Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance

Detalhes bibliográficos
Autor(a) principal: Ferreira, Fabio Isaac [UNESP]
Data de Publicação: 2022
Outros Autores: De Aguiar, Paulo Roberto [UNESP], Silva, Rosemar Batista Da, Jackson, Mark James, Baptista, Fabricio Guimaraes [UNESP], Bianchi, Eduardo Carlos [UNESP]
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Repositório Institucional da UNESP
Texto Completo: http://dx.doi.org/10.1109/JSEN.2022.3172230
http://hdl.handle.net/11449/241790
Resumo: One of the most promising monitoring techniques is based on electromechanical impedance (EMI) transducers, which are low-cost components and allow easy implementation. EMI signal features showed good results for some applications in previous studies, but it is still unexplored for machining processes, which is essential for metal-cutting industries. This paper presents a new approach to verify the applicability of EMI measurements to monitor surface quality after the plunge cylindrical grinding of non-flat parts, which require low roughness and tight dimensional tolerances. Tests were carried out in a camshaft grinder and two low-cost piezoelectric diaphragms were attached to each workpiece to guarantee redundancy. Roughness R a was also monitored to check existence of correlation with the EMI signals and relevant discussions regarding monitoring by EMI are presented. Results showed a great correlation between EMI measurement and surface roughness: 0.94 and 0.80 for both diaphragms. Since these diaphragms cost less than 1 US dollar and good correlation was verified, this monitoring system is promising to replace the traditional ones.
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spelling Monitoring of Cylindrical Plunge Grinding Process by Electromechanical ImpedanceElectromechanical ImpedancePiezoelectric transducersPlunge cylindrical grindingStructural health monitoringSurface roughnessOne of the most promising monitoring techniques is based on electromechanical impedance (EMI) transducers, which are low-cost components and allow easy implementation. EMI signal features showed good results for some applications in previous studies, but it is still unexplored for machining processes, which is essential for metal-cutting industries. This paper presents a new approach to verify the applicability of EMI measurements to monitor surface quality after the plunge cylindrical grinding of non-flat parts, which require low roughness and tight dimensional tolerances. Tests were carried out in a camshaft grinder and two low-cost piezoelectric diaphragms were attached to each workpiece to guarantee redundancy. Roughness R a was also monitored to check existence of correlation with the EMI signals and relevant discussions regarding monitoring by EMI are presented. Results showed a great correlation between EMI measurement and surface roughness: 0.94 and 0.80 for both diaphragms. Since these diaphragms cost less than 1 US dollar and good correlation was verified, this monitoring system is promising to replace the traditional ones.São Paulo State University (UNESP) School of Engineering Electrical Engineering Department The Mechanical Engineering DepartmentFederal University of Uberlândia Santa Mônica Campus School of Mechanical EngineeringKansas State University School of Integrated StudiesSão Paulo State University (UNESP) School of Engineering Electrical Engineering Department The Mechanical Engineering DepartmentUniversidade Estadual Paulista (UNESP)Universidade Federal de Uberlândia (UFU)School of Integrated StudiesFerreira, Fabio Isaac [UNESP]De Aguiar, Paulo Roberto [UNESP]Silva, Rosemar Batista DaJackson, Mark JamesBaptista, Fabricio Guimaraes [UNESP]Bianchi, Eduardo Carlos [UNESP]2023-03-02T00:08:59Z2023-03-02T00:08:59Z2022-06-15info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/article12314-12322http://dx.doi.org/10.1109/JSEN.2022.3172230IEEE Sensors Journal, v. 22, n. 12, p. 12314-12322, 2022.1558-17481530-437Xhttp://hdl.handle.net/11449/24179010.1109/JSEN.2022.31722302-s2.0-85129351648Scopusreponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPengIEEE Sensors Journalinfo:eu-repo/semantics/openAccess2024-06-28T13:54:58Zoai:repositorio.unesp.br:11449/241790Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462024-08-05T19:26:04.758586Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false
