A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology
Autor(a) principal: | |
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Data de Publicação: | 2019 |
Outros Autores: | , , , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UNESP |
Texto Completo: | http://dx.doi.org/10.1109/TIM.2018.2843605 http://hdl.handle.net/11449/185247 |
Resumo: | Heat dissipation sensors operate based on the temperature dependence of the transient heat conduction within the soil, which is a function of the soil characteristics and its water content. After a heat pulse with controlled energy is applied to a heater, it is possible to show that the maximum temperature rise Delta T-M measured in the temperature sensing element can be related to the volumetric water content of the soil theta(v) [m(3) m(-3)]. The design and fabrication of a low-cost soil moisture multiprobe heat pulse sensor system using conventional printed circuit boards and surface-mount devices is presented. The proposed sensor is free of the needles' deflection problem present in conventional multiprobe sensors and is manufactured using conventional off-the-shelf electronic components. A precision low-power electronic signal conditioning circuit, using an instrumentation switched-capacitor building block, was developed and successfully used in the prototype. Due to an energy-efficient topology for the sensor and a low-power signal conditioning circuit, the average current consumption of the system (with one measurement per day) is only 3 mu A. To demonstrate the feasibility of the concept, a prototype of the sensor was tested in soils with volumetric humidity in the range from theta(v) = 0.05 m(3) m(-3) to theta(v) = 0.41 m(3) m(-3) and, with a very low heating energy pulse (3 J), showed a sensitivity, normalized by the total energy applied, Gamma = 211 x 10(-3) degrees C m(3) m(-3) J(-1). Compared with a button heat pulse probe sensor which has Gamma = 192 x 10(-3) degrees C m(3) m(-3) J(-1), the developed sensor shows a higher normalized sensitivity. |
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A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB TechnologyHeat pulse sensorslow-power circuitsmulti-probe sensorsprinted circuit board (PCB) technologysignal conditioning circuitsoil moisture sensorsHeat dissipation sensors operate based on the temperature dependence of the transient heat conduction within the soil, which is a function of the soil characteristics and its water content. After a heat pulse with controlled energy is applied to a heater, it is possible to show that the maximum temperature rise Delta T-M measured in the temperature sensing element can be related to the volumetric water content of the soil theta(v) [m(3) m(-3)]. The design and fabrication of a low-cost soil moisture multiprobe heat pulse sensor system using conventional printed circuit boards and surface-mount devices is presented. The proposed sensor is free of the needles' deflection problem present in conventional multiprobe sensors and is manufactured using conventional off-the-shelf electronic components. A precision low-power electronic signal conditioning circuit, using an instrumentation switched-capacitor building block, was developed and successfully used in the prototype. Due to an energy-efficient topology for the sensor and a low-power signal conditioning circuit, the average current consumption of the system (with one measurement per day) is only 3 mu A. To demonstrate the feasibility of the concept, a prototype of the sensor was tested in soils with volumetric humidity in the range from theta(v) = 0.05 m(3) m(-3) to theta(v) = 0.41 m(3) m(-3) and, with a very low heating energy pulse (3 J), showed a sensitivity, normalized by the total energy applied, Gamma = 211 x 10(-3) degrees C m(3) m(-3) J(-1). Compared with a button heat pulse probe sensor which has Gamma = 192 x 10(-3) degrees C m(3) m(-3) J(-1), the developed sensor shows a higher normalized sensitivity.Univ Estadual Londrina, Dept Elect Engn, BR-86057970 Londrina, BrazilSao Paulo State Univ Julio de Mesquita, Fac Sci & Engn, BR-17602496 Tupa, BrazilParana Fed Univ Technol, Dept Elect Engn, BR-8630000 Cornelio Procopio, BrazilUniv Estadual Campinas, Sch Elect & Comp Engn, Dept Semicond Instrumentat & Photon, BR-13083820 Campinas, SP, BrazilSao Paulo State Univ Julio de Mesquita, Fac Sci & Engn, BR-17602496 Tupa, BrazilIeee-inst Electrical Electronics Engineers IncUniversidade Estadual de Londrina (UEL)Universidade Estadual Paulista (Unesp)Parana Fed Univ TechnolUniversidade Estadual de Campinas (UNICAMP)Morais Franca, Maria Bernadete deMorais, Flavio J. O. [UNESP]Carvalhaes-Dias, PedroDuarte, Luis CaparrozSiqueira Dias, Jose A.2019-10-04T12:33:53Z2019-10-04T12:33:53Z2019-02-01info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/article606-613http://dx.doi.org/10.1109/TIM.2018.2843605Ieee Transactions On Instrumentation And Measurement. Piscataway: Ieee-inst Electrical Electronics Engineers Inc, v. 68, n. 2, p. 606-613, 2019.0018-9456http://hdl.handle.net/11449/18524710.1109/TIM.2018.2843605WOS:000454332000029Web of Sciencereponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPengIeee Transactions On Instrumentation And Measurementinfo:eu-repo/semantics/openAccess2024-06-10T14:48:59Zoai:repositorio.unesp.br:11449/185247Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462024-08-05T14:32:43.346179Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false |
