Fabrication of Flexible Hybrid Circuits in Parylene
Autor(a) principal: | |
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Data de Publicação: | 2022 |
Tipo de documento: | Dissertação |
Idioma: | eng |
Título da fonte: | Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) |
Texto Completo: | http://hdl.handle.net/10362/152017 |
Resumo: | In recent years, with the increasing research interest in personalized medicine, new and disruptive technologies such as the Internet of Things (IoT) and flexible wearable electronics have emerged and have become trending topics in the scientific community. Despite consistent progress in the area of fully flexible electronics, these continue to reveal some restrictions, which can be overcome by traditional silicon integrated circuits (ICs). The combination between these technologies generated the new concept of flexible hybrid electronics (FHE) igniting a new generation of wearable health monitoring systems. This thesis reports a new way to the use parylene C as substrate, dielectric and encap- sulation layers to accommodate silicon ICs, surface mounted devices (SMDs) and thin metal layers, in order to create flexible and conformable double layered hybrid sensing membranes for body temperature monitoring, one of the most relevant physiological pa- rameters upon a medical diagnosis, since it’s among the main indicators for inflammation and infection. To achieve the thin metal and parylene C layers, thin-film microfabrica- tion techniques were employed and corroborated by superficial, electrical and structural characterization techniques. In addition the establishment of an electrical connection by the integration of silicon ICs and SMDs onto the thin metal layer was successfully tested using a low-temperature solder paste and a reflow oven, which reproduced a previously inputted time-temperature profile. Furthermore, this thesis analyses the repercussions of this integration procedure on the peel off process. Throughout this work, commercial body temperature measuring circuits were used as inspiration for the temperature sensing circuits developed. The interface between the produced membranes and their respective microcontrollers was also tested, although no temperature measurements were obtained due to parylene’s performance as a dielectric. The successful production of a fully functional flexible and conformable double layered hybrid sensing membrane could propel the adaptation of other rigid health monitoring electronics to FHE membranes, further engraving this technology into people’s daily lives. |
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Fabrication of Flexible Hybrid Circuits in ParyleneFlexible Hybrid ElectronicsDouble LayerParylene CSilicon Integrated CircuitTemperature SensingDomínio/Área Científica::Engenharia e Tecnologia::Outras Engenharias e TecnologiasIn recent years, with the increasing research interest in personalized medicine, new and disruptive technologies such as the Internet of Things (IoT) and flexible wearable electronics have emerged and have become trending topics in the scientific community. Despite consistent progress in the area of fully flexible electronics, these continue to reveal some restrictions, which can be overcome by traditional silicon integrated circuits (ICs). The combination between these technologies generated the new concept of flexible hybrid electronics (FHE) igniting a new generation of wearable health monitoring systems. This thesis reports a new way to the use parylene C as substrate, dielectric and encap- sulation layers to accommodate silicon ICs, surface mounted devices (SMDs) and thin metal layers, in order to create flexible and conformable double layered hybrid sensing membranes for body temperature monitoring, one of the most relevant physiological pa- rameters upon a medical diagnosis, since it’s among the main indicators for inflammation and infection. To achieve the thin metal and parylene C layers, thin-film microfabrica- tion techniques were employed and corroborated by superficial, electrical and structural characterization techniques. In addition the establishment of an electrical connection by the integration of silicon ICs and SMDs onto the thin metal layer was successfully tested using a low-temperature solder paste and a reflow oven, which reproduced a previously inputted time-temperature profile. Furthermore, this thesis analyses the repercussions of this integration procedure on the peel off process. Throughout this work, commercial body temperature measuring circuits were used as inspiration for the temperature sensing circuits developed. The interface between the produced membranes and their respective microcontrollers was also tested, although no temperature measurements were obtained due to parylene’s performance as a dielectric. The successful production of a fully functional flexible and conformable double layered hybrid sensing membrane could propel the adaptation of other rigid health monitoring electronics to FHE membranes, further engraving this technology into people’s daily lives.Com o crescente interesse na pesquisa em medicina personalizada, novas tecnologias como a Internet of Things (IoT) e a eletrónica flexível, surgiram e tornaram-se tópicos de tendência na comunidade científica. Apesar dos progressos na área da eletrónica totalmente flexível, continuam a existir algumas restrições, que podem ser superadas pelos circuitos integrados de silício (ICs) tradicionais. A junção entre estas tecnologias gerou um novo conceito de eletrónica híbrida flexível (FHE) dando início a uma nova geração de sistemas de monitorização de saúde. Esta tese aborda uma forma inovadora de usar parileno C como substrato, dielétrico e camada de encapsulamento para acomodar ICs de silício, surface mounted devices (SMDs) e camadas metálicas finas, a fim de criar circuitos em membranas híbridas de dupla camada flexíveis e conformáveis para monitorização da temperatura corporal, um dos parâmetros fisiológicos com maior relevância aquando do diagnóstico, uma vez que é um dos principais indicadores de infeções e