Atmospheric Pressure Plasma Chemical Vapor Deposition of Carvacrol Thin Films on Stainless Steel to Reduce the Formation ofE. ColiandS. AureusBiofilms

• Autor(a) principal: Getnet, Tsegaye Gashaw [UNESP]
• Data de Publicação: 2020
• Outros Autores: Silva, Gabriela F. da, Duarte, Iolanda S., Kayama, Milton E. [UNESP], Rangel, Elidiane C. [UNESP], Cruz, Nilson C. [UNESP]
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Repositório Institucional da UNESP
• Texto Completo: http://dx.doi.org/10.3390/ma13143166; http://hdl.handle.net/11449/197882
• topic: dielectric barrier discharge; carvacrol plasma polymerization; biofilm inhibition

In this paper, we have investigated the deposition of thin films from natural carvacrol extract using dielectric barrier discharge (DBD) plasma polymerization, aiming at the inhibition of bacteria adhesion and proliferation. The films deposited on stainless steel samples have been characterized by scanning electron microscopy, infrared reflectance-absorbance spectroscopy, profilometry, and contact angle measurements. Films with thicknesses ranging from 1.5 mu m to 3.5 mu m presented a chemical structure similar to that of carvacrol. While the formation of biofilm was observed on untreated samples, the coating completely inhibited the adhesion ofE. coliand reduced the adhesion ofS. aureusbiofilm in more than 90%.