dc.title.none.fl_str_mv |
A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology |
title |
A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology |
spellingShingle |
A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology Morais Franca, Maria Bernadete de Heat pulse sensors low-power circuits multi-probe sensors printed circuit board (PCB) technology signal conditioning circuit soil moisture sensors |
title_short |
A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology |
title_full |
A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology |
title_fullStr |
A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology |
title_full_unstemmed |
A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology |
title_sort |
A Multiprobe Heat Pulse Sensor for Soil Moisture Measurement Based on PCB Technology |
author |
Morais Franca, Maria Bernadete de |
author_facet |
Morais Franca, Maria Bernadete de Morais, Flavio J. O. [UNESP] Carvalhaes-Dias, Pedro Duarte, Luis Caparroz Siqueira Dias, Jose A. |
author_role |
author |
author2 |
Morais, Flavio J. O. [UNESP] Carvalhaes-Dias, Pedro Duarte, Luis Caparroz Siqueira Dias, Jose A. |
author2_role |
author author author author |
dc.contributor.none.fl_str_mv |
Universidade Estadual de Londrina (UEL) Universidade Estadual Paulista (Unesp) Parana Fed Univ Technol Universidade Estadual de Campinas (UNICAMP) |
dc.contributor.author.fl_str_mv |
Morais Franca, Maria Bernadete de Morais, Flavio J. O. [UNESP] Carvalhaes-Dias, Pedro Duarte, Luis Caparroz Siqueira Dias, Jose A. |
dc.subject.por.fl_str_mv |
Heat pulse sensors low-power circuits multi-probe sensors printed circuit board (PCB) technology signal conditioning circuit soil moisture sensors |
topic |
Heat pulse sensors low-power circuits multi-probe sensors printed circuit board (PCB) technology signal conditioning circuit soil moisture sensors |
description |
Heat dissipation sensors operate based on the temperature dependence of the transient heat conduction within the soil, which is a function of the soil characteristics and its water content. After a heat pulse with controlled energy is applied to a heater, it is possible to show that the maximum temperature rise Delta T-M measured in the temperature sensing element can be related to the volumetric water content of the soil theta(v) [m(3) m(-3)]. The design and fabrication of a low-cost soil moisture multiprobe heat pulse sensor system using conventional printed circuit boards and surface-mount devices is presented. The proposed sensor is free of the needles' deflection problem present in conventional multiprobe sensors and is manufactured using conventional off-the-shelf electronic components. A precision low-power electronic signal conditioning circuit, using an instrumentation switched-capacitor building block, was developed and successfully used in the prototype. Due to an energy-efficient topology for the sensor and a low-power signal conditioning circuit, the average current consumption of the system (with one measurement per day) is only 3 mu A. To demonstrate the feasibility of the concept, a prototype of the sensor was tested in soils with volumetric humidity in the range from theta(v) = 0.05 m(3) m(-3) to theta(v) = 0.41 m(3) m(-3) and, with a very low heating energy pulse (3 J), showed a sensitivity, normalized by the total energy applied, Gamma = 211 x 10(-3) degrees C m(3) m(-3) J(-1). Compared with a button heat pulse probe sensor which has Gamma = 192 x 10(-3) degrees C m(3) m(-3) J(-1), the developed sensor shows a higher normalized sensitivity. |
publishDate |
2019 |
dc.date.none.fl_str_mv |
2019-10-04T12:33:53Z 2019-10-04T12:33:53Z 2019-02-01 |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://dx.doi.org/10.1109/TIM.2018.2843605 Ieee Transactions On Instrumentation And Measurement. Piscataway: Ieee-inst Electrical Electronics Engineers Inc, v. 68, n. 2, p. 606-613, 2019. 0018-9456 http://hdl.handle.net/11449/185247 10.1109/TIM.2018.2843605 WOS:000454332000029 |
url |
http://dx.doi.org/10.1109/TIM.2018.2843605 http://hdl.handle.net/11449/185247 |
identifier_str_mv |
Ieee Transactions On Instrumentation And Measurement. Piscataway: Ieee-inst Electrical Electronics Engineers Inc, v. 68, n. 2, p. 606-613, 2019. 0018-9456 10.1109/TIM.2018.2843605 WOS:000454332000029 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
Ieee Transactions On Instrumentation And Measurement |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
606-613 |
dc.publisher.none.fl_str_mv |
Ieee-inst Electrical Electronics Engineers Inc |
publisher.none.fl_str_mv |
Ieee-inst Electrical Electronics Engineers Inc |
dc.source.none.fl_str_mv |
Web of Science reponame:Repositório Institucional da UNESP instname:Universidade Estadual Paulista (UNESP) instacron:UNESP |
instname_str |
Universidade Estadual Paulista (UNESP) |
instacron_str |
UNESP |
institution |
UNESP |
reponame_str |
Repositório Institucional da UNESP |
collection |
Repositório Institucional da UNESP |
repository.name.fl_str_mv |
Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP) |
repository.mail.fl_str_mv |
|
_version_ |
1808128376000479232 |