Integrated 5.7 GHz chip-size antenna for wireless sensor networks

Detalhes bibliográficos
Autor(a) principal: Mendes, P. M.
Data de Publicação: 2003
Outros Autores: Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Idioma: eng
Título da fonte: Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
Texto Completo: http://hdl.handle.net/1822/1567
Resumo: We report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8x8 mm2 patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18% efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5x4x1 mm3 and has a projected efficiency of 60%.
id RCAP_968241210c404754f647e7e14453a849
oai_identifier_str oai:repositorium.sdum.uminho.pt:1822/1567
network_acronym_str RCAP
network_name_str Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
repository_id_str 7160
spelling Integrated 5.7 GHz chip-size antenna for wireless sensor networksIntegrated antennaWireless sensor networksWafer level packagingAntenna measurementsBandwidthChip scale packagingFabricationFrequency measurementGain measurementPatch antennasWafer bondingWafer scale integrationWe report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8x8 mm2 patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18% efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5x4x1 mm3 and has a projected efficiency of 60%.Fundação para a Ciência e Tecnologia (FCT), project (SFRH/BD/4717/2001 and POCTI/ESE/38468/2001).IEEEUniversidade do MinhoMendes, P. M.Polyakov, A.Bartek, M.Burghartz, J. N.Correia, J. H.2003-062003-06-01T00:00:00Zconference paperinfo:eu-repo/semantics/publishedVersionapplication/pdfhttp://hdl.handle.net/1822/1567engTRANSDUCERS ´03. IEEE INTERNATIONAL CONFERENCE ON SOLID STATE SENSORS, ACTUATORS AND MICROSYSTEMS, 12, Boston, 2003 - "Digest of technical papers". Boston : IEEE, 2003. ISBN 0-7803-7731-1. vol. 1. p. 49-52.0-7803-7731-110.1109/SENSOR.2003.1215250info:eu-repo/semantics/openAccessreponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãoinstacron:RCAAP2024-05-11T05:25:02Zoai:repositorium.sdum.uminho.pt:1822/1567Portal AgregadorONGhttps://www.rcaap.pt/oai/openairemluisa.alvim@gmail.comopendoar:71602024-05-11T05:25:02Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãofalse
dc.title.none.fl_str_mv Integrated 5.7 GHz chip-size antenna for wireless sensor networks
title Integrated 5.7 GHz chip-size antenna for wireless sensor networks
spellingShingle Integrated 5.7 GHz chip-size antenna for wireless sensor networks
Mendes, P. M.
Integrated antenna
Wireless sensor networks
Wafer level packaging
Antenna measurements
Bandwidth
Chip scale packaging
Fabrication
Frequency measurement
Gain measurement
Patch antennas
Wafer bonding
Wafer scale integration
title_short Integrated 5.7 GHz chip-size antenna for wireless sensor networks
title_full Integrated 5.7 GHz chip-size antenna for wireless sensor networks
title_fullStr Integrated 5.7 GHz chip-size antenna for wireless sensor networks
title_full_unstemmed Integrated 5.7 GHz chip-size antenna for wireless sensor networks
title_sort Integrated 5.7 GHz chip-size antenna for wireless sensor networks
author Mendes, P. M.
author_facet Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
author_role author
author2 Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
author2_role author
author
author
author
dc.contributor.none.fl_str_mv Universidade do Minho
dc.contributor.author.fl_str_mv Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
dc.subject.por.fl_str_mv Integrated antenna
Wireless sensor networks
Wafer level packaging
Antenna measurements
Bandwidth
Chip scale packaging
Fabrication
Frequency measurement
Gain measurement
Patch antennas
Wafer bonding
Wafer scale integration
topic Integrated antenna
Wireless sensor networks
Wafer level packaging
Antenna measurements
Bandwidth
Chip scale packaging
Fabrication
Frequency measurement
Gain measurement
Patch antennas
Wafer bonding
Wafer scale integration
description We report on design, fabrication and characterization of chip-size antennas for operation at 5.7 GHz and use in wireless sensor networks. Application of wafer-level chipscale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna types (patch and folded patch) allows on-chip integration and is the main novelty of our work. A short-range wireless link between two systems both equipped with an 8x8 mm2 patch antenna (measured characteristics: 5.705 GHz central frequency, 90 MHz bandwidth @ -10 dB, 0.3 dB gain, 18% efficiency) realized on a high-resistivity silicon (HRS) substrate is demonstrated. A folded-patch antenna built on two stacked glass substrates allows size reduction down to 4.5x4x1 mm3 and has a projected efficiency of 60%.
publishDate 2003
dc.date.none.fl_str_mv 2003-06
2003-06-01T00:00:00Z
dc.type.driver.fl_str_mv conference paper
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://hdl.handle.net/1822/1567
url http://hdl.handle.net/1822/1567
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv TRANSDUCERS ´03. IEEE INTERNATIONAL CONFERENCE ON SOLID STATE SENSORS, ACTUATORS AND MICROSYSTEMS, 12, Boston, 2003 - "Digest of technical papers". Boston : IEEE, 2003. ISBN 0-7803-7731-1. vol. 1. p. 49-52.
0-7803-7731-1
10.1109/SENSOR.2003.1215250
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.format.none.fl_str_mv application/pdf
dc.publisher.none.fl_str_mv IEEE
publisher.none.fl_str_mv IEEE
dc.source.none.fl_str_mv reponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
instacron:RCAAP
instname_str Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
instacron_str RCAAP
institution RCAAP
reponame_str Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
collection Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)
repository.name.fl_str_mv Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informação
repository.mail.fl_str_mv mluisa.alvim@gmail.com
_version_ 1817544613826658304

Registros relacionados