repositório Institucional da UNESP
repository_id_str 2946
spelling A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB TechnologyHeat pulse sensorslow-power circuitsmulti-probe sensorsprinted circuit board (PCB) technologysignal conditioning circuitsoil moisture sensorsHeat dissipation sensors operate based on the temperature dependence of the transient heat conduction within the soil, which is a function of the soil characteristics and its water content. After a heat pulse with controlled energy is applied to a heater, it is possible to show that the maximum temperature rise Delta T-M measured in the temperature sensing element can be related to the volumetric water content of the soil theta(v) [m(3) m(-3)]. The design and fabrication of a low-cost soil moisture multiprobe heat pulse sensor system using conventional printed circuit boards and surface-mount devices is presented. The proposed sensor is free of the needles' deflection problem present in conventional multiprobe sensors and is manufactured using conventional off-the-shelf electronic components. A precision low-power electronic signal conditioning circuit, using an instrumentation switched-capacitor building block, was developed and successfully used in the prototype. Due to an energy-efficient topology for the sensor and a low-power signal conditioning circuit, the average current consumption of the system (with one measurement per day) is only 3 mu A. To demonstrate the feasibility of the concept, a prototype of the sensor was tested in soils with volumetric humidity in the range from theta(v) = 0.05 m(3) m(-3) to theta(v) = 0.41 m(3) m(-3) and, with a very low heating energy pulse (3 J), showed a sensitivity, normalized by the total energy applied, Gamma = 211 x 10(-3) degrees C m(3) m(-3) J(-1). Compared with a button heat pulse probe sensor which has Gamma = 192 x 10(-3) degrees C m(3) m(-3) J(-1), the developed sensor shows a higher normalized sensitivity.Univ Estadual Londrina, Dept Elect Engn, BR-86057970 Londrina, BrazilSao Paulo State Univ Julio de Mesquita, Fac Sci & Engn, BR-17602496 Tupa, BrazilParana Fed Univ Technol, Dept Elect Engn, BR-8630000 Cornelio Procopio, BrazilUniv Estadual Campinas, Sch Elect & Comp Engn, Dept Semicond Instrumentat & Photon, BR-13083820 Campinas, SP, BrazilSao Paulo State Univ Julio de Mesquita, Fac Sci & Engn, BR-17602496 Tupa, BrazilIeee-inst Electrical Electronics Engineers IncUniversidade Estadual de Londrina (UEL)Universidade Estadual Paulista (Unesp)Parana Fed Univ TechnolUniversidade Estadual de Campinas (UNICAMP)Morais Franca, Maria Bernadete deMorais, Flavio J. O. [UNESP]Carvalhaes-Dias, PedroDuarte, Luis CaparrozSiqueira Dias, Jose A.2019-10-04T12:33:53Z2019-10-04T12:33:53Z2019-02-01info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/article606-613http://dx.doi.org/10.1109/TIM.2018.2843605Ieee Transactions On Instrumentation And Measurement. Piscataway: Ieee-inst Electrical Electronics Engineers Inc, v. 68, n. 2, p. 606-613, 2019.0018-9456http://hdl.handle.net/11449/18524710.1109/TIM.2018.2843605WOS:000454332000029Web of Sciencereponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPengIeee Transactions On Instrumentation And Measurementinfo:eu-repo/semantics/openAccess2024-06-10T14:48:59Zoai:repositorio.unesp.br:11449/185247Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462024-08-05T14:32:43.346179Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false
dc.title.none.fl_str_mv A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology
title A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology
spellingShingle A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology
Morais Franca, Maria Bernadete de
Heat pulse sensors
low-power circuits
multi-probe sensors
printed circuit board (PCB) technology
signal conditioning circuit
soil moisture sensors
title_short A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology
title_full A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology
title_fullStr A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology
title_full_unstemmed A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology
title_sort A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology
author Morais Franca, Maria Bernadete de
author_facet Morais Franca, Maria Bernadete de
Morais, Flavio J. O. [UNESP]
Carvalhaes-Dias, Pedro
Duarte, Luis Caparroz
Siqueira Dias, Jose A.
