Rooting of cuttings of vanilla plant (Orchidaceae)

• Autor(a) principal: Silva, Maria das Dôres David
• Data de Publicação: 2009
• Outros Autores: Pasqual, Moacir, Silva, Flávio Pereira, Dias, José Maria Moreira, Araujo, Aparecida Gomes de
• Tipo de documento: Artigo
• Idioma: por
• Título da fonte: Semina. Ciências Agrárias (Online)
• Texto Completo: https://ojs.uel.br/revistas/uel/index.php/semagrarias/article/view/2632
• topic: Vanilla planifolia; Propagation; Cutting; Substrate; Nutritious solution.; Vanilla planifolia; Propagação; Estaquia; Substrato; Solução nutritiva.

The vanilla plant (Vanilla planifolia) could have a higher commercial production but there are problems in the efficiency of propagation. The present work was conducted with the aim of studying the effect of different substrates, in the adventitious rooting of cuttings taken at five heights in the plant stem. The cuttings were 20cm long and had two buds and one leaf and were planted in: 1) Liquid medium formed by Clark’s nutrient added of 2.5mg L-1 of IBA placed in plastic foam box with a capacity of 1.5L lined inside with transparent plastic bag and lidded with proper lid. 2) Solid substrate formed by the mixture of sand, carbonized rice husk, soil and cured cow manure in equal proportions of volume, they being placed in rigid polypropylene with a capacity of 0.28L. 3) Pre-rooting of the cuttings in liquid medium (20 days before planting), and later transferred into seedling tubes containing solid substrate. The cuttings planted in the solid substrate were maintained under intermittent mist condition controlled by a timer. After 90 days, the percentage of rooting was of 98-100%, regardless of the treatment. Larger and more vigorous sproutings were obtained from cuttings planted directly into solid substrate. Adventitious rooting of cuttings and formation of new vanilla cuttings occurred, when the cuttings were obtained from position P2 (ranging between 20 to 40cm in stem height) and planted in solid substrate in greenhouse with intermittent misting system.