inflamações. Para obter as camadas finas de metal e parileno C, foram empregues técnicas de microfabricação de filmes finos, corroboradas por caracterizações superficiais, elétricas e estruturais. Utilizando uma pasta de solda de baixa temperatura e um forno de refluxo, reproduzindo um perfil de tempo-temperatura, foi desenvolvido um protocolo para a conexão e integração de ICs na fina camada de metal. São ainda apresentados resultados relativos às implicações deste processo no método do peel off. Os circuitos desenvolvidos durante esta tese tiveram por base circuitos comerciais que medem a temperamtura corporal. Apesar da interface entre as membranas produzidas e os seus respetivos microcontroladores ter sido testada, não foi possível medir a temperatura com os circuitos desenvolvidos devido à performance do parileno como dielétrico. A produção bem-sucedida de uma membrana híbrida de dupla camada, flexível e conformável, totalmente funcional pode impulsionar a adaptação de outros equipamentos rígidos de monitorização de saúde para membranas híbridas flexíveis, inserindo ainda mais esta tecnologia na vida quotidiana.Sarmento, JoanaNeto, JoanaRUNRodrigues, Pedro Carvalho2023-04-21T18:21:25Z2022-112022-11-01T00:00:00Zinfo:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/masterThesisapplication/pdfhttp://hdl.handle.net/10362/152017enginfo:eu-repo/semantics/openAccessreponame:Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos)instname:Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãoinstacron:RCAAP2024-03-11T05:34:26Zoai:run.unl.pt:10362/152017Portal AgregadorONGhttps://www.rcaap.pt/oai/openaireopendoar:71602024-03-20T03:54:46.991209Repositório Científico de Acesso Aberto de Portugal (Repositórios Cientìficos) - Agência para a Sociedade do Conhecimento (UMIC) - FCT - Sociedade da Informaçãofalse |
dc.title.none.fl_str_mv |
Fabrication of Flexible Hybrid Circuits in Parylene |
title |
Fabrication of Flexible Hybrid Circuits in Parylene |
spellingShingle |
Fabrication of Flexible Hybrid Circuits in Parylene Rodrigues, Pedro Carvalho Flexible Hybrid Electronics Double Layer Parylene C Silicon Integrated Circuit Temperature Sensing Domínio/Área Científica::Engenharia e Tecnologia::Outras Engenharias e Tecnologias |
title_short |
Fabrication of Flexible Hybrid Circuits in Parylene |
title_full |
Fabrication of Flexible Hybrid Circuits in Parylene |
title_fullStr |
Fabrication of Flexible Hybrid Circuits in Parylene |
title_full_unstemmed |
Fabrication of Flexible Hybrid Circuits in Parylene |
title_sort |
Fabrication of Flexible Hybrid Circuits in Parylene |
author |
Rodrigues, Pedro Carvalho |
author_facet |
Rodrigues, Pedro Carvalho |
author_role |
author |
dc.contributor.none.fl_str_mv |
Sarmento, Joana Neto, Joana RUN |
dc.contributor.author.fl_str_mv |
Rodrigues, Pedro Carvalho |
dc.subject.por.fl_str_mv |
Flexible Hybrid Electronics Double Layer Parylene C Silicon Integrated Circuit Temperature Sensing Domínio/Área Científica::Engenharia e Tecnologia::Outras Engenharias e Tecnologias |
topic |
Flexible Hybrid Electronics Double Layer Parylene C Silicon Integrated Circuit Temperature Sensing Domínio/Área Científica::Engenharia e Tecnologia::Outras Engenharias e Tecnologias |
description |
In recent years, with the increasing research interest in personalized medicine, new and disruptive technologies such as the Internet of Things (IoT) and flexible wearable electronics have emerged and have become trending topics in the scientific community. Despite consistent progress in the area of fully flexible electronics, these continue to reveal some restrictions, which can be overcome by traditional silicon integrated circuits (ICs). The combination between these technologies generated the new concept of flexible hybrid electronics (FHE) igniting a new generation of wearable health monitoring systems. This thesis reports a new way to the use parylene C as substrate, dielectric and encap- sulation layers to accommodate silicon ICs, surface mounted devices (SMDs) and thin metal layers, in order to create flexible and conformable double layered hybrid sensing membranes for body temperature monitoring, one of the most relevant physiological pa- rameters upon a medical diagnosis, since it’s among the main indicators for inflammation and infection. To achieve the thin metal and parylene C layers, thin-film microfabrica- tion techniques were employed and corroborated by superficial, electrical and structural characterization techniques. In addition the establishment of an electrical connection by the integration of silicon ICs and SMDs onto the thin metal layer was successfully tested using a low-temperature solder paste and a reflow oven, which reproduced a previously inputted time-temperature profile. Furthermore, this thesis analyses the repercussions of this integration procedure on the peel off process. Throughout this work, commercial body temperature measuring circuits were used as inspiration for the temperature sensing circuits developed. The interface between the produced membranes and their respective microcontrollers was also tested, although no temperature measurements were obtained due to parylene’s performance as a dielectric. The successful production of a fully functional flexible and conformable double layered hybrid sensing membrane could propel the adaptation of other rigid health monitoring electronics to FHE membranes, further engraving this technology into people’s daily lives. |
publishDate |
2022 |
dc.date.none.fl_str_mv |
2022-11 2022-11-01T00:00:00Z 2023-04-21T18:21:25Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/masterThesis |
format |
masterThesis |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
http://hdl.handle.net/10362/152017 |
url |
http://hdl.handle.net/10362/152017 |
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eng |
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eng |
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info:eu-repo/semantics/openAccess |
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openAccess |
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