author_role author
author2 Morais, Flavio J. O. [UNESP]
Carvalhaes-Dias, Pedro
Duarte, Luis Caparroz
Siqueira Dias, Jose A.
author2_role author
author
author
author
dc.contributor.none.fl_str_mv Universidade Estadual de Londrina (UEL)
Universidade Estadual Paulista (Unesp)
Parana Fed Univ Technol
Universidade Estadual de Campinas (UNICAMP)
dc.contributor.author.fl_str_mv Morais Franca, Maria Bernadete de
Morais, Flavio J. O. [UNESP]
Carvalhaes-Dias, Pedro
Duarte, Luis Caparroz
Siqueira Dias, Jose A.
dc.subject.por.fl_str_mv Heat pulse sensors
low-power circuits
multi-probe sensors
printed circuit board (PCB) technology
signal conditioning circuit
soil moisture sensors
topic Heat pulse sensors
low-power circuits
multi-probe sensors
printed circuit board (PCB) technology
signal conditioning circuit
soil moisture sensors
description Heat dissipation sensors operate based on the temperature dependence of the transient heat conduction within the soil, which is a function of the soil characteristics and its water content. After a heat pulse with controlled energy is applied to a heater, it is possible to show that the maximum temperature rise Delta T-M measured in the temperature sensing element can be related to the volumetric water content of the soil theta(v) [m(3) m(-3)]. The design and fabrication of a low-cost soil moisture multiprobe heat pulse sensor system using conventional printed circuit boards and surface-mount devices is presented. The proposed sensor is free of the needles' deflection problem present in conventional multiprobe sensors and is manufactured using conventional off-the-shelf electronic components. A precision low-power electronic signal conditioning circuit, using an instrumentation switched-capacitor building block, was developed and successfully used in the prototype. Due to an energy-efficient topology for the sensor and a low-power signal conditioning circuit, the average current consumption of the system (with one measurement per day) is only 3 mu A. To demonstrate the feasibility of the concept, a prototype of the sensor was tested in soils with volumetric humidity in the range from theta(v) = 0.05 m(3) m(-3) to theta(v) = 0.41 m(3) m(-3) and, with a very low heating energy pulse (3 J), showed a sensitivity, normalized by the total energy applied, Gamma = 211 x 10(-3) degrees C m(3) m(-3) J(-1). Compared with a button heat pulse probe sensor which has Gamma = 192 x 10(-3) degrees C m(3) m(-3) J(-1), the developed sensor shows a higher normalized sensitivity.
publishDate 2019
dc.date.none.fl_str_mv 2019-10-04T12:33:53Z
2019-10-04T12:33:53Z
2019-02-01
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://dx.doi.org/10.1109/TIM.2018.2843605
Ieee Transactions On Instrumentation And Measurement. Piscataway: Ieee-inst Electrical Electronics Engineers Inc, v. 68, n. 2, p. 606-613, 2019.
0018-9456
http://hdl.handle.net/11449/185247
10.1109/TIM.2018.2843605
WOS:000454332000029
url http://dx.doi.org/10.1109/TIM.2018.2843605
http://hdl.handle.net/11449/185247
identifier_str_mv Ieee Transactions On Instrumentation And Measurement. Piscataway: Ieee-inst Electrical Electronics Engineers Inc, v. 68, n. 2, p. 606-613, 2019.
0018-9456
10.1109/TIM.2018.2843605
WOS:000454332000029
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv Ieee Transactions On Instrumentation And Measurement
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv 606-613
dc.publisher.none.fl_str_mv Ieee-inst Electrical Electronics Engineers Inc
publisher.none.fl_str_mv Ieee-inst Electrical Electronics Engineers Inc
dc.source.none.fl_str_mv Web of Science
reponame:Repositório Institucional da UNESP
instname:Universidade Estadual Paulista (UNESP)
instacron:UNESP
instname_str Universidade Estadual Paulista (UNESP)
instacron_str UNESP
institution UNESP
reponame_str Repositório Institucional da UNESP
collection Repositório Institucional da UNESP
repository.name.fl_str_mv Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)
repository.mail.fl_str_mv
_version_ 1808128376000479232