dc.title.none.fl_str_mv Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance
title Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance
spellingShingle Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance
Ferreira, Fabio Isaac [UNESP]
Electromechanical Impedance
Piezoelectric transducers
Plunge cylindrical grinding
Structural health monitoring
Surface roughness
title_short Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance
title_full Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance
title_fullStr Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance
title_full_unstemmed Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance
title_sort Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance
author Ferreira, Fabio Isaac [UNESP]
author_facet Ferreira, Fabio Isaac [UNESP]
De Aguiar, Paulo Roberto [UNESP]
Silva, Rosemar Batista Da
Jackson, Mark James
Baptista, Fabricio Guimaraes [UNESP]
Bianchi, Eduardo Carlos [UNESP]
author_role author
author2 De Aguiar, Paulo Roberto [UNESP]
Silva, Rosemar Batista Da
Jackson, Mark James
Baptista, Fabricio Guimaraes [UNESP]
Bianchi, Eduardo Carlos [UNESP]
author2_role author
author
author
author
author
dc.contributor.none.fl_str_mv Universidade Estadual Paulista (UNESP)
Universidade Federal de Uberlândia (UFU)
School of Integrated Studies
dc.contributor.author.fl_str_mv Ferreira, Fabio Isaac [UNESP]
De Aguiar, Paulo Roberto [UNESP]
Silva, Rosemar Batista Da
Jackson, Mark James
Baptista, Fabricio Guimaraes [UNESP]
Bianchi, Eduardo Carlos [UNESP]
dc.subject.por.fl_str_mv Electromechanical Impedance
Piezoelectric transducers
Plunge cylindrical grinding
Structural health monitoring
Surface roughness
topic Electromechanical Impedance
Piezoelectric transducers
Plunge cylindrical grinding
Structural health monitoring
Surface roughness
description One of the most promising monitoring techniques is based on electromechanical impedance (EMI) transducers, which are low-cost components and allow easy implementation. EMI signal features showed good results for some applications in previous studies, but it is still unexplored for machining processes, which is essential for metal-cutting industries. This paper presents a new approach to verify the applicability of EMI measurements to monitor surface quality after the plunge cylindrical grinding of non-flat parts, which require low roughness and tight dimensional tolerances. Tests were carried out in a camshaft grinder and two low-cost piezoelectric diaphragms were attached to each workpiece to guarantee redundancy. Roughness R a was also monitored to check existence of correlation with the EMI signals and relevant discussions regarding monitoring by EMI are presented. Results showed a great correlation between EMI measurement and surface roughness: 0.94 and 0.80 for both diaphragms. Since these diaphragms cost less than 1 US dollar and good correlation was verified, this monitoring system is promising to replace the traditional ones.
publishDate 2022
dc.date.none.fl_str_mv 2022-06-15
2023-03-02T00:08:59Z
2023-03-02T00:08:59Z
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://dx.doi.org/10.1109/JSEN.2022.3172230
IEEE Sensors Journal, v. 22, n. 12, p. 12314-12322, 2022.
1558-1748
1530-437X
http://hdl.handle.net/11449/241790
10.1109/JSEN.2022.3172230
2-s2.0-85129351648
url http://dx.doi.org/10.1109/JSEN.2022.3172230
http://hdl.handle.net/11449/241790
identifier_str_mv IEEE Sensors Journal, v. 22, n. 12, p. 12314-12322, 2022.
1558-1748
1530-437X
10.1109/JSEN.2022.3172230
2-s2.0-85129351648
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv IEEE Sensors Journal
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv 12314-12322
dc.source.none.fl_str_mv Scopus
reponame:Repositório Institucional da UNESP
instname:Universidade Estadual Paulista (UNESP)
instacron:UNESP
instname_str Universidade Estadual Paulista (UNESP)
instacron_str UNESP
institution UNESP
reponame_str Repositório Institucional da UNESP
collection Repositório Institucional da UNESP
repository.name.fl_str_mv Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)
repository.mail.fl_str_mv
_version_ 1808129